KR100696210B1 - Optical path changer and optical backplane device using the same - Google Patents

Abstract

The present invention relates to an optical path changer and an optical backplane apparatus using the same, and includes a backplane substrate having a first optical waveguide layer having at least one optical waveguide therein and having insertion grooves to expose portions of both sides of the first optical waveguide layer. And a system substrate having a second optical waveguide layer having at least one optical waveguide formed therein and coupled to an upper side of the insertion groove, and portions of both sides of the first optical waveguide layer having a curvature radius of 2 mm to 3 mm. The optical path is directly connected between the first and second optical waveguide layers made of a flexible organic-inorganic polymer material, respectively, being screwed into the insertion grooves of the backplane substrate so that the path of the optical signal is vertically changed. By including an optical path changer provided so that the connection between the optical waveguide embedded in each substrate when the backplane substrate and the system substrate is connected It is possible to realize the connection more efficiently, to reduce the optical parts, simplify the packaging process, and to reduce the cost, and to reduce the number of connection parts to reduce the number of connections, thereby improving the characteristics of the optical communication system. It has an effect.

Description

Optical path change device and Electro-optical circuit board apparatus using the same}

1 is a cross-sectional view for explaining the optical backplane device using the optical path changer according to an embodiment of the present invention.

Figure 2 is a plan view for explaining a backplane substrate applied to the present invention.

Figure 3 is an enlarged perspective view for explaining a first optical waveguide layer of the backplane substrate applied to the present invention.

Figure 4 is an exploded perspective view for explaining the applied light path changer according to an embodiment of the present invention.

5 is a perspective view for explaining a light path changer according to an embodiment of the present invention.

Figure 6 is an exploded perspective view for explaining an optical path changer according to another embodiment of the present invention.

7 is a perspective view illustrating a light path changer according to another embodiment of the present invention.

8A to 8C are cross-sectional views illustrating a method of manufacturing a backplane substrate applied to an embodiment of the present invention.

FIG. 9 is a cross-sectional view illustrating a method of removing a first optical waveguide layer exposed after inserting an optical path changer into an insertion groove of a backplane substrate according to an embodiment of the present invention. FIG.

*** Explanation of symbols on main parts of drawing ***

100: backplane substrate, 110: first optical waveguide layer,

111a: core, 111: core layer,

112: cladding layer, 113: protective layer,

120a and 120b: insertion hole, 120a 'and 120b': insertion groove,

130: seating groove, 200a and 200b: system board,

210a and 210b: second optical waveguide layer, 220: surface emitting laser,

230: light receiving element, 300a and 300b: light path changer,

310: main body portion, 311: first guide groove,

311 ': vertical guide groove, 312a and 312b: first projection,

313a and 313b: coupling groove, 320: auxiliary body,

321: second guide groove, 321 ': horizontal guide groove,

322: third guide groove, 322 ': curved guide groove,

323a and 323b: second projections, 324a and 324b: coupling holes,

330a and 330b: screw

The present invention relates to an optical path changer and an optical backplane apparatus using the same, and more particularly, a backplane substrate and a system substrate each having an optical waveguide layer having at least one optical waveguide formed therein are vertically coupled to each other. By inserting and fixing the optical path changers into insertion grooves formed at both ends of the optical waveguide layer having the built-in flexibility, the optical signal emitted from the optical waveguide of the system substrate is changed vertically and transmitted directly to the optical waveguide of the backplane substrate. The present invention relates to an optical path changer and an optical backplane device using the optical path changer that can more efficiently implement optical path connection between optical waveguides embedded in each substrate when connecting a substrate and a system substrate.

Recently, in order to transmit high-speed and high-capacity signals in the system according to the demand for high-speed and large-capacity of the optical communication system, a micro strip line implemented by etching copper foil on a conventional printed circuit board (hereinafter referred to as 'PCB') has been developed. Was used.

However, such a microstrip line is not easy to solve the signal bottleneck at high speed, so the optical PCB technology, that is, the optical backplane (Electro-optical Circuit) is a method of transmitting an optical signal by mounting an optical waveguide on the PCB EOCB) is being developed.

In the optical backplane (EOCB) device, the optical path connection between the optical PCBs is mainly implemented by combining various optical systems such as a micro lens array, a ball lens, or a mirror. In addition, an optical connector using a space on a free space or an optical fiber is assembled.

In this case, the combination of the optical system such as the micro lens array, the ball lens or the mirror is most commonly used for the optical path connection between the optical PCB, but the number of optical components increases, the optical loss increases, the lens Precise alignment is required to maintain the optical axis of the optical component, such as the greatest difficulty in packaging, which is difficult to lower the price.

In addition, the optical path connection using the free space is sensitive to the loss due to the spread of light and the alignment of the optical axis due to the constant free space distance between the substrates, and sensitive to the difficulty of maintaining the precise spacing between the substrates in an external environment such as vibration during use. There is a problem that the characteristics can be changed.

In addition, the optical path connection between the optical PCB using the optical connector is to connect the optical fiber to the back of the optical PCB by making the optical fiber separately from the optical PCB in the form of a foil (Foil), not the optical fiber connection between the optical PCB containing the optical waveguide. That is, by using the conventional commercially available optical connector technology is not significantly different from the technology applied to the existing optical communication system, there is a problem in the use of the optical connector to be connected again after the connection of the optical PCB.

In addition, since the optical circuit board in the form of a foil is directly laminated on the rear surface of the optical PCB, there is a problem that it is difficult to apply to a multilayer optical PCB process, thereby increasing the process steps and complexity.

The present invention has been made to solve the above-described problems, an object of the present invention is a backplane substrate and a system substrate, each having an optical waveguide layer in which at least one optical waveguide is formed, are vertically coupled to each other, embedded in the backplane substrate Optical signals emitted from the optical waveguide of the system substrate by inserting and fixing the optical path changers so that both ends of the flexible optical waveguide layer embedded in the backplane substrate are bent at a predetermined curvature radius in insertion grooves formed at both ends of the optical waveguide layer having flexibility. By changing the path of the vertical path and transmitting it directly to the optical waveguide of the backplane substrate, the connection between the optical waveguides embedded in each substrate can be more efficiently realized when the backplane substrate and the system substrate are connected, and the optical parts are greatly reduced in the packaging process. Price can be simplified and connection parts can be simplified. By reducing the number to provide an optical backplane device using changes to reduce the optical path loss in accordance with the number of connections that can improve the characteristics of the optical communication system, and group them.

In order to achieve the above object, the first aspect of the present invention, in the optical backplane device comprising a backplane substrate and a system substrate, each containing a first and second optical waveguide layer made of a flexible organic-inorganic polymer material, The optical signal is inserted into the backplane substrate by screwing, and a portion of both sides of the first optical waveguide layer is bent at a radius of curvature of 2 mm to 3 mm to allow direct optical connection between the first and second optical waveguide layers. It is to provide a light path changer, characterized in that the path is provided to be changed vertically.

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Preferably, the optical path changer is configured to receive the optical signal emitted from the second optical waveguide layer of any one of the system substrates directly to one end of the first optical waveguide layer, and to simultaneously receive the path of the received optical signal. In order to vertically change, and to change the path of the optical signal transmitted to the other end of the first optical waveguide layer again vertically to be opposite to each other so as to be directly transmitted to one end of the second optical waveguide layer of the other system substrate.

Preferably, the optical path changer is formed in the same shape as the insertion groove to be inserted into the insertion groove formed on the backplane substrate, respectively, so that both sides of the first optical waveguide layer are horizontally inserted into one side thereof. A horizontal guide groove is formed, and a curved guide groove extending in a vertical direction to the end of the horizontal guide groove is formed so that the first optical waveguide layer inserted along the horizontal guide groove bends at a constant curvature radius. A vertical guide groove is formed to extend to the end of the groove so that the first optical waveguide layer is exposed on a side surface perpendicular to the one side surface.

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According to a second aspect of the present invention, there is provided a semiconductor device comprising: a backplane substrate having a first optical waveguide layer having at least one optical waveguide formed therein and having insertion grooves to expose portions of both sides of the first optical waveguide layer; A system substrate having a second optical waveguide layer having at least one optical waveguide embedded therein and coupled to an upper side of the insertion groove; And a portion of both sides of the first optical waveguide layer is inserted into the insertion groove of the backplane substrate by screwing so that the path of the incident optical signal is vertically bent with a curvature radius of 2 mm to 3 mm, and the organic-flexible organic- An optical backplane device using an optical path changer provided to directly connect an optical path between the first and second optical waveguide layers made of an inorganic polymer material.

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Preferably, the first and second optical waveguide layer comprises: a core layer having a plurality of cores arranged in a line; A cladding layer formed to surround each core; And a protective layer formed on the surface of the clad layer.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, embodiments of the present invention illustrated below may be modified in many different forms, and the scope of the present invention is not limited to the embodiments described below. The embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art.

1 is a cross-sectional view illustrating an optical backplane device using an optical path changer according to an embodiment of the present invention, FIG. 2 is a plan view illustrating a backplane substrate applied to the present invention, and FIG. 3 is applied to the present invention. It is an enlarged perspective view for demonstrating the 1st optical waveguide layer of a backplane substrate.

1 to 3, an optical backplane apparatus according to an exemplary embodiment of the present invention includes a backplane substrate 100, a system substrate 200a and 200b, and optical path changers 300a and 300b. .

Here, the backplane substrate 100 includes a printed circuit board (PCB) stacked in multiple layers, and includes a first optical waveguide layer 110 having at least one optical waveguide formed therein. At both ends of the optical waveguide layer 110, insertion grooves 120a 'and 120b' are formed to insert and fix the optical path changers 300a and 300b.

In addition, as shown in FIG. 3, the first optical waveguide layer 110 includes a core layer 111 in which a plurality of cores 111a for transmitting an optical signal are arranged in a row, and the optical signal leaks out. Clad layer 112 is formed to surround each core (111a) so as not to go out, and the protective layer 113 formed to protect the surface of the clad layer 112, that is, the upper and lower parts from various external use environment. . In this case, the protective layer 113 is preferably formed of, for example, a material such as a polyimide resin.

In addition, the insertion grooves 120a 'and 120b' are preferably implemented in a quadrangular shape to more stably insert and fix the optical path changers 300a and 300b, but are not limited thereto. Or may be variously implemented in a polygonal shape or the like. In addition, the backplane substrate 100 is preferably provided with a plurality of optical wiring and electrical wiring. Meanwhile, in order to fix the optical path changers 300a and 300b coupled to the first optical waveguide layer 110 to the backplane substrate 100, the optical path changers 300a and 300b may be fixedly coupled using a conventional adhesive or a screw. .

The system substrates 200a and 200b are vertically coupled to upper sides of the insertion grooves 120a 'and 120b' formed in the backplane substrate 100, respectively, and have a second optical waveguide formed thereon. The optical waveguide layers 210a and 210b are embedded. At this time, the coupling between the backplane substrate 100 and the system substrates 200a and 200b is preferably aligned using a conventional guide groove or guide pin, and fixedly coupled to a lever or the like.

Meanwhile, the second optical waveguide layers 210a and 210b have the same structure, function, and effect as the first waveguide layer 110, and the detailed description thereof will be described with reference to the first waveguide layer 110. do.

The system substrate 200a is equipped with a surface emission laser (VCSEL) 220 for emitting an optical signal having an arbitrary wavelength and transmitting it to the second optical waveguide layer 210a. A light receiving element 230 is installed to process the incident optical signal into an electrical signal.

Meanwhile, the first and second optical waveguide layers 110 and 210a and 210b may be formed of a polymer material having excellent light transmittance and flexibility in a communication wavelength band of about 850 nm, for example, an organic-inorganic polymer material. It may be produced by an embossing process or a photolithography process.

In this case, the organic-inorganic polymer material is, for example, low density polyethylene (Low Density Polyethylene), ultra low density polyethylene (LLDPE), high density polyethylene (High Density Polyethylene), polypropylene (Polypropylene), amide (Amide) nylon 6 (Nylon) 6), Nylon 66 (Nylon 66), Nylon 6/9 (Nylon 6/9), Nylon 6/10 (Nylon 6/10), Nylon 6/12 (Nylon 6/12), Nylon 11, Nylon 12, Polystyrene (Polystyrene), polyethylene terephthalate, polybutyl terephthalate, polyvinyl chloride, polyvinylidene chloride, polycarbonate, cellulose acetate or poly (meth) It is preferably made of any one of (Poly (meth) acrylate), any one selected from these in consideration of thermal properties and mechanical properties among these materials It may be made by a combination thereof.

4 is an exploded perspective view for describing the light path changer according to an embodiment of the present invention, and FIG. 5 is a combined perspective view for explaining the light path changer according to an embodiment of the present invention.

4 and 5, light path changers 300a and 300b according to an embodiment of the present invention are inserted into and respectively inserted into insertion grooves 120a 'and 120b' of the backplane substrate 100. As to vertically change the path of the signal, the main body portion 310 and the auxiliary body portion 320 is coupled to the main body portion 310 is fixed.

Here, the main body portion 310 is formed in the same shape so as to be inserted into the insertion grooves (120a 'and 120b') of the backplane substrate 100, respectively, the first optical waveguide layer 110 in the central portion thereof The first protrusions 312a and 312b having an 'L' shape are protruding integrally on both sides of one side thereof so as to form the first guide grooves 311 for guiding in the horizontal and vertical directions. In this case, predetermined coupling grooves 313a and 313b are formed in one surface of the first protrusions 312a and 312b and the main body 310, respectively.

The first optical waveguide layer 110 is inserted into the lower surface of the auxiliary body part 320 to form a second guide groove 321 for guiding in the horizontal direction. 'A' on both sides of the first optical waveguide layer 110 to form a third guide groove 322 for guiding the first optical waveguide layer 110 to bend to a certain radius of curvature (for example, about 2 mm to 3 mm). The second protrusions 323a and 323b in the shape of protrusions are formed integrally with each other. In this case, predetermined coupling holes 324a and 324b are formed at both sides of the auxiliary body 320 and the second protrusions 323a and 323b, respectively.

The auxiliary body 320 is inserted into the conventional screw 330a and 330b into the coupling holes 324a and 324b and the coupling grooves 313a and 313b, respectively. 312a and 312b).

That is, the auxiliary body 320 is fixedly coupled to the first protrusions 312a and 312b of the main body 310, so that the first to third guide grooves 311, 321, and 322 are optical paths. The horizontal guide groove 321 ′ formed to open on the lower surfaces of the changers 300a and 300b and the first optical waveguide layer 110 inserted along the horizontal guide groove 321 ′ are bent at a constant curvature radius. A curved guide groove 322 'formed to extend in a vertical direction to an end of the horizontal guide groove 321', and an end of the curved guide groove 322 'to extend the optical path changers 300a and 300b. The vertical guide groove 311 ′ formed to expose the first optical waveguide layer 110 on an upper surface of the upper surface of the panel.

In addition, when the main body 310 and the auxiliary body 320 is fixedly coupled, the vertical guide groove 311 ′ is formed to be fixed to the end of the first optical waveguide layer 110 is inserted, Other portions, that is, the horizontal guide groove 321 ′ and the curved guide groove 322 ′ may be formed so as not to be fixed for the buffering role due to the bending deformation of the first optical waveguide layer 110.

Each of the optical path changers 300a and 300b according to the exemplary embodiment of the present invention configured as described above may output an optical signal emitted from the second optical waveguide layer 210a of the system substrate 200a to the backplane substrate 100. The first optical waveguide layer 110 is directly transmitted to one end of the first optical waveguide layer 110, and the path of the received optical signal is vertically changed and transmitted to the other end of the first optical waveguide layer 110 of the backplane substrate 100. It is preferable that the paths of the optical signals to be vertically changed again so as to face each other so as to be directly transmitted to one end of the second optical waveguide layer 210b of the other system substrate 200b.

As such, both ends of the first optical waveguide layer 110 embedded in the backplane substrate 100 are bent to have a predetermined radius of curvature so that the optical path changers 300a and 300b face each other so as to face each other. In addition, the optical path connection between each of the first and second optical waveguide layers 110 (210a and 210b) embedded in the backplane substrate 100 and the system substrates 200a and 200b may be more efficiently implemented. Significantly reduced parts can simplify packaging processes, resulting in lower cost.

On the other hand, the horizontal guide grooves 321 ′ formed in the optical path changers 300a and 300b according to the embodiment of the present invention are formed to be open at lower ends of one side surfaces of the optical path changers 300a and 300b. The horizontal guide groove 321 ′ may be formed on any one side of the optical path changers 300a and 300b.

In addition, although the curvature radius of the curved guide groove 322 ′ formed in the optical path changers 300a and 300b according to the embodiment of the present invention is formed in the auxiliary body part 320, the present invention is not limited thereto. It may be formed on at least one of the body portion 310 and the auxiliary body portion 320.

In addition, the light path changers 300a and 300b according to an embodiment of the present invention are coupled to the main body part 310 and the auxiliary body part 320, but are not limited thereto. 310 and the auxiliary body 320 may be integrally formed.

In addition, the main body 310 and the auxiliary body 320 is fixed by screwing, but is not limited thereto, and may be fixed using a conventional adhesive or a fixing pin.

6 is an exploded perspective view for explaining an optical path changer according to another exemplary embodiment of the present invention, and FIG. 7 is a combined perspective view for explaining an optical path changer according to another exemplary embodiment of the present invention.

6 and 7, light path changers 400a and 400b according to another embodiment of the present invention are inserted into and respectively inserted into the insertion grooves 120a 'and 120b' of the backplane substrate 100. As to vertically change the path of the signal, the main body portion 410 and the auxiliary body portion 420 which is fixed to the main body portion 410 is formed.

Here, the main body 410 is formed in the same shape so as to be inserted into the insertion grooves (120a 'and 120b') of the backplane substrate 100, respectively, the first optical waveguide layer 110 in the central portion thereof The third protrusions 412a and 412b having an 'L' shape are protruded integrally on both sides of one side thereof so as to form the fourth guide grooves 411 for insertion in the horizontal and vertical directions. In this case, predetermined coupling grooves 413a and 413b are formed in one surface of the third protrusions 412a and 412b and the main body 410, respectively.

A fifth guide groove 421 is formed on one side of the auxiliary body 420 to guide the first optical waveguide layer 110 inserted in the horizontal direction in a vertical direction. 422a and 422b are formed, respectively. The auxiliary body part 420 inserts the usual screws 430a and 430b into the coupling holes 422a and 422b and the coupling grooves 413a and 413b, respectively, to form third protrusions of the main body 410. 412a and 412b).

That is, the auxiliary body part 420 is fixedly coupled to the third protrusions 412a and 412b of the main body part 410, so that the fourth and fifth guide grooves 411 and 421 have an 'L' shape. That is, the optical path changer 400a extends perpendicularly to an end of the horizontal guide groove 411 'and the horizontal guide groove 411' formed to be open at the lower end of one side of the optical path changers 400a and 400b. And a vertical guide groove 421 'formed on a surface perpendicular to one side of 400b.

In addition, when the main body portion 410 and the auxiliary body portion 420 is fixedly coupled, the vertical guide groove 421 ′ is formed so that the end of the first optical waveguide layer 110 inserted thereon is fixed. Other portions, that is, the lower side of the vertical guide groove 421 'and the horizontal guide groove 411' are formed so as not to be fixed for the buffering role due to the bending deformation of the first optical waveguide layer 110. This is preferred.

Meanwhile, the light path changers 400a and 400b according to another embodiment of the present invention have the same installation, operation, and effect as the light path changers 300a and 300b according to the embodiment of the present invention. Detailed description thereof will be referred to an embodiment of the present invention.

On the other hand, the light path changers 300a and 300b according to the present invention (400a and 400b) is preferably made of a polymer material capable of metal processing or molding.

Hereinafter, the operation of the optical backplane device using the optical path changer according to an embodiment of the present invention having the above-described configuration will be described in detail.

Referring to FIG. 1, first, an optical signal generated by the surface emission laser 220 mounted on the system substrate 200a passes through the second optical waveguide layer 210a to form a first surface of the backplane substrate 100. The optical waveguide layer 110 is directly transmitted to one end.

The transmitted optical signal is vertically changed along the first optical waveguide layer 110 bent by the optical path changer 300a and transmitted to the other side of the first optical waveguide layer 110, and the transmission is performed. The converted optical signal is vertically changed again along the first optical waveguide layer 110 bent by the optical path changer 300b.

The vertically changed optical signal is directly transmitted to one end of the second optical waveguide layer 210b of another system substrate 200b, and the transmitted optical signal is along the second optical waveguide layer 210b. The light is transferred to the light receiving element 230 mounted at 200b and processed as an electric signal.

Hereinafter, a method of manufacturing an optical backplane device using an optical path changer according to an embodiment of the present invention having the above-described configuration will be described in detail.

8A to 8C are cross-sectional views illustrating a method of manufacturing a backplane substrate applied to an embodiment of the present invention, and FIG. 9 is a view illustrating inserting an optical path changer into an insertion groove of a backplane substrate according to an embodiment of the present invention. It is sectional drawing for demonstrating the method of removing the exposed 1st optical waveguide layer.

First, a backplane substrate having a first optical waveguide layer 110 having at least one optical waveguide formed therein and having insertion grooves 120a 'and 120b' exposed at both sides of the first optical waveguide layer 110. 100).

That is, referring to FIG. 8A, first, an upper PCB 100a and a lower PCB 100b stacked in multiple layers are manufactured. Forming a recess 130 for protecting the first optical waveguide layer 110 is formed on the lower surface of the upper PCB (100a), the optical path changer (300a and 300b) on both sides of the mounting groove 130 ) Is formed to form predetermined insertion holes 120a and 120b. In this case, the insertion holes 120a and 120b may be formed by, for example, drilling or laser processing.

8B and 8C, after placing the first optical waveguide layer 110 on the lower PCB 100b, the first optical waveguide layer 110 is seated in the seating groove 130. Insert grooves for inserting and fixing the optical path changers 300a and 300b by coupling the upper PCB 100a by, for example, pressure bonding at a high temperature so that portions of both sides of the exposure holes 120a and 120b are exposed. 120a 'and 120b') are formed.

Next, the system substrates 200a and 200b having the second optical waveguide layers 210a and 210b having at least one optical waveguide formed therein are fabricated, and both sides of the first optical waveguide layer 110 have a constant curvature radius. The optical path changers 300a and 300b are inserted into and fixed to the insertion grooves 120a 'and 120b' of the backplane substrate 100, respectively, so that the paths of the incident optical signals are vertically changed.

In this case, the first optical waveguide layer 110 is formed of a flexible polymer material, and then slightly lifted both ends of the first optical waveguide layer 110 by using a worker's hand or other tool. The first optical waveguide layer 110 is exposed to the vertical guide groove 311 ′ through the curved guide groove 322 ′ by being inserted into the horizontal guide groove 321 ′ of the optical path changers 300a and 300b. Preferably, the optical path changers 300a and 300b are inserted into and fixed to the insertion grooves 120a 'and 120b', respectively.

Referring to FIG. 9, when the optical path changers 300a and 300b are inserted into and fixed to the insertion grooves 120a 'and 120b', respectively, both ends of the first optical waveguide layer 110 are exposed. The first optical waveguide layer 110 is removed using, for example, a polymer processing knife 500 and the like, and the cross section is cross-sectional processed using, for example, a portable polishing tool or the like.

Thereafter, the system substrates 200a and 200b are inserted into the grooves 120a 'and 120b' of the backplane substrate 100 so that the first and second optical waveguide layers 110 and 210a and 210b are directly connected to each other. By vertically coupling to the upper side, the optical backplane device according to an embodiment of the present invention is completed.

Although a preferred embodiment of the optical path changer and the backplane device using the same according to the present invention has been described above, the present invention is not limited thereto, and the scope of the claims and the detailed description of the invention and the accompanying drawings are various. It is possible to carry out the transformation to this also belongs to the present invention.

For example, in an embodiment of the present invention, the first optical waveguide layer 110 of the backplane substrate 100 is inserted into the optical path changers 300a and 300b, but is not limited thereto. The backplane substrate 100 Insertion grooves 120a 'and 120b' formed in the second optical waveguide layer 110 are formed so that both ends of the first optical waveguide layer 110 do not protrude and partially protrude outwardly of the system substrates 200a and 200b. 210a and 210b and inserting the protruding second optical waveguide layers 210a and 210b into optical path changers 300a and 300b, and then inserting the optical path changers 300a and 300b into the insertion grooves. 120a 'and 120b'), respectively.

According to the optical path changer and the optical backplane apparatus using the same as described above, a backplane substrate and a system substrate each having an optical waveguide layer having at least one optical waveguide embedded therein are vertically coupled to each other and connected to the backplane substrate. The path of the optical signal emitted from the optical waveguide of the system substrate by inserting and fixing the optical path changers so that both ends of the first optical waveguide layer bends at a constant curvature radius into insertion grooves formed at both ends of the first optical waveguide layer having the built-in flexibility. Is changed vertically and transmitted directly to the optical waveguide of the backplane substrate, so that when the backplane substrate and the system substrate are connected, the optical path connection between the optical waveguides embedded in each substrate can be realized more efficiently, and the optical parts are greatly reduced in the packaging process. Price can be simplified and the number of connecting parts can be reduced. There is an advantage to improve the characteristics of the optical communication system by reducing the loss due to the number of connections.

In addition, according to the present invention, by directly connecting between the backplane substrate and the optical waveguide layer embedded in the system substrate, it is possible to maintain the connection with a more stable light beam, there is an advantage that can improve the optical characteristics of the system.

In addition, according to the present invention, the optical path changers are installed to face each other, so that the optical path connection between the optical waveguides embedded in the backplane substrate and the system substrate can be more efficiently implemented, and the optical components can be greatly reduced for packaging. Since the process can be simplified, the cost can be realized.

Claims (10)

delete In an optical backplane device comprising a backplane substrate and a system substrate each having a flexible organic-inorganic polymer material having a first and second optical waveguide layers embedded therein, the first and second optical waveguide layers are inserted into the backplane substrate by screwing. A portion of both sides of the first optical waveguide layer is bent at a curvature radius of 2 mm to 3 mm to directly connect the second optical waveguide layer so that the path of the incident optical signal is changed vertically. group. 3. The optical path changer of claim 2, wherein the optical path changer is configured to receive an optical signal emitted from the second optical waveguide layer of any one of the system substrates directly to one end of the first optical waveguide layer. The path is vertically changed, and the path of the optical signal transmitted to the other end of the first optical waveguide layer is vertically changed again so that the paths are directly transmitted to one end of the second optical waveguide layer of the other system substrate. Light path changer, characterized in that. The method of claim 2, wherein the optical path changer, It is made of the same shape as the insertion groove to be inserted into the insertion groove formed on the backplane substrate, respectively, Horizontal guide grooves are formed on one side thereof so that a portion of both sides of the first optical waveguide layer is inserted horizontally, and the horizontal guide grooves are bent at a predetermined radius of curvature of the first optical waveguide layer inserted along the horizontal guide grooves. A curved guide groove extending in the vertical direction at the end of the curved guide groove is formed, the vertical guide groove is formed to extend to the end of the curved guide groove so that the first optical waveguide layer is exposed on the side perpendicular to the one side surface. Light path changer. delete delete A backplane substrate having a first optical waveguide layer having at least one optical waveguide embedded therein and having insertion grooves to expose portions of both sides of the first optical waveguide layer; A system substrate having a second optical waveguide layer having at least one optical waveguide embedded therein and coupled to an upper side of the insertion groove; And A portion of both sides of the first optical waveguide layer is inserted into the insertion groove of the backplane substrate by screw coupling so that the path of the incident optical signal is bent vertically with a curvature radius of 2 mm to 3 mm, respectively, and has a flexible organic-inorganic. An optical backplane device using an optical path changer provided to directly connect an optical path between the first and second optical waveguide layers made of a polymer material. delete The method of claim 7, wherein the first and second optical waveguide layer, A core layer in which a plurality of cores are arranged in a line; A cladding layer formed to surround each core; And And a protective layer formed on the surface of the clad layer. 8. The optical backplane apparatus of claim 7, wherein the insertion groove of the backplane substrate is formed in a quadrangular shape.

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