KR100751084B1 - Light emitting element - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device, wherein a chip mounting portion is formed at a central portion to protrude to a certain height, and a heat dissipation main board made of metal material, a plurality of light emitting diode chips mounted on the chip mounting portion, and chip mounting in the center An insertion hole through which an additional part is formed is formed and is mounted around the chip seat of the heat dissipation main board, and is concentrically with the through hole formed to penetrate up and down on the upper surface of the exposed part further extended to be exposed to the heat dissipation main board. A circuit board on which a chip bonding pad is formed which electrically connects the light emitting diode chip to the conductive pad and the conductive pad, and a lead pin that is joined to the conductive pad through a through hole and extends downward along the side of the heat dissipation main substrate. And an insulating spacer formed of an insulating material and coupled to the lead pin at the bottom of the circuit board, and a beam diffused from the light emitting diode chip to the surroundings. Able to belong to a circuit comprising a reflector of a metal material bonding through the insulation sheet on the substrate. Such a light emitting device has good assembly performance by screwing a large-area metallic heat dissipation main board, a circuit board, and a reflector on which a large number of light emitting diode chips are mounted, by screwing, and the reflector of the metal material has a heat dissipation main board and screws. It is combined with through to provide the advantage to increase the heat dissipation ability.

Description

Light emitting device

1 is a cross-sectional view showing a light emitting device according to a preferred embodiment of the present invention,

2 is an exploded perspective view illustrating some elements of the light emitting device of FIG. 1;

3 is a plan view illustrating a state in which the elements of FIG. 2 are stacked on each other;

4 is a plan view illustrating a preferred example of manufacturing the circuit board of FIG.

<Description of Symbols for Major Parts of Drawings>

110: heat dissipation main board 127: lead pin

130: circuit board 150: insulating sheet

170: reflector

The present invention relates to a light emitting device, and more particularly, to a light emitting device having a heat dissipation and light focusing structure suitable for high output.

Recently, as the light emitting diode (LED) is known to have a structure that emits white light by applying a phosphor, its application range has been extended to a lighting field that can replace a conventional light lamp in addition to a simple light emitting display function. . In addition, research on high power light emitting diodes suitable for lighting has been continuously conducted.

The light emitting diode, which is one of the semiconductor devices, decreases its lifespan and decreases the luminous efficiency when the temperature rises above the rated operating temperature. Therefore, in order to increase the output of the light emitting diodes, the light emitting diodes effectively emit heat generated from the light emitting diodes. Heat dissipation structure is required.

However, the conventional light emitting diode has a structure in which a lead frame on which a light emitting diode chip is mounted is molded with a plastic material. The light emitting diode of such a structure is difficult to be applied to a high output light emitting diode because the heat dissipation is low because the heat radiation is carried out through the lead frame.

On the other hand, in recent years, various structures have been proposed in which a light emitting diode chip is mounted on a metal substrate in order to increase light emission efficiency and heat radiation effect.

By the way, when a plurality of light emitting diode chips are mounted on one substrate, most of them have a structure in which red, green, and blue light emitting diodes can be applied. However, when ten or more light emitting diodes are mounted on one substrate and the phosphor is filled to obtain white light, the temperature of the phosphor is increased by light absorption of the phosphor, and thus, the characteristics of the phosphor are deteriorated. There is a need for structures that can improve the problem.

In addition, when a plurality of light emitting diode chips are mounted in a single substrate and used for high output, a structure is required that is easy to manufacture and can increase heat dissipation capability.

The present invention has been made to solve the above requirements, and has an object of providing a high output light emitting device having a structure that can be applied to the phosphor thinly while improving the heat radiation capacity and luminous efficiency.

Still another object of the present invention is to provide a high output light emitting device having good assembly performance.

In order to achieve the above object, the light emitting device according to the present invention includes a chip mounting portion formed at a central portion so as to protrude to a predetermined height, and a heat dissipating main substrate made of a metal material; A plurality of light emitting diode chips mounted on the chip seat; An insertion hole through which the chip seat part is penetrated is formed at the center thereof, and is mounted around the chip seat part of the heat dissipation main board, and penetrates up and down on an upper surface of the exposed part further extended to be exposed to the heat dissipation main board. A circuit board having a conductive pad formed concentrically with the through hole formed therein, and a chip bonding pad connected to the conductive pad to electrically connect the light emitting diode chip; A lead pin joined to the conductive pad through the through hole and extending downwardly in parallel with a side surface of the heat dissipation main substrate; An insulating spacer coupled to the lead pin at the bottom of the circuit board and formed of an insulating material; And a reflector made of a metal material bonded through an insulating sheet on the circuit board to focus the beam diffused from the light emitting diode chip to the surroundings.

Preferably the protruding height of the chip seat is 0.05mm to 0.8mm.

In addition, the upper surface of the circuit board is formed to be 0.1 to 1 millimeter higher than the upper surface of the light emitting diode chip mounted on the chip mounting portion.

More preferably, the reflector, the circuit board, and the heat dissipation main board are formed with assembly holes formed at positions corresponding to each other, and are coupled to each other by screws through the assembly holes.

Hereinafter, a light emitting device and a method of manufacturing the same according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view illustrating a light emitting device according to a preferred embodiment of the present invention, FIG. 2 is an exploded perspective view illustrating some elements of the light emitting device of FIG. 1, and FIG. It is the top view which showed the bonded state.

1 to 3, the light emitting device 100 includes a heat dissipation main board 110, a lead pin 127, a circuit board 130, an insulating sheet 150, and a reflector 170.

The heat dissipation main substrate 110 includes a chip mounting portion 113 for mounting a light emitting diode chip 121 formed to protrude at a predetermined height in a central portion thereof, and a base portion 115 extending horizontally from a lower portion of the chip mounting portion 113. ) And an auxiliary coupling portion 116 extending from the edges of two sides of the base portion 115 to protrude a predetermined height. Protruding height of the chip mounting portion 113 from the upper surface of the base 115 is preferably applied to 0.05mm to 0.8mm.

On both sides of the base portion 115, in which the auxiliary coupling portion 116 is omitted, a corresponding portion is drawn inward so that both edge portions formed with the conductive pads 136 of the circuit board 130 to be mounted thereon are exposed. It is formed in a structure having a groove 118. The entrance depth of the inlet groove 118 may be formed to sufficiently expose the conductive pad 136 of the circuit board 130 inserted into the chip seating portion 113.

Reference numeral 117 denotes a coupling hole for coupling the light emitting device 100 to the outside.

In the illustrated example, the chip seat 113 is applied in a quadrangular shape, and may be formed in various shapes such as a circle.

The heat dissipation main substrate 110 is formed of a metal material having good thermal conductivity.

As a material of the heat dissipation main substrate 110, copper or a copper alloy such as brass, tungsten / copper, molybdenum / copper alloy may be applied.

Preferably, the heat dissipation main substrate 110 is formed in the structure shown in the above-described metal material and then plated with a nickel material. More preferably, the heat dissipation main substrate 110 is second plated with silver or gold on the nickel plating layer.

A plurality of light emitting diode chips 121 are mounted on the chip seating portion 113 of the heat dissipation main substrate 110.

The assembling hole 119 formed in the base 115 is for coupling the reflector 170, the insulating sheet 150, and the circuit board 130 to each other by a screw 190. .

The circuit board 130 has an insertion hole 132 through which the chip mounting part 113 can be inserted, and the conductive pad 136 is inserted through the insertion hole 132 of the heat dissipation main board 110. Is formed to be spaced apart from the base portion 115 to be exposed.

The circuit board 130 has a circuit pattern formed to electrically connect the LED chip 121 and the lead pin 127 for electrical connection with the outside.

The upper surface of the circuit board 130 has a chip bonding pad 133 formed around the insertion hole 132 and a conductive pad 136 formed on the exposed surface exposed by the inlet groove 118 of the heat dissipation main substrate 110. And a conductive pattern 134 connecting the chip bonding pad 133 and the conductive pad 136 to each other.

A through hole 136a for inserting the lead pin 127 is formed in the center of the conductive pad 136.

The chip bonding pad 133 is electrically coupled to the light emitting diode chip 121 by a gold wire 122.

In the state in which the circuit board 130 is inserted into the heat dissipation main board 110 through the chip mounting unit 113, the upper surface thereof is 0.1 to 1 larger than the upper surface of the light emitting diode chip 121 mounted on the chip mounting unit 113. It is desirable that the thickness be determined to be higher in millimeters.

In this case, the coating thickness of the phosphor 124 applied to the light emitting diode chip 121 is easily controlled to be less than 1 millimeter so that the coating thickness is not covered to the light emitting diode chip 121 but to the upper surface of the circuit board 130. Can be.

The circuit board 130 applies various known circuit boards, for example, a PCB board or a ceramic board.

Reference numeral 138 denotes an assembling hole formed at a position corresponding to the assembling hole previously formed in the base portion 115, and a thread line is omitted.

The circuit board 130 is coated with the conductive pads 136 and the chip bonding pads 133 with nickel or silver. The circuit board 130 may be electrically conductive in manufacturing as shown in FIG. Each of the pads 136 extends through the auxiliary pads 211, but is first manufactured in a structure having a common pad 212 for connecting the auxiliary pads 211 in common, followed by electroplating through the common pads 212. It is preferable to use what cut | disconnected both sides in the cutting line direction shown.

The insulating sheet 150 and the reflector 170 are sequentially stacked on the circuit board 130.

What is necessary is just to apply the insulating sheet 150 formed with the insulating material, and to apply the thing formed in the magnitude | size or more which can cover the bottom face of the reflector 170. FIG.

Reference numeral 154 denotes an assembly hole.

The reflector 170 is formed to focus light emitted from the light emitting diode chip 121.

That is, the reflector 170 has a light-transmitting hole 173 formed at the center thereof so that the light emitting diode chip 121 can be exposed, and a ring-shaped protrusion 171 protruding upward from a flange portion 172 at a predetermined distance. The inner side surface of the inner surface of the light emitting diode chip 121 is formed to have a curvature of the inner diameter becomes smaller as it proceeds from the top to the bottom so as to focus the light.

The reflector 170 is formed of a metal material having high reflectance and good heat dissipation. That is, the reflector 170 is formed by molding any one of silver, nickel or aluminum as an example.

 Alternatively, the reflector 170 may be formed by first forming a metal material and then coating at least the inner surface of the reflector with a material having high reflectivity. Here, as the coating material having a high reflectance, at least one of a reflection material group including silver, aluminum, and bright nickel is preferably applied.

Reference numeral 174 denotes an assembly hole formed in the flange portion 172.

Lens 180 is applied as an example of a cap for sealing and protecting the light emitting diode chip 121 is formed by molding the internal space of the reflector 170 with a transparent material such as silicon or epoxy.

Unlike this, of course, the separately manufactured lens may be bonded through the mounting groove 176 formed at the upper end of the reflector 170.

In the light emitting diode 100 having such a structure, light emitted from the light emitting diode chip 110 mounted on the heat dissipation main substrate 110 is focused by the reflector 170 and the lens 180 to emit light at a desired divergence angle. Can be provided.

The lead pin 127 is inserted through the through hole 136a of the circuit board 130 and bonded to the conductive pad 136 by soldering.

Lead pin 127 may be applied to the surface mounting type in addition to the pin type as shown.

The insulating spacer 129 is formed of an insulating material having a hollow, and a cylindrical shape partially covering the lead pin 127 coupled in the hollow is applied.

The light emitting device 100 having such a structure laminates the circuit board 130, the insulating sheet 150, and the reflector 170 on the heat dissipation main board 110, and then assembles the holes 138, 154, and 174. The screw 190 is coupled to the assembling hole 119 of the heat dissipation main substrate 110 through. Thereafter, the light emitting diode chip 121 mounted on the chip mounting unit 113 may be coupled to the chip bonding pad 133 by a wire 122 to form the phosphor 124 and the lens 180. In addition, the lead pin 127 is bonded by soldering through the through-hole 136a while the insulating spacer 129 is bonded to the circuit board 130 before the screw 190 is coupled, or the circuit board 130 is screwed. It may be joined after being joined by the 190.

The light emitting device having such a structure provides a heat dissipation path from the heat dissipation main substrate 110 to the reflector 170 by screws 190.

As described so far, the light emitting device according to the present invention has good assembly performance by screwing a large area metallic heat dissipation main board, a circuit board, and a reflector on which a large number of light emitting diode chips are mounted. Reflector is coupled through the heat dissipation main board and the screw provides an advantage to increase the heat dissipation ability.

Claims (4)

A heat sink main board having a chip seat portion formed to protrude at a predetermined height in a center portion and made of a metal material; A plurality of light emitting diode chips mounted on the chip seat; An insertion hole through which the chip seat part is penetrated is formed at the center thereof, and is mounted around the chip seat part of the heat dissipation main board, and penetrates up and down on an upper surface of the exposed part further extended to be exposed to the heat dissipation main board. A circuit board having a conductive pad formed concentrically with the through hole formed therein, and a chip bonding pad connected to the conductive pad to electrically connect the light emitting diode chip; A lead pin joined to the conductive pad through the through hole and extending downwardly in parallel with a side surface of the heat dissipation main substrate; An insulating spacer coupled to the lead pin at the bottom of the circuit board and formed of an insulating material; And a reflector made of a metal material bonded through an insulating sheet on the circuit board so as to focus a beam diffused from the light emitting diode chip to the periphery thereof. The light emitting device of claim 1, wherein the protruding height of the chip seat is 0.05 mm to 0.8 mm. The light emitting device of claim 2, wherein an upper surface of the circuit board is formed to be 0.1 to 1 millimeter higher than an upper surface of the light emitting diode chip mounted on the chip seat. According to claim 1 or claim 3, The reflecting mirror, the circuit board and the heat dissipation main board is formed with an assembling hole formed in a position corresponding to each other, the mutually coupled by a screw through the assembling hole Light emitting device, characterized in that.

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