KR100831988B1 - Spin head and method for holding / unholding wafer using the same - Google Patents

Abstract

The spin head includes a plate positioned at the bottom of the substrate during the process, first and second holding pins disposed along the edge of the plate on the top of the plate and preventing the substrate from being separated from the top of the plate, And a driving unit driven by magnetic force to hold / unhold the substrate by alternately contacting / non-contacting the first and second holding pins with the side of the substrate.

Plate, Holding Pin, Inner Magnetic Body, Outer Magnetic Body

Description

Spin head and method for holding / unholding wafer using the spin head

1 is a perspective view schematically showing a spin head according to the present invention.

2 is a perspective view showing a first holding pin according to the present invention.

3A and 3B illustrate a method of holding / unholding a wafer by using an inner driving unit and an outer driving unit according to a first embodiment of the present invention.

FIG. 4 is a diagram illustrating an arrangement relationship between first and second magnetic bodies, inner magnetic bodies, and outer magnetic bodies according to the first embodiment of the present invention.

5A and 5B illustrate a state in which a wafer is held / unheld using holding pins according to the present invention.

6A and 6B illustrate a method of holding / unholding a wafer using an inner driving unit and an outer driving unit according to a second embodiment of the present invention.

FIG. 7 is a diagram illustrating an arrangement relationship between first and second magnetic bodies, an inner magnetic body, and an outer magnetic body according to a second embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: spin head 100: plate

120: first holding pin 130: first rotating shaft

140: second holding pin 150: second rotating shaft

160: first magnetic material 180: second magnetic material

200: inner drive unit 300: outer drive unit

The present invention relates to a method for holding / unholding a wafer and a spin head using the same, and more particularly, to a method for holding / unholding a wafer capable of minimizing contact with the wafer during a process and a spin head using the same. will be.

The semiconductor manufacturing process forms a desired pattern on a substrate such as a semiconductor substrate, a glass substrate, or a liquid crystal panel through various processes. At present, in the etching process and the cleaning process, a process of removing residues or thin films on the wafer by spinning the wafer is performed. At this time, a spinning operation is performed while supplying deionized water or etching liquid or cleaning liquid while rotating a substrate such as a wafer to several thousand RPM. Of course, the process performed while spinning the substrate is used in various kinds of semiconductor manufacturing processes such as photoresist process as well as the cleaning process. U.S. by Mackawa et al. Pat. NO. 5,860,181 discloses various basic technical matters related to the spin head for spinning the wafer.

In general, the spin head is mainly used to fix the back side of the wafer by vacuum adsorption and to mechanically fix the edge of the wafer from the side of the wafer using a cylinder or a motor.

In the method of mechanically fixing the side of the wafer from the side of the wafer by driving a cylinder or a motor, once the holder holds the wafer, it is supported while continuously contacting the same part at the same position until the end of the process. At this time, a part of the chemical liquid remains on and near the contact surface between the holder and the wafer and remains even after the process. The remaining chemical liquid remains hardened or left in the form of dregs and becomes a source of contamination that contaminates the wafer or contaminates the peripheral device during the next process.

It is an object of the present invention to provide a method for holding / unholding a wafer capable of removing chemical liquid remaining on a contact surface of a wafer during a process and a spin head using the same.

Another object of the present invention is to provide a method for holding / unholding a wafer capable of uniformly treating the entire surface of the wafer, and a spin head using the same.

According to the present invention, the spin head is disposed in the lower portion of the substrate during the process, the upper portion of the plate is disposed along the edge of the plate, the first and preventing the substrate from being separated from the upper portion of the plate and And second driving pins and a driving unit which is driven by magnetic force to hold / unhold the substrate by alternately contacting / non-contacting the first and second holding pins with the sides of the substrate.

The driving unit may include first magnetic bodies connected to the first holding pins, second magnetic bodies connected to the second holding pins, respectively, and are installed inside the first and second magnetic bodies, respectively. It may include an inner magnetic material for applying a magnetic force to any one of the second magnetic material, and an inner magnetic material that is installed outside the first and second magnetic materials and applying a magnetic force to the other of the first and second magnetic materials. have.

The inner magnetic body may have a disk shape, an upper portion of the inner magnetic body may have a first polarity, and a lower portion of the inner magnetic body may have a second polarity.

The inner magnetic body may have a disc shape, the outer side of the inner magnetic body may have a first polarity, and the inner side of the inner magnetic body may have a second polarity.

The outer magnetic body may have a ring shape, an upper portion of the inner magnetic body may have a first polarity, and a lower portion of the inner magnetic body may have a second polarity.

The outer magnetic body may have a ring shape, the outside of the inner magnetic body may have a first polarity, and the inside of the inner magnetic body may have a second polarity.

The inner magnetic material is installed at a first height and the outer magnetic material is installed at a second height different from the first height, and the driving unit is a first movement capable of moving the inner magnetic material to the first or second height The member may further include a second moving member capable of moving the outer magnetic material to the first or second height.

The first and second magnetic bodies may be permanent magnets.

The first and second holding pins may be rotatable.

According to the present invention, a method of holding / unholding a substrate using a spin head may include mounting the substrate on an upper portion of the spin head, and forming first and second holding pins disposed along an edge of the spin head. The substrate is held in contact with each other and non-contacted with the side of the substrate, and the substrate is held and unheld. It is contacted / non-contacted by a magnetic force applied from an outer magnetic body provided outside the pins.

When the inner magnetic body applies magnetic force to any one of the first and second holding pins and contacts the side of the substrate, the outer magnetic body applies magnetic force to the other one of the first and second holding pins to Can be in contact with the side.

The inner magnetic body and the outer magnetic body may be elevated to apply magnetic force to the first and second holding pins.

Hereinafter, exemplary embodiments of the present invention will be described in more detail with reference to FIGS. 1 to 7. Embodiment of the present invention may be modified in various forms, the scope of the present invention should not be construed as limited to the embodiments described below. This embodiment is provided to explain in detail the present invention to those skilled in the art. Accordingly, the shape of each element shown in the drawings may be exaggerated to emphasize a more clear description.

1 is a perspective view schematically showing a spin head 10 according to the present invention, Figure 2 is a perspective view showing a first holding pin 120 according to the present invention.

The spin head 10 rotates the wafer W while holding the wafer W thereon. The rotated wafer W performs an etching process or a cleaning process by separate etching equipment or cleaning equipment.

The spin head 10 includes a disc-shaped plate 100, first and second holding pins 120 and 140 disposed on the plate 100 along an edge of the plate 100, and first and second plates. It includes a drive unit for driving the two holding pins (120, 140).

The plate 100 has a disc shape having a size corresponding to the wafer W, and a plurality of through holes 110 are formed in the plate 100 along the edge of the plate 100. The through hole 110 provides a passage through which the first and second rotation shafts 130 and 150 to be described later penetrate from the bottom of the plate 100 to the top of the plate 100.

The through holes 110 are formed to have a predetermined angle θ at a predetermined distance with respect to the center of the plate 100. This is because the first and second holding pins 120 and 140 which will be described later apply the force uniformly to the wafer (W). In the present embodiment, six through holes 110 are formed in the plate 100, and an angle θ between the through holes 110 is provided at 60 °. However, when a different number of through holes 110 is provided than the present embodiment, the angle θ between the through holes 110 may vary.

The first holding pins 120 and the second holding pins 140 alternately hold / unhold the wafer W during the process. When the first holding pins 120 hold the wafer W The second holding pins 140 hold the wafer W, and when the second holding pins 140 hold the wafer W, the second holding pins 140 hold the wafer W. The first holding pins 120 hold the wafer W.

2, the first holding pin 120a has a cylindrical body 122a, an inclined surface 124a connected to the upper end of the body 122a, and a support tip 126a connected to the upper end of the inclined surface 124a. ). The first rotating shaft 130a is connected to the lower portion of the body 122a, and the body 122a may rotate together with the rotation of the first rotating shaft 130a.

The support tip 126a is eccentric from the center of rotation of the first rotation shaft 130a, and thus the support tip 126a may approach the inside of the plate 100 according to the rotation of the first rotation shaft 130a. Therefore, in the holding state, the support tip 126a approaches the inside of the plate 100 and is in contact with the side of the wafer W. In the unholding state, the support tip 126a is biased toward the outside of the plate 100. It is a state spaced apart from the side of the wafer (W).

A method of holding the wafer W using the first holding pins 120 is as follows. Before the wafer W is loaded onto the spin head 10, the support tip 126a is biased outward of the plate 100 in a state eccentric from the center of rotation of the first rotational axis 130a. The loaded wafer W is seated on the inclined surface 124a, and after mounting, the first rotation shaft 130a is rotated. As the first rotation shaft 130a rotates, the support tip 126a approaches the inside of the plate 100 in an eccentric state from the rotation center of the first rotation shaft 130a, and the side surface of the support tip 126a is a wafer ( It is in close contact with the edge of W). The wafer W is held by the plurality of first holding pins 120 operating in this manner. The method of unholding the wafer W is the reverse of the method of holding the wafer W. Since the second holding pin 140 has the same structure and function as the first holding pin 120, a description thereof will be omitted.

The spin head 10 includes three first holding pins 120a, 120b, and 120c spaced apart from each other by 120 °, and three second holding pins 140a, 140b and 140c spaced apart by a 120 ° apart. The wafer W is alternately held / unheld by three first holding pins 120a, 120b and 120c and three second holding pins 140a, 140b and 140c.

3A and 3B illustrate a method of holding / unholding the wafer W using the inner driving unit 200 and the outer driving unit 300 according to the first embodiment of the present invention.

The driving unit includes first magnetic bodies 160 connected to the first holding pins 120, and second magnetic bodies 180 connected to the second holding pins 140, respectively.

The first magnetic body 160a is fixed to the first rotation shaft 130a positioned below the plate 100. Therefore, when the first magnetic body 160a rotates, the first rotation shaft 130a rotates together, and the first holding pin 120a also rotates as described above. Therefore, the holding / unholding state of the first holding pin 120a is determined by the first magnetic body 160a.

The first magnetic body 160a includes a first pole 162a and a second pole 164a. The first pole 162a is one of the N and S poles, and the second pole 164a is the other of the N and S poles. When the first holding pin 120a is in an unholding state, the first pole 162a is positioned outside the plate 100, and the second pole 164a is positioned inside the plate 100. When the first holding pin 120a is in the holding state, the first pole 162a is located inside the plate 100, and the second pole 164a is located outside the plate 100. 3A illustrates a case in which the first holding pin 120a is in an unholding state, and FIG. 3B illustrates a case in which the first holding pin 120a is in a holding state.

Since the second magnetic body 180a has the same structure and function as the first magnetic body 160a, a detailed description thereof will be omitted. However, the second magnetic body 180a is installed at a different height from the first magnetic body 160a. In the present embodiment, the second magnetic body 180a is installed at a lower level than the first magnetic body 160a.

3A illustrates a case in which the second holding pin 140a is in a holding state, and FIG. 3B illustrates a case in which the second holding pin 140a is in an unholding state.

The driving unit further includes an inner driving unit 200 and an outer driving unit 300 for driving the first holding pins 120 and the second holding pins 140.

The inner driving unit 200 is installed on the lower side of the plate 100 and the first holding pins 120 and the second holding pins 140, and the inner magnetic body 220 and the lower magnetic body 220. The inner driving shaft 280 and the inner driving portion 290 connected to the other side of the inner driving shaft 280 is further included.

The inner magnetic body 220 has a disc shape, and includes a first pole 222 located above and a second pole 224 located below. The inner magnetic material 220 is movable up and down by the inner driving part 290.

The outer driving unit 300 is installed on the lower side of the plate 100 and the outer side of the first holding pins 120 and the second holding pins 140, the outer magnetic body 320 and the lower magnetic body 320 It further includes an outer drive shaft 380 connected, and an outer drive unit 390 connected to the other side of the outer drive shaft 380.

The outer magnetic body 320 has a ring shape surrounding the first holding pins 120 and the second holding pins 140, and includes a first pole 322 disposed above and a second pole 324 located below. . The outer magnetic body 320 is liftable by the outer driving part 390.

Hereinafter, a method of holding / unholding the wafer W by using the inner driving unit 200 and the outer driving unit 300 according to the first embodiment of the present invention will be described with reference to FIGS. 3A and 3B. do.

As shown in FIG. 3A, when the inner driving shaft 280 rises and the outer driving shaft 380 descends, the first magnetic body 160a corresponds to the inner magnetic body 220, and the second magnetic body 180a is the outer magnetic body. Corresponds to 320.

At this time, when the first pole 162a of the first magnetic body 160a faces the first pole 222 of the inner magnetic body 220, the repulsive force is between the inner magnetic body 220 and the first magnetic body 160a. The first rotation shaft 130a rotates. When the second pole 164a of the first magnetic body 160a faces the inner magnetic body 220, an attractive force acts between the inner magnetic body 220 and the first magnetic body 160a, and the first rotation shaft 130a. Stops. In addition, as described above, when the second pole 164a of the first magnetic body 160a faces the inner magnetic material 220, the first holding pin 120a is in an unholding state.

Similarly, when the first pole 182a of the second magnetic body 180a faces the first pole 322 of the outer magnetic body 320, a repulsive force is applied between the outer magnetic body 320 and the second magnetic body 180a. And the second rotation shaft 150a rotates. When the second pole 184a of the second magnetic body 180a faces the outer magnetic body 320, an attractive force acts between the outer magnetic body 320 and the second magnetic body 180a, and the second rotating shaft 150a is provided. Stops. In addition, when the second pole 184a of the second magnetic body 180a faces the outer magnetic body 320 as described above, the second holding pin 140a is in a holding state.

On the contrary, as shown in FIG. 3B, when the inner driving shaft 280 descends and the outer driving arm 380 rises, the first magnetic body 160a corresponds to the outer magnetic body 320, and the second magnetic body 180a Corresponds to the inner magnetic material 220.

At this time, when the first pole 162a of the first magnetic body 160a faces the first pole 322 of the outer magnetic body 320, the repulsive force is between the outer magnetic body 320 and the first magnetic body 160a. The first rotation shaft 130a rotates. When the second pole 164a of the first magnetic body 160a faces the outer magnetic body 320, an attractive force acts between the outer magnetic body 320 and the first magnetic body 160a and the first rotating shaft 130a Stop. In addition, when the second pole 164a of the first magnetic body 160a faces the outer magnetic body 320 as described above, the first holding pin 120a is in a holding state.

Similarly, when the first pole 182a of the second magnetic body 180a faces the first pole 222 of the inner magnetic body 220, the repulsive force is applied between the inner magnetic body 220 and the second magnetic body 180a. The second rotation shaft 150a rotates because it acts. When the second pole 184a of the second magnetic body 180a faces the inner magnetic body 220, an attractive force acts between the inner magnetic body 220 and the second magnetic body 180a, and the second rotating shaft 150a is provided. Stops. In addition, when the second pole 184a of the second magnetic body 180a faces the inner magnetic material 220 as described above, the second holding pin 140a is in an unholding state.

Meanwhile, in the present embodiment, the first and second holding pins 120 and 140 are driven using magnetic force including repulsive force and attraction force, and a permanent magnet is used as a magnetic material having magnetic force. Alternatively, other materials having magnetic force may be used, such as an electromagnet having magnetic force by electric current.

4 is a diagram illustrating an arrangement relationship between the first and second magnetic bodies 160a and 180a, the inner magnetic body 220, and the outer magnetic body 320 according to the first embodiment of the present invention.

As illustrated in FIG. 1, the plurality of through holes 110 are formed to have 60 ° of a predetermined angle θ at a predetermined distance with respect to the center of the plate 100, and each of the through holes 110 may have a first angle. The rotating shafts 130a, 130b and 130c and the second rotating shafts 150a, 150b and 150c are provided. In addition, first magnetic bodies 160a, 160b and 160c are installed on the first rotation shafts 130a, 130b and 130c, and second magnetic bodies 180a, 180b and 180c are installed on the second rotation shafts 150a, 150b and 150c. do. 4 illustrates an arrangement relationship between the first magnetic bodies 160a, 160b and 160c and the second magnetic bodies 180a, 180b and 180c.

On the other hand, the inner magnetic material 220 is disposed inside the first magnetic material (160a, 160b, 160c) and the second magnetic material (180a, 180b, 180c), the first magnetic material (160a, 160b, 160c) and the second magnetic material ( The outer magnetic body 320 is disposed outside the 180a, 180b, and 180c. As described above, the inner magnetic body 220 and the outer magnetic body 320 alternately drive the first and second holding pins 120 and 140.

5A and 5B illustrate a state in which the wafer W is held / unheld using the first and second holding pins 120 and 140 according to the present invention.

5A illustrates a state in which the wafer W is held by using second support tips 146a, 146b, and 146c of the second holding pin 140. The second support tips 146a, 146b, and 146c hold the wafer W in close contact with the edge of the wafer W. The first support tips 126a, 126b, and 126c of the first holding pin 120 unhold the wafer W in a state spaced apart from the edge of the wafer W.

5B illustrates a state in which the wafer W is held using the first support tips 126a, 126b, and 126c of the first holding pin 120. The first support tips 126a, 126b, and 126c hold the wafer W in close contact with the edge of the wafer W. The second support tips 146a, 146b, and 146c of the second holding pin 120 hold the wafer W in a state spaced apart from the edge of the wafer W.

6A and 6B are views illustrating a method of holding / unholding a wafer by using the inner driving unit 200 and the outer driving unit 300 according to the second embodiment of the present invention, and FIG. FIG. 2 is a diagram illustrating an arrangement relationship between the first and second magnetic bodies 160 and 180, the inner magnetic body 220, and the outer magnetic body 320 according to the second embodiment.

According to the second embodiment of the present invention, the inner magnetic body 220 has a disc shape, and includes a first pole 222 located outside and a second pole 224 located inside. In addition, the outer magnetic body 320 has a ring shape surrounding the first holding pins 120 and the second holding pins 140, and has a first pole 322 located outside and a second pole 324 located inside. Equipped.

Since the method of holding / unholding the wafer W using the inner driving unit 200 and the outer driving unit 300 according to the second embodiment of the present invention is the same as in the first embodiment, a description thereof will be omitted. Let's do it.

Meanwhile, when the first holding pin 120 is switched to the holding state and the second holding pin 140 is switched to the unholding state, the unholding state of the second holding pin 140 is the first holding pin 120. It must be done after the holding state of. This is to prevent the wafer W from being temporarily held from the first and second holding pins 120 and 140.

Similarly, when the second holding pin 140 is switched to the holding state and the first holding pin 120 is switched to the unholding state, the unholding state of the first holding pin 120 is the second holding pin 140. It must be done after the holding state of.

As described above, since the wafer W is alternately held / unheld by the first holding pin 120 and the second holding pin 140, the wafer W is in contact / non-contact state with the wafer W. In this process, the contact with the wafer W can be minimized and the entire surface of the wafer W can be uniformly processed.

According to the present invention, the chemical liquid remaining on the contact surface of the wafer during the process can be removed, and the entire surface of the wafer can be uniformly processed.

Claims (13)

delete A plate located under the substrate during the process; First and second holding pins disposed along an edge of the plate at an upper portion of the plate and preventing the substrate from being separated from the upper portion of the plate; And The first and second holding pins are driven by magnetic force to hold / unhold the substrate by alternately contacting / non-contacting with the side of the substrate, and the second holding pins when the first holding pins hold the substrate. A driving unit for unholding the substrate and driving the first holding pins to unhold the substrate when the second holding pins hold the substrate; The drive unit, First magnetic bodies connected to the first holding pins, respectively; Second magnetic bodies connected to the second holding pins, respectively; An inner magnetic body installed inside the first and second magnetic bodies and configured to apply a magnetic force to any one of the first and second magnetic bodies; And And an outer magnetic body installed on the outside of the first and second magnetic bodies and applying a magnetic force to the other one of the first and second magnetic bodies. The method of claim 2, The inner magnetic body has a disk shape, the upper portion of the inner magnetic material has a first polarity, the lower portion of the inner magnetic material has a second polarity spin head. The method of claim 2, The inner magnetic body has a disk shape, the outside of the inner magnetic material is a first polarity and the inside of the inner magnetic material has a second polarity of the spin head. The method of claim 2, The outer magnetic body is a ring shape, the upper portion of the outer magnetic material is a first polarity, the lower portion of the outer magnetic material spin head, characterized in that it has a second polarity. The method of claim 2, The outer magnetic body has a ring shape, the outside of the outer magnetic material is a first polarity and the inside of the outer magnetic material has a second polarity of the spin head. The method of claim 2, The inner magnetic material is installed at a first height and the outer magnetic material is installed at a second height different from the first height, The drive unit, A first moving member capable of moving the inner magnetic material to the first or second height; And And a second moving member capable of moving the outer magnetic material to the first or second height. The method of claim 2, The first and second magnetic body is a spin head, characterized in that the permanent magnet. The method of claim 2, And the first and second holding pins are rotatable. delete In the method for holding / unholding a substrate using a spin head, The substrate is seated on top of the spin head, and the first and second holding pins disposed along the edge of the spin head are alternately contacted / non-contacted with the sides of the substrate, so that the first holding pins The second holding pins unhold the substrate when held, and the first holding pins unhold the substrate when the second holding pins hold the substrate. The first and second holding pins are contacted / non-contacted by a magnetic force applied from an inner magnetic body installed inside the first and second holding pins and an outer magnetic body installed outside the first and second holding pins; When the inner magnetic body applies magnetic force to any one of the first and second holding pins and contacts the side of the substrate, the outer magnetic body applies magnetic force to the other one of the first and second holding pins to A method for holding / unholding a substrate, characterized in that it is in contact with the side. The method of claim 11, And the inner magnetic material and the outer magnetic material are raised and lowered to apply magnetic force to the first and second holding pins. The method of claim 2, And the first and second holding pins are alternately disposed along the side.

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