KR100824820B1 - 통신 장치의 마이크 커플러 - Google Patents
통신 장치의 마이크 커플러 Download PDFInfo
- Publication number
- KR100824820B1 KR100824820B1 KR1020060058965A KR20060058965A KR100824820B1 KR 100824820 B1 KR100824820 B1 KR 100824820B1 KR 1020060058965 A KR1020060058965 A KR 1020060058965A KR 20060058965 A KR20060058965 A KR 20060058965A KR 100824820 B1 KR100824820 B1 KR 100824820B1
- Authority
- KR
- South Korea
- Prior art keywords
- microphone
- pcb
- cover
- metal
- shielding
- Prior art date
Links
- 238000004891 communication Methods 0.000 title claims abstract description 55
- MTCPZNVSDFCBBE-UHFFFAOYSA-N 1,3,5-trichloro-2-(2,6-dichlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=C(Cl)C=CC=C1Cl MTCPZNVSDFCBBE-UHFFFAOYSA-N 0.000 claims description 32
- 238000000034 method Methods 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 15
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- 238000006243 chemical reaction Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 4
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- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 230000005236 sound signal Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
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- 238000010586 diagram Methods 0.000 description 2
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- 238000001914 filtration Methods 0.000 description 2
- 238000010295 mobile communication Methods 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- NTKSJAPQYKCFPP-UHFFFAOYSA-N 1,2,4,5-tetrachloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C(=C(Cl)C=C(Cl)C=2Cl)Cl)=C1 NTKSJAPQYKCFPP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
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- 238000013507 mapping Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- 210000003813 thumb Anatomy 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B15/00—Suppression or limitation of noise or interference
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
- H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Telephone Set Structure (AREA)
- Transmitters (AREA)
- Details Of Audible-Bandwidth Transducers (AREA)
- Mechanical Pencils And Projecting And Retracting Systems Therefor, And Multi-System Writing Instruments (AREA)
Abstract
Description
Claims (18)
- 전도성 패드를 구비하는 인쇄 회로 기판(PCB; 104);전기 접촉을 구비하는 마이크(microphone; 112);RF 차폐를 제공하는 금속 캔(120)으로서, 상기 금속 캔(120)은 상기 PCB 상의 마이크(112)를 덮도록 형성되고, 음향이 상기 마이크에 도달하기 위한 개구부(204)를 구비하는 것인 상기 금속 캔(120); 및상기 PCB(104) 및 상기 금속 캔(120)을 둘러싸도록 형성되는 덮개로서, 상기 덮개는 벽(wall)들의 세트에 의해 정의되는 내부 캐비티(214)를 구비하고, 상기 캐비티는 상기 금속 캔을 수용하여 상기 금속 캔을 상기 마이크 위의 정위치에 고정시키도록 형성되고, 상기 덮개는 상기 마이크의 전기 접촉이 상기 전도성 패드에 대하여 압착되도록 상기 금속 캔을 상기 PCB 측으로 압착하여 상기 마이크를 상기 PCB 상에 고정하도록 형성되는 것인 상기 덮개를 포함하는 통신 장치(10).
- 제1항에 있어서, 상기 벽들의 세트는 상기 금속 캔과 접촉을 형성하는 금속 물질(metallized material)로 라이닝(line)되어 있는 것인 통신 장치.
- 제1항 또는 제2항에 있어서,상기 금속 캔(120)의 하부 엣지와 접촉하도록 형성되고, 상기 PCB(104)와 상기 금속 캔(120) 사이에 위치하는 RF 개스킷(210); 및상기 금속 캔에 대한 상기 PCB 내의 접지 연결(ground connection)로의 접지 경로(ground path)를 완성하기 위해 상기 RF 개스킷과 접촉하는 상기 PCB 내의 전기 연결(electrical connection)을 더 포함하는 통신 장치.
- 제3항에 있어서,상기 마이크를 덮도록 끼워 맞춰진 마이크 부츠(microphone boot)를 더 포함하는 통신 장치.
- 제4항에 있어서,상기 내부 캐비티의 내면과 상기 금속 캔 사이에 위치하는 개스킷(130)를 더 포함하는 통신 장치.
- 제3항에 있어서,상기 금속 캔(120)을 덮도록 끼워 맞춰진 마이크 부츠를 더 포함하는 통신 장치.
- 제6항에 있어서,상기 마이크의 표면과 상기 금속 캔(120)의 천정(ceiling) 사이에 위치하는 개스킷(130)을 더 포함하는 통신 장치.
- 제1항 또는 제2항에 있어서,상기 마이크의 상부에 위치하는 헬름홀쯔 캐비티(214)를 더 포함하는 통신 장치.
- 제8항에 있어서,상기 헬름홀쯔 캐비티는 상기 덮개(12A) 바로 아래에 위치하는 공간에 의해 정의되는 것인 통신 장치.
- 제1항 또는 제2항에 있어서,적어도 일부가 상기 덮개 내에 위치하는 안테나(154)를 더 포함하는 통신 장치.
- 제3항에 있어서,상기 마이크의 상부에 위치하는 헬름홀쯔 캐비티(214)를 더 포함하는 통신 장치.
- 제5항에 있어서,상기 마이크의 상부에 위치하는 헬름홀쯔 캐비티(214)를 더 포함하는 통신 장치.
- 제7항에 있어서,상기 마이크의 상부에 위치하는 헬름홀쯔 캐비티(214)를 더 포함하는 통신 장치.
- 제10항에 있어서,상기 마이크의 상부에 위치하는 헬름홀쯔 캐비티(214)를 더 포함하는 통신 장치.
- 제3항에 있어서,적어도 일부가 상기 덮개 내에 위치하는 안테나(154)를 더 포함하는 통신 장치.
- 제5항에 있어서,적어도 일부가 상기 덮개 내에 위치하는 안테나(154)를 더 포함하는 통신 장치.
- 제7항에 있어서,적어도 일부가 상기 덮개 내에 위치하는 안테나(154)를 더 포함하는 통신 장치.
- 제11항에 있어서,적어도 일부가 상기 덮개 내에 위치하는 안테나(154)를 더 포함하는 통신 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05105772A EP1739933B1 (en) | 2005-06-28 | 2005-06-28 | Communication device with shielded microphone |
EP05105772.7 | 2005-06-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070001021A KR20070001021A (ko) | 2007-01-03 |
KR100824820B1 true KR100824820B1 (ko) | 2008-04-23 |
Family
ID=35376918
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060058965A KR100824820B1 (ko) | 2005-06-28 | 2006-06-28 | 통신 장치의 마이크 커플러 |
Country Status (10)
Country | Link |
---|---|
EP (1) | EP1739933B1 (ko) |
JP (1) | JP4303737B2 (ko) |
KR (1) | KR100824820B1 (ko) |
CN (1) | CN1917382B (ko) |
AT (1) | ATE383711T1 (ko) |
AU (1) | AU2006202755B2 (ko) |
CA (1) | CA2550887C (ko) |
DE (1) | DE602005004271T2 (ko) |
SG (1) | SG128642A1 (ko) |
TW (1) | TWI327031B (ko) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1739933B1 (en) * | 2005-06-28 | 2008-01-09 | Research In Motion Limited | Communication device with shielded microphone |
WO2008062036A2 (en) | 2006-11-23 | 2008-05-29 | Pulse Mems Aps. | Board mounting of microphone transducer |
US8295528B2 (en) | 2006-11-23 | 2012-10-23 | Epcos Ag | Board mounting of microphone transducer |
JP2008278476A (ja) * | 2007-04-05 | 2008-11-13 | Yamaha Corp | コンデンサマイク装置のsn比改善方法およびコンデンサマイク装置並びにコンデンサマイク装置搭載機器 |
KR101415765B1 (ko) * | 2007-10-09 | 2014-07-08 | 엘지전자 주식회사 | 휴대 단말기 |
US7817798B2 (en) * | 2008-10-07 | 2010-10-19 | Shoretel, Inc. | Compact beamforming microphone assembly |
JP5481852B2 (ja) | 2008-12-12 | 2014-04-23 | 船井電機株式会社 | マイクロホンユニット及びそれを備えた音声入力装置 |
US8340735B2 (en) | 2010-08-06 | 2012-12-25 | Research In Motion Limited | Electromagnetic shielding and an acoustic chamber for a microphone in a mobile electronic device |
EP2416544B1 (en) * | 2010-08-06 | 2015-04-29 | BlackBerry Limited | Electromagnetic Shielding and an Acoustic Chamber for a Microphone in a Mobile Electronic Device |
KR101156052B1 (ko) * | 2010-10-19 | 2012-06-20 | 주식회사 비에스이 | 표면실장형 마이크로폰 |
CN204465862U (zh) * | 2015-01-23 | 2015-07-08 | 瑞声声学科技(深圳)有限公司 | 微机电麦克风的封装结构 |
CN107920323B (zh) * | 2016-10-10 | 2020-10-16 | 中兴通讯股份有限公司 | 一种麦克风密封装置 |
WO2018095028A1 (en) | 2016-11-25 | 2018-05-31 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Housing for terminal and terminal |
TWI707586B (zh) * | 2018-08-14 | 2020-10-11 | 美律實業股份有限公司 | 微機電揚聲器 |
CN110366069A (zh) * | 2019-06-24 | 2019-10-22 | 卢宇庭 | 一种高保真拾音器小型化安装的方法 |
AU2021230524A1 (en) | 2020-03-03 | 2022-09-29 | Intelligent Agricultural Solutions Llc | Stanley coupler |
CN112542683B (zh) * | 2020-12-09 | 2022-02-25 | 北京航空航天大学 | 一种用于星载的低频信号发射天线 |
CN117424644B (zh) * | 2023-12-18 | 2024-03-12 | 中国科学院长春光学精密机械与物理研究所 | 基于红外传输协议的室内语音传输装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0678040A (ja) * | 1992-08-26 | 1994-03-18 | Matsushita Electric Ind Co Ltd | マイクロホン装置 |
US5937361A (en) * | 1997-05-09 | 1999-08-10 | Ericsson Inc. | Radiotelephones with shielded microphones |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1989004106A1 (en) * | 1987-10-28 | 1989-05-05 | Acs Communications, Inc. | Acoustic filter microphone cup |
US4857668A (en) * | 1988-04-15 | 1989-08-15 | Schlegel Corporation | Multi-function gasket |
US6051779A (en) * | 1996-11-21 | 2000-04-18 | Ericsson Inc. | Shield can with integrally molded gasket |
FI970409L (fi) * | 1997-01-31 | 1998-08-01 | Nokia Mobile Phones Ltd | Menetelmä mikrofonin suojaamiseksi ulkoisilta häiriötekijäiltä ja mikrofonin häiriösuojus |
EP1739933B1 (en) * | 2005-06-28 | 2008-01-09 | Research In Motion Limited | Communication device with shielded microphone |
-
2005
- 2005-06-28 EP EP05105772A patent/EP1739933B1/en active Active
- 2005-06-28 AT AT05105772T patent/ATE383711T1/de not_active IP Right Cessation
- 2005-06-28 DE DE602005004271T patent/DE602005004271T2/de active Active
-
2006
- 2006-06-26 SG SG200604370A patent/SG128642A1/en unknown
- 2006-06-27 JP JP2006177093A patent/JP4303737B2/ja active Active
- 2006-06-27 AU AU2006202755A patent/AU2006202755B2/en active Active
- 2006-06-27 CA CA2550887A patent/CA2550887C/en active Active
- 2006-06-28 TW TW095123443A patent/TWI327031B/zh active
- 2006-06-28 KR KR1020060058965A patent/KR100824820B1/ko active IP Right Grant
- 2006-06-28 CN CN2006101422792A patent/CN1917382B/zh active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0678040A (ja) * | 1992-08-26 | 1994-03-18 | Matsushita Electric Ind Co Ltd | マイクロホン装置 |
US5937361A (en) * | 1997-05-09 | 1999-08-10 | Ericsson Inc. | Radiotelephones with shielded microphones |
Also Published As
Publication number | Publication date |
---|---|
DE602005004271D1 (de) | 2008-02-21 |
KR20070001021A (ko) | 2007-01-03 |
JP2007013966A (ja) | 2007-01-18 |
CA2550887A1 (en) | 2006-12-28 |
CN1917382A (zh) | 2007-02-21 |
DE602005004271T2 (de) | 2008-12-24 |
JP4303737B2 (ja) | 2009-07-29 |
TWI327031B (en) | 2010-07-01 |
CA2550887C (en) | 2010-10-19 |
CN1917382B (zh) | 2010-12-08 |
EP1739933B1 (en) | 2008-01-09 |
AU2006202755A1 (en) | 2007-01-18 |
TW200718256A (en) | 2007-05-01 |
AU2006202755B2 (en) | 2008-07-31 |
ATE383711T1 (de) | 2008-01-15 |
EP1739933A1 (en) | 2007-01-03 |
SG128642A1 (en) | 2007-01-30 |
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