KR100820170B1 - 플렉시블 기판의 적층 방법 - Google Patents
플렉시블 기판의 적층 방법 Download PDFInfo
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- KR100820170B1 KR100820170B1 KR1020060082746A KR20060082746A KR100820170B1 KR 100820170 B1 KR100820170 B1 KR 100820170B1 KR 1020060082746 A KR1020060082746 A KR 1020060082746A KR 20060082746 A KR20060082746 A KR 20060082746A KR 100820170 B1 KR100820170 B1 KR 100820170B1
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- H—ELECTRICITY
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- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/01—Manufacture or treatment
- H10D86/021—Manufacture or treatment of multiple TFTs
- H10D86/0214—Manufacture or treatment of multiple TFTs using temporary substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
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- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/411—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by materials, geometry or structure of the substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/14—Glass
- C09J2400/143—Glass in the substrate
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/20—Presence of organic materials
- C09J2400/22—Presence of unspecified polymer
- C09J2400/226—Presence of unspecified polymer in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/006—Presence of polyolefin in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/006—Presence of polyester in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
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Abstract
Description
Claims (17)
- 캐리어 기판을 준비하는 단계;상기 캐리어 기판 상에 압착 방법을 이용하여 접착층을 적층하는 단계; 및상기 접착층 상에 압착 방법을 이용하여 적어도 하나의 화상 표시 소자가 형성된 플렉시블 기판을 적층하는 단계를 포함하되,상기 접착층을 적층하는 단계 및 상기 플렉시블 기판을 적층하는 단계는,상기 접착층 또는 상기 플렉시블 기판의 상부에 형성되며 상하 이동 가능한 상부 압착부, 상기 캐리어 기판의 하부에 형성되는 고정 압착부 또는 상하 이동 가능한 하부 압착부를 포함하는 압착기를 이용하여 적층하는플렉시블 기판의 적층 방법.
- 제 1항에 있어서, 상기 압착기는,상기 캐리어 기판 또는 상기 접착층 또는 상기 플렉시블 기판의 손상을 방지하기 위하여 상기 캐리어 기판 또는 상기 접착층 또는 상기 플렉시블 기판이 접촉되는 영역에 형성되는 보호체를 더 포함하는플렉시블 기판의 적층 방법.
- 제 2항에 있어서, 상기 압착기는,0 ~ 160℃의 범위에서 온도 조절 가능한플렉시블 기판의 적층 방법.
- 제 2항에 있어서, 상기 압착기는,상기 접착층 또는 상기 플렉시블 기판과의 밀착을 위한 공기압 조절 또는 기계식 조절이 가능한플렉시블 기판의 적층 방법.
- 제 4항에 있어서, 상기 압착기는,0.1 ~ 100㎏/㎠ 의 범위에서 공기압 조절이 가능한플렉시블 기판의 적층 방법.
- 캐리어 기판을 준비하는 단계;상기 캐리어 기판 상에 라미네이팅 방법을 이용하여 접착층을 적층하는 단계; 및상기 접착층 상에 라미네이팅 방법을 이용하여 적어도 하나의 화상 표시 소자가 형성된 플렉시블 기판을 적층하는 단계를 포함하되,상기 접착층을 적층하는 단계 및 상기 플렉시블 기판을 적층하는 단계는,상기 접착층 또는 상기 플렉시블 기판의 상부에서 회전하는 상부 롤러, 상기 캐리어 기판의 하부에서 회전하는 하부 롤러 또는 상기 캐리어 기판의 하부에 형성되는 하부 지지대를 포함하며, 상기 상부 롤러와 상기 하부 롤러 사이의 간격 또는 상기 상부 롤러와 상기 하부 지지대 사이의 간격은 기계식 또는 공기압 조절이 가능한 라미네이터를 이용하여 적층하는플렉시블 기판의 적층 방법.
- 제 6항에 있어서, 상기 라미네이터는,상기 캐리어 기판 또는 상기 접착층 또는 상기 플렉시블 기판의 손상을 방지하기 위하여 상기 캐리어 기판 또는 상기 접착층 또는 상기 플렉시블 기판이 접촉되는 영역에 형성되는 보호체를 더 포함하는플렉시블 기판의 적층 방법.
- 제 6항에 있어서, 상기 라미네이터는,0 ~ 160℃의 범위에서 온도 조절 가능한플렉시블 기판의 적층 방법.
- 제 6항에 있어서, 상기 라미네이터는,0.1 ~ 10㎏/㎠ 의 범위에서 공기압 조절이 가능한플렉시블 기판의 적층 방법.
- 제 2항 또는 제 7항에 있어서, 상기 보호체는,고무 또는 천으로 코팅 또는 적층되어 있는플렉시블 기판의 적층 방법.
- 제 1항 또는 제 6항에 있어서,상기 접착층 및 상기 플렉시블 기판을 적층하는 단계의 적층 분위기는 상압 분위기, 불활성 분위기 및 진공 분위기 중 어느 하나인플렉시블 기판의 적층 방법.
- 제 1항 또는 제 6항에 있어서, 상기 접착층은,지지체와 상기 지지체의 상부 및 하부에 형성되는 접착체층을 포함하는 플렉시블 기판의 적층 방법.
- 제 12항에 있어서, 상기 지지체는,폴리에틸렌 테레프탈레이트(poly(ethylene terephthalat)), 폴리부틸렌 테레프탈레이트(poly(butylenes terephthalat)), 폴리이미드(polyimide), 폴리에스터(polyseter), 폴리올레핀(polyethylene, polypropylene) 중 어느 하나인플렉시블 기판의 적층 방법.
- 제 1항 또는 제 6항에 있어서, 상기 플렉시블 기판은,금속 박막, 플라스틱 기판 및 초박형 유리 기판 중 어느 하나인플렉시블 기판의 적층 방법.
- 제 1항 또는 제 6항에 있어서, 상기 캐리어 기판은,유리 기판 또는 실리콘 기판인플렉시블 기판의 적층 방법.
- 제 1항 또는 제 6항에 있어서,상기 플렉시블 기판 상에 화상표시소자를 형성한 후 상기 캐리어 기판을 박리하는 단계를 더 포함하는 플렉시블 기판의 적층 방법.
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Application Number | Priority Date | Filing Date | Title |
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KR1020060082746A KR100820170B1 (ko) | 2006-08-30 | 2006-08-30 | 플렉시블 기판의 적층 방법 |
US11/774,855 US8038820B2 (en) | 2006-08-30 | 2007-07-09 | Method of stacking flexible substrate |
US13/231,266 US8206536B2 (en) | 2006-08-30 | 2011-09-13 | Method of stacking flexible substrate |
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KR1020060082746A KR100820170B1 (ko) | 2006-08-30 | 2006-08-30 | 플렉시블 기판의 적층 방법 |
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KR100820170B1 true KR100820170B1 (ko) | 2008-04-10 |
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Cited By (2)
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KR101038329B1 (ko) | 2009-03-23 | 2011-06-01 | 웅진케미칼 주식회사 | 플렉시블 디스플레이 기판 |
KR102111123B1 (ko) | 2019-01-09 | 2020-05-15 | ㈜ 엘에이티 | 에어튜브를 이용한 곡면형 커버 글라스용 라미네이터 |
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KR101494317B1 (ko) * | 2013-08-30 | 2015-02-23 | 엠에스티코리아(주) | 압착 장치 및 이를 이용한 플렉시블 디스플레이 장치의 제조 방법 |
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Also Published As
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US8038820B2 (en) | 2011-10-18 |
US20080053604A1 (en) | 2008-03-06 |
KR20080020024A (ko) | 2008-03-05 |
US8206536B2 (en) | 2012-06-26 |
US20120000602A1 (en) | 2012-01-05 |
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