KR100705315B1 - Mask device and method and apparatus for manufacturing organic light emitting device using same - Google Patents

Abstract

The present invention relates to a mask device which can prevent damage to the organic light emitting device and can be used semi-permanently, and a method and a manufacturing apparatus of the organic light emitting device using the same.

According to an exemplary embodiment of the present invention, a mask device includes: a first blocking portion blocking light emitted to each of the organic light emitting arrays, a second blocking portion blocking light emitted to the gap region except for the sealant, and light emitted from the sealant. A mask including a transmission portion for transmitting the light and a link portion connecting the first blocking portion and the second blocking portion; The mask is characterized in that the steel (steel) material.

Description

Mask apparatus and manufacturing method and apparatus for manufacturing organic electroluminescent device using same {MASKING APPARATUS AND METHOD AND APPARATUS FOR FABRICATING ORGANIC ELECTRO LUMINESCENCE DEVICE USING THE SAME}             

1 is a view schematically showing a conventional organic electroluminescent device.

2 is a view showing the bonding of the cap and the substrate on which the organic light emitting array is formed.

3A to 3F are views showing a method of manufacturing the mask device shown in FIG.

4 is a view showing a mask device for an organic electroluminescent device according to the present invention.

5A to 5C are views showing a method of manufacturing a mask device for an organic electroluminescent device according to the present invention.

    <Explanation of symbols for the main parts of the drawings>

1 Substrate 15 Organic Light Emitting Array

9: cap 10: sealant

24,124: mask 26: mask holder

18: cap tray 127: support portion

125: first blocking unit 130: second blocking unit

32,132: Align Mark

The present invention relates to an organic light emitting device, and more particularly, to a mask device which can prevent damage to the organic light emitting device and can be used semi-permanently, and a method and a manufacturing method of the organic light emitting device using the same.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes. Such flat panel displays include liquid crystal displays (hereinafter referred to as "LCDs"), field emission displays (FEDs), plasma display panels (hereinafter referred to as PDPs), and organic electric fields. Electo-luminescence ("EL") elements, etc. There are active researches to improve the display quality of such a flat panel display device and attempt to enlarge the screen.

Among them, PDP is attracting attention as the most advantageous display device for light and small size and large screen because of its simple structure and manufacturing process, but it has the disadvantages of low luminous efficiency, low luminance and high power consumption. On the other hand, an active matrix LCD having a thin film transistor (hereinafter referred to as a TFT) as a switching element has a disadvantage in that it is difficult to large screen due to the semiconductor process and consumes a lot of power due to the backlight unit. , Optical prism sheet, diffusion plate, etc. are characterized by high optical loss and narrow viewing angle.

On the other hand, EL devices are classified into inorganic EL devices and organic EL devices according to the material of the light emitting layer. The EL devices are self-luminous devices that emit light by themselves, and have fast response speed, high luminous efficiency, high brightness, and high viewing angle. Inorganic EL devices have higher power consumption and higher luminance than organic EL devices and cannot emit various colors of R, G, and B. On the other hand, the organic EL device is driven at a low DC voltage of several tens of volts, has a fast response speed, obtains high brightness, and emits various colors of R, G, and B, which is suitable for next-generation flat panel display devices.

1 is a cross-sectional view showing a conventional organic EL device.

The organic EL device shown in FIG. 1 includes an anode electrode 2 formed on the substrate 1, an insulating film 3 formed on the substrate 1 on which the anode electrode 2 is formed, a hole related layer 4, and a light emitting layer ( (Emitting Layer: EMI, 5), and an electron-related layer 6. The cathode electrode 7 is formed on the electron-related layer 6 as a metal electrode.

The anode electrode 2 and the insulating film 3 are sequentially formed on the substrate 1 by a material such as ITO, IZO, ITZO, or the like by photolithgraphy. In the hole related layer 4, a hole injection layer (HIL) and a water transport layer (HTL) are sequentially formed on the anode electrode 2. The light emitting layer 5 functions to emit light, but mostly also serves to transport electrons or holes. In the electron related layer 6, an electron transport layer (ETL) and an electron injection layer (EIL) are sequentially stacked on the light emitting layer 5.

The hole related layer 4, the light emitting layer 5, and the electron related layer 6 are formed by vacuum deposition in the case of a low molecular weight compound, and are formed by spin coating or inkjet printing in the case of a polymer compound. .

The cathode 7 may be made of Al, Ag, etc. having high reflectance, but in many cases, a metal such as aluminum (Al) is used.

In the organic EL device, when a driving voltage and a current are applied to the anode electrode 2 and the cathode electrode 7, the holes in the hole injection layer and the electrons in the electron injection layer proceed toward the light emitting layer 5, respectively. The material is excited. In this way, the visible light generated from the light emitting layer 5 displays an image or an image on the principle that the light exits through the transparent anode electrode 2.

On the other hand, the organic EL device has the property of easily deteriorating with moisture and oxygen. In order to solve this problem, an encapsulation process is performed to bond the substrate 1 and the cap 9 on which the organic EL array 15, such as the anode electrode 2, is formed, to the sealant 10 such as an epoxy resin. do. The cap 9 is filled with a getter 8 for absorbing moisture and oxygen in the center of the rear surface thereof, and a semipermeable membrane 11 is attached to fix the getter 8 and to enter moisture and oxygen. do.

2 is a view for explaining a bonding process of the substrate 1 and the cap 9 on which the organic EL array 15 is formed.

Referring to FIG. 2, a cap tray 18 on which a cap 9 is seated is positioned below a substrate 1 on which a plurality of organic EL arrays 15 are formed, and a cap 9 is disposed below the cap tray 18. The pushing device 20 is pushed to push the cap 9 so that) may be in close contact with the substrate 1.

A UV (ultraviolet) mask 24 having a metal pattern 22 formed on the substrate 1 to correspond to the organic EL array 15 formed on the substrate 1 is fixed by the mask holder 26. Done. The metal pattern 22 of the UV mask 24 prevents the organic EL array 15 from being exposed to ultraviolet rays UV irradiated onto the substrate 1 when the substrate 1 and the cap 9 are bonded together. The organic EL array 15 serves to prevent damage to organic materials and the like. Here, quartz or the like is used as the UV (ultraviolet) mask 24, and molybdenum (Mo), aluminum (Al) or the like is used as the metal pattern 24.

After the mask 24 and the cap tray 18 are positioned above and below the substrate 1, the cap 1 seated on the substrate 1 and the cap tray 18 is bonded by the sealant 10 and the ultraviolet light ( By curing the sealant 10 by UV), the cap 9 and the substrate 1 are firmly bonded.

Thus, the UV (ultraviolet) mask 24 used at the time of bonding of the board | substrate 1 and the cap 9 is manufactured by the following process.

First, using a quartz (Quartz), glass, etc. as a main raw material to prepare a substrate, processed to a desired size, surface treatment, and then through a cleaning process to remove the residues generated during processing as shown in Figure 3a To form (24).

Subsequently, a film form or a polymer-based coating film 25a, for example, a dry film resist (DFR: Dry Film Resist), is formed on the mask substrate 24 to form the entire surface, as shown in FIG. 3B. .

Subsequently, the coating film 25a is patterned by a photolithography process and an etching process to form a coating film 25 having a rectangular band shape as illustrated in FIG. 3C.

Thereafter, in order to avoid direct contact between the substrate 1 on which the organic EL array is formed and the mask 24 during bonding, a second blast process is performed to remove residues generated after sandblasting as shown in FIG. 3D. After this is performed, an alignment mark 32 is formed in one region of the mask substrate 24 using a laser as shown in FIG. 3E.

Thereafter, molybdenum (Mo), aluminum (Al), etc. are deposited on the mask substrate 24 using a thin film deposition process such as sputtering, PECVD, vacuum deposition, and the like, and the remaining rectangular band-shaped coating film 25 is removed. As a result, as shown in FIG. 3F, the mask 24 having the metal pattern 22 is formed. Here, the metal pattern 22 serves to block ultraviolet rays, and the rectangular band region 27 may emit ultraviolet rays (UV) to the sealant 10 when the substrate 1 and the cap 9 are bonded together. ) To pass.

On the other hand, the ultraviolet mask 24 is applied to the metal pattern 22 when applying other processes, such as inadvertent operation or contact with the substrate 1 when the cap 9 and the substrate 1 are bonded or aligned. Scratch occurs. At this time, ultraviolet rays (UV) are irradiated to the organic EL array through a region where scratches are generated, thereby causing a problem that the organic EL array 15 is damaged. In addition, blocking ultraviolet rays (UV) for a long time causes a problem of deterioration of the characteristics of the metal pattern 22.

Accordingly, an object of the present invention relates to a manufacturing apparatus for a sustained electroluminescent element which can be used semi-permanently while preventing damage to the organic electroluminescent element.

In addition, another object of the present invention relates to a manufacturing method of a manufacturing apparatus for an organic light emitting device that is easy to manufacture.

In order to achieve the above object, the mask device according to the present invention is a first blocking portion for blocking the light irradiated to each of the organic light emitting array, a second blocking portion for blocking the light irradiated to the gap region except the sealant A mask including a transmission part for transmitting the light irradiated to the sealant and a link part connecting the first blocking part and the second blocking part; The mask is characterized in that the steel (steel) material.

The first and second blocking parts and the link part may be integrated.

In addition to the seating of the mask, characterized in that it further comprises a support for supporting the mask.

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The mask is characterized in that the bonded portion by at least one of the adhesive and the epoxy resin.

The method of manufacturing an organic light emitting display device according to the present invention includes a first blocking portion for blocking light irradiated to each of the organic light emitting arrays, a second blocking portion for blocking light irradiated to the gap region except for the sealant, Arranging a mask of a steel material on the substrate, the mask including a transmission part for transmitting the light irradiated to the sealant and a link part connecting the first blocking part and the second blocking part; Bonding a plurality of caps for packaging each of the organic light emitting arrays to the sealant; Irradiating the light onto the substrate through the mask to bond the cap to the substrate.

An apparatus for manufacturing an organic light emitting display device according to an embodiment of the present invention includes a first blocking unit for blocking light irradiated to each of the organic light emitting arrays, a second blocking unit for blocking light irradiated to the gap region except for the sealant, A mask including a transmission part for transmitting the light irradiated to the sealant and a link connecting the first blocking part and the second blocking part; A cap pushing device for contacting the sealant with a plurality of caps for packaging each of the organic light emitting arrays; An exposure apparatus for bonding the cap and the substrate by irradiating the light onto the substrate through the mask; The mask is characterized in that the steel material.

In addition to the seating of the mask, characterized in that it further comprises a support for supporting the mask.

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The mask is characterized in that the bonded portion by at least one of the adhesive and the epoxy resin.

Other objects and features of the present invention in addition to the above object will be apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 4 to 5.

4 is a view showing a mask device of an organic EL element according to the present invention.

The mask device of the organic EL element illustrated in FIG. 4 includes a mask 124 for irradiating ultraviolet (UV) light to the sealant upon bonding of the substrate and the cap on which the organic EL array is formed, and a support part for supporting the mask 124. 127 is provided.

The mask 124 may include a first blocking part 125 for blocking the irradiation of ultraviolet rays (UV) to the organic EL array, a transmitting part 126 for transmitting ultraviolet rays (UV), a transmitting part 126, and a first blocking part ( The second blocking unit 130 except for 125, and the link unit 128 for connecting the first and second blocking units 125 and 130 are provided.

The first blocking portion 124 of the mask 130 corresponds to the organic EL array and the transmissive portion 126 corresponds to the formation region of the sealant for bonding the cap and the substrate. In addition, an alignment mark 132 is formed outside the second blocking unit 130 of the mask 130. The alignment mark 132 is formed at the same time when the mask 124 is directly formed without a separate process using a laser.

The mask 124 having such a configuration is adhered to the support 127 by an adhesive or an ultraviolet curing epoxy. As the mask 124, a steel-based material containing 36% or more of nickel (Ni) is used, and the support part 127 is made of quartz, glass, or the like.

The mask 124 having the above-described configuration is formed of a strong steel-based material containing carbon, nickel (Ni), etc., unlike the related art, thereby preventing contact or alignment between the substrate and the substrate when the cap and the substrate are bonded. Scratch or the like does not occur when other processes are applied. In addition, by forming the mask 124 using a strong steel-based material it can be used semi-permanently, such that even when irradiated with a plurality of ultraviolet rays (UV) does not change or deteriorate characteristics.

5A to 5C, a method of manufacturing a mask device for an organic light emitting display device according to the present invention is as follows.

First, the support 127 is formed as shown in FIG. 5A through a cleaning process for preparing a substrate using a quartz, glass, or the like as a main raw material, processing the substrate to a desired size, and removing the residues generated during processing. .

Thereafter, the link unit 128, which aligns the first and second blocking units 125 and 130, the transmission unit 126, and the first and second blocking units 125 and 130 by a separate process using a steel-based material, is aligned. The mask 124 having the mark 132 is formed. Thereafter, the mask 124 and the support 127 are adhered to the mask 124 and the support 127 using an adhesive or ultraviolet (UV) curable epoxy.

In the method of manufacturing an organic light emitting display device according to the present invention, the mask device as shown in FIG. 4 is aligned on an upper portion of a substrate on which an organic EL array is formed, and a plurality of caps for packaging each organic light emitting array are bonded together. In order to align the cap tray having a plurality of caps seated on the lower portion of the substrate on which the organic light emitting array is formed. Here, ultraviolet rays (UV) transmitted through the transmission part 128 of the mask 124 are irradiated to the sealant for bonding the cap and the substrate on which the organic light emitting array is formed. As a result, the sealant is cured to firmly bond the substrate and the cap. Thereby, a cap for protecting the organic EL array is packaged.

An apparatus for manufacturing an organic light emitting display device according to the present invention includes a mask device shown in Figs. 4, 5a to 5c, a cap pushing device for pushing a plurality of caps for packaging each of the organic light emitting array through a sealant; And an exposure apparatus for irradiating light (for example, ultraviolet rays) to the sealant for adhering the cap and the substrate through the mask.

As described above, the mask device according to the present invention and the manufacturing method and manufacturing apparatus of the organic light emitting device using the same are first and second blocking parts 125 and 130 and the transmission part 126 by a separate process using a steel-based material. And a linking portion 128 connecting the first and second blocking portions, and a support portion 127 provided separately from the mask 124 in which the alignment mark 132 is integrated.

Accordingly, the manufacturing process is simplified in comparison with the related art, and the mask 124 is prevented by forming a mask 124 made of a steel-based material resistant to impact due to inadvertent operation or contact between the cap and the substrate. The organic EL array is protected from damage. In addition, since the mask (UV) is formed of a solid steel-based material, even if the ultraviolet rays are blocked for a long time, the characteristics of the mask are not deteriorated.

As described above, the mask device according to the present invention and the manufacturing method and manufacturing apparatus of the organic light emitting device using the same are connected to the blocking portion, the transmission portion, the first and second blocking portion by a separate process using a steel-based material. And a link portion, a mask in which the alignment mark is integrated, and a support portion for supporting the mask. Accordingly, it is easy to manufacture compared to the conventional, and by forming a mask made of a solid steel-based material, scratches, etc. are not generated even if there is inadvertent or small impact on the work, thereby preventing damage to the organic EL array due to ultraviolet rays and for a long time. Blocking does not deteriorate the characteristics of the mask.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (10)

In the mask device for masking a desired portion with respect to the substrate formed by a plurality of organic electroluminescent array with a predetermined gap and bonded through a cap and a sealant for packaging the organic electroluminescent array, A first blocking unit for blocking the light irradiated to each of the organic light emitting arrays, a second blocking unit for blocking the light irradiated to the gap region except the sealant, a transmission unit for transmitting the light irradiated to the sealant, and the first blocking unit A mask including a link portion connecting the first blocking portion and the second blocking portion; The mask device, characterized in that the steel (steel) material. The method of claim 1, And the first and second blocking portions and the link portion are integrated. delete The method of claim 1, And a support part for supporting the mask while the mask is seated. The method of claim 4, wherein And the mask is bonded by at least one of the support and the adhesive and the epoxy resin. In the method of manufacturing an organic light emitting device using a substrate formed with a plurality of organic light emitting array with a predetermined gap and bonded through a cap and a sealant for packaging the organic light emitting array, A first blocking unit for blocking the light irradiated to each of the organic light emitting arrays, a second blocking unit for blocking the light irradiated to the gap region except the sealant, a transmission unit for transmitting the light irradiated to the sealant, and the first blocking unit Aligning a mask of steel-based material on the substrate, the mask including a link portion connecting the first blocking portion and the second blocking portion; Bonding a plurality of caps for packaging each of the organic light emitting arrays to the sealant; Irradiating the light onto the substrate through the mask to bond the cap to the substrate. In the organic electroluminescent device manufacturing apparatus using a substrate formed with a plurality of organic electroluminescent array with a predetermined gap and bonded through a cap and a sealant for packaging the organic electroluminescent array, A first blocking unit for blocking the light irradiated to each of the organic light emitting arrays, a second blocking unit for blocking the light irradiated to the gap region except the sealant, a transmission unit for transmitting the light irradiated to the sealant, and the first blocking unit A mask including a link connecting the first blocking portion and the second blocking portion; A cap pushing device for contacting the sealant with a plurality of caps for packaging each of the organic light emitting arrays; An exposure apparatus for bonding the cap and the substrate by irradiating the light onto the substrate through the mask; The mask manufacturing apparatus of the organic light emitting device, characterized in that the steel material. delete The method of claim 7, wherein In addition to the mounting of the mask, the organic light emitting device manufacturing apparatus further comprises a support for supporting the mask. The method of claim 9, The mask is an apparatus for manufacturing an organic light emitting display device, characterized in that the support is bonded by at least one of an adhesive and an epoxy resin.

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