KR100795179B1 - 질화물계 반도체 발광소자 - Google Patents
질화물계 반도체 발광소자 Download PDFInfo
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- KR100795179B1 KR100795179B1 KR1020060048877A KR20060048877A KR100795179B1 KR 100795179 B1 KR100795179 B1 KR 100795179B1 KR 1020060048877 A KR1020060048877 A KR 1020060048877A KR 20060048877 A KR20060048877 A KR 20060048877A KR 100795179 B1 KR100795179 B1 KR 100795179B1
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- type cladding
- cladding layer
- light emitting
- emitting device
- semiconductor light
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- 239000004065 semiconductor Substances 0.000 title abstract description 81
- 150000004767 nitrides Chemical class 0.000 title abstract description 75
- 238000005253 cladding Methods 0.000 claims abstract description 124
- 239000000758 substrate Substances 0.000 claims description 24
- 230000035939 shock Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 230000036039 immunity Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
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- Led Devices (AREA)
Abstract
Description
Claims (4)
- 양전극;상기 양전극과 접하는 제2 n형 클래드층을 가지고, 상기 양전극과 일부 접하도록 그 하면에 형성된 제1 p형 클래드층;상기 제1 p형 클래드층 하면에 형성된 활성층;상기 활성층과 접하지 않는 제2 p형 클래드층을 가지고, 상기 활성층 하면 전체에 형성된 제1 n형 클래드층; 및상기 제1 n형 클래드층의 일부 및 제2 p형 클래드층과 접하도록 그 하면에 형성된 음전극을 포함하는 질화물계 반도체 발광소자.
- 양전극;상기 양전극과 접하는 제2 p형 클래드층을 가지고, 상기 양전극과 일부 접하도록 그 하면에 형성된 제1 n형 클래드층;상기 제1 n형 클래드층 하면에 형성된 활성층;상기 활성층과 접하지 않는 제2 n형 클래드층을 가지고, 상기 활성층 하면 전체에 형성된 제1 p형 클래드층; 및상기 제1 p형 클래드층의 일부 및 제2 n형 클래드층과 접하도록 그 하면에 형성된 음전극을 포함하는 질화물계 반도체 발광소자.
- 기판;상기 기판과 접하지 않는 제2 p형 클래드층을 가지고, 상기 기판 상면 전체에 형성된 제1 n형 클래드층;상기 제1 n형 클래드층 상면의 소정 영역에 형성된 활성층;상기 활성층과 접하지 않는 제2 n형 클래드층을 가지고, 상기 활성층 상면 전체에 형성된 제1 p형 클래드층;상기 제1 p형 클래드층의 일부 및 상기 제2 n형 클래드층과 접하도록 그 상면에 형성된 양전극; 및상기 활성층이 형성되지 않은 제1 n형 클래드층의 일부 및 상기 제2 p형 클래드층과 접하도록 그 상면에 형성된 음전극을 포함하는 질화물계 반도체 발광소자.
- 기판;상기 기판과 접하지 않는 제2 n형 클래드층을 가지고, 상기 기판 상면 전체에 형성된 제1 p형 클래드층;상기 제1 p형 클래드층 상면의 소정 영역에 형성된 활성층;상기 활성층과 접하지 않는 제2 p형 클래드층을 가지고, 상기 활성층 상면 전체에 형성된 제1 n형 클래드층;상기 제1 n형 클래드층의 일부 및 상기 제2 p형 클래드층과 접하도록 그 상면에 형성된 양전극; 및상기 활성층이 형성되지 않은 제1 p형 클래드층의 일부 및 상기 제2 n형 클래드층과 접하도록 그 상면에 형성된 음전극을 포함하는 질화물계 반도체 발광소자.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060048877A KR100795179B1 (ko) | 2006-05-30 | 2006-05-30 | 질화물계 반도체 발광소자 |
CNB2007101030428A CN100517786C (zh) | 2006-05-30 | 2007-04-29 | 氮化物基半导体发光二极管 |
US11/797,491 US7683389B2 (en) | 2006-05-30 | 2007-05-03 | Nitride-based semiconductor light emitting diode |
JP2007137849A JP4879820B2 (ja) | 2006-05-30 | 2007-05-24 | 窒化物系半導体発光素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060048877A KR100795179B1 (ko) | 2006-05-30 | 2006-05-30 | 질화물계 반도체 발광소자 |
Publications (2)
Publication Number | Publication Date |
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KR20070115062A KR20070115062A (ko) | 2007-12-05 |
KR100795179B1 true KR100795179B1 (ko) | 2008-01-16 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020060048877A KR100795179B1 (ko) | 2006-05-30 | 2006-05-30 | 질화물계 반도체 발광소자 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7683389B2 (ko) |
JP (1) | JP4879820B2 (ko) |
KR (1) | KR100795179B1 (ko) |
CN (1) | CN100517786C (ko) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101222015B (zh) * | 2008-01-19 | 2010-05-12 | 鹤山丽得电子实业有限公司 | 发光二极管、具有其的封装结构及其制造方法 |
JP5218117B2 (ja) * | 2008-03-18 | 2013-06-26 | 三菱電機株式会社 | 窒化物半導体積層構造及び光半導体装置並びにその製造方法 |
KR100986440B1 (ko) | 2009-04-28 | 2010-10-08 | 엘지이노텍 주식회사 | 발광소자 및 그 제조방법 |
TWI527261B (zh) * | 2009-09-11 | 2016-03-21 | 晶元光電股份有限公司 | 發光元件 |
CN102456826A (zh) * | 2010-11-01 | 2012-05-16 | 富士康(昆山)电脑接插件有限公司 | 发光二极管导线架 |
CN102207534B (zh) * | 2011-03-18 | 2013-04-17 | 华南师范大学 | 利用pn结测量LED热阻的方法及其装置 |
CN105938864B (zh) * | 2016-06-22 | 2018-05-29 | 厦门乾照光电股份有限公司 | 一种ac-led芯片及其制造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR960026992A (ko) * | 1994-12-02 | 1996-07-22 | 오가와 에이지 | 질화물 반도체 발광 소자 및 질화물 반도체 발광 다이오드 |
Family Cites Families (6)
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JPS4982668A (ko) * | 1972-12-20 | 1974-08-08 | ||
JP3787202B2 (ja) * | 1997-01-10 | 2006-06-21 | ローム株式会社 | 半導体発光素子 |
JP2002185049A (ja) | 2000-11-08 | 2002-06-28 | Lumileds Lighting Us Llc | フリップチップ発光ダイオードおよびフリップチップ静電放電保護チップをパッケージにおける電極にダイレクトボンディングする方法 |
TW492202B (en) | 2001-06-05 | 2002-06-21 | South Epitaxy Corp | Structure of III-V light emitting diode (LED) arranged in flip chip configuration having structure for preventing electrostatic discharge |
KR100536709B1 (ko) | 2003-05-31 | 2005-12-14 | 주식회사 대우일렉트로닉스 | 비디오 신호처리 제어장치 |
US20050189552A1 (en) * | 2003-12-26 | 2005-09-01 | Nobuyuki Ikoma | Semiconductor light-emitting device |
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2006
- 2006-05-30 KR KR1020060048877A patent/KR100795179B1/ko active IP Right Grant
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2007
- 2007-04-29 CN CNB2007101030428A patent/CN100517786C/zh active Active
- 2007-05-03 US US11/797,491 patent/US7683389B2/en active Active
- 2007-05-24 JP JP2007137849A patent/JP4879820B2/ja active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR960026992A (ko) * | 1994-12-02 | 1996-07-22 | 오가와 에이지 | 질화물 반도체 발광 소자 및 질화물 반도체 발광 다이오드 |
Also Published As
Publication number | Publication date |
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JP4879820B2 (ja) | 2012-02-22 |
CN100517786C (zh) | 2009-07-22 |
US7683389B2 (en) | 2010-03-23 |
KR20070115062A (ko) | 2007-12-05 |
JP2007324591A (ja) | 2007-12-13 |
CN101083291A (zh) | 2007-12-05 |
US20070278499A1 (en) | 2007-12-06 |
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