KR100690314B1 - Electronic component package - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component package for maximizing a heat dissipation effect. The present invention relates to a lower ceramic substrate having an upper surface on which a light emitting device mounting region is mounted, and a light emitting device mounting region disposed on the lower ceramic substrate. In an electronic component package including an upper ceramic substrate having a cavity formed in a region corresponding to the upper portion, a thermosetting fluid is embedded below the light emitting device mounting region of the lower ceramic substrate in a wider range than the size of the light emitting device.

LED, Heat Dissipation, Ceramic Substrate, Thermal Sink

Description

Electronic parts package

1 is a schematic diagram of a conventional lamp-type LED package structure,

2 is a schematic diagram of a conventional surface mount LED package structure,

3 is a cross-sectional view of an electronic component package according to an embodiment of the present invention;

4A to 4E are diagrams for describing a cavity forming process of the upper ceramic substrate illustrated in FIG. 3.

<Description of Symbols for Major Parts of Drawings>

30: lower ceramic substrate 32: LED device

34: anode electrode 36: cathode electrode

38: thermosetting fluid 40: upper ceramic substrate

42: wire 44: reflector

46: metal core 50a, 50b, 50c: heat passage hole

60: jig

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component package, and more particularly, to an electronic component package capable of optimal heat dissipation.

A light emitting diode (hereinafter, referred to as an LED) is a semiconductor device capable of realizing various colors by configuring a light emitting source by changing compound semiconductor materials such as GaAs, AlGaAs, GaN, InGaN, and AlGaInP. Say. At present, many such semiconductor devices have been adopted in the form of packages in electronic components.

In general, the criteria for determining the characteristics of the LED device includes a range of colors, luminance, luminance intensity, and the like. The characteristics of such LED devices are primarily determined by the compound semiconductor materials used in the LED devices, but are also greatly influenced by the structure of the package for mounting chips as secondary elements.

In general, a semiconductor package is a mother board that is electrically connected to a substrate, for example, a chip-based semiconductor device (eg, an LED) that is sawed from a wafer to a substrate, and is wrapped in a resin encapsulant and is a mother board. It is a thing of the form that can be electrically mounted in).

Referring to FIGS. 1 and 2, the respective package structures of the typical lamp type LED and the surface mounted LED are compared. In the case of the lamp type LED package 10 shown in FIG. 1, two lead frames 3a and 3b are used. The upper part of one lead frame 3b is provided with a metal electrode surface having a predetermined angle in a cup shape, and the LED element 5 is mounted on the upper part of the lead frame 3b, and is packaged by a semispherical case 7 made of transparent molding resin. It has a structure. On the other hand, the surface-mount LED package 20 shown in FIG. 2 has a package 11 made of a molding epoxy resin, and the LED element 15 is disposed in a mounting area having a small external angle, and the pattern electrode is formed of a wire 13. It is made of a structure connected to (not shown).

By such a package structure, the lamp-shaped LED package 10 can adjust the angular distribution of brightness by the hemispherical case 7 acts as a lens, and in particular, it is possible to increase the luminance at a certain angle by narrowly adjusting the luminance distribution. At the same time, light is reflected from the light emitting source by the cup-shaped metal electrode plate to increase the intensity of luminance. In contrast, in the surface-mount type LED package 20, the package has a wide distribution of luminance, and the luminance is also low. As such, the luminance and the luminance distribution are greatly influenced by the package structure. Therefore, in the case of a surface mount type LED package using molding resins, development of a method of adding a reflector by forming a constant reflection angle structure on the side of the mounting region and plating a metal is in progress.

On the other hand, thermal stress is one of the biggest causes of characteristic degradation and failure in semiconductor packages using such LEDs. When the LED elements are directly mounted on the same substrate with high density and used as signal lamps or lighting equipment, the LED elements emit more heat, and the amount of heat dissipation tends to increase in proportion to the total light emitting area.

In particular, the blue LED has a relatively high driving voltage compared to other high-brightness LED, so the temperature increases. Furthermore, the larger the area of the lighting equipment, the more densely mounted the LED elements will be, the worse the characteristics of LED deterioration and the occurrence of failure. However, the existing light emitting devices are not good heat dissipation characteristics, there is a limit to mounting a high density LED device in a large area.

The present invention has been proposed to solve the above problems, and an object thereof is to provide an electronic component package for maximizing a heat dissipation effect.

In order to achieve the above object, an electronic component package according to an exemplary embodiment of the present invention includes a lower ceramic substrate having an upper surface on which a light emitting device mounting region on which a light emitting device is mounted is formed, and disposed on the lower ceramic substrate. An electronic component package comprising an upper ceramic substrate having a cavity formed in a region corresponding to an element mounting region,

Under the light emitting device mounting area of the lower ceramic substrate, a thermal via body is embedded in a wider range than the size of the light emitting device.

Preferably, the thermofluid is divided into a plurality of regions and embedded, and a thermofluid region having a diameter greater than or equal to the size of the light emitting element is disposed directly below the light emitting element.

In addition, a pattern electrode is formed under the light emitting device so as to cover the entire upper surface of the thermofluid region.

Hereinafter, an electronic component package according to an embodiment of the present invention will be described with reference to the accompanying drawings. Hereinafter, the electronic component package will be described using a semiconductor package to which a light emitting diode is applied, that is, a light emitting diode package.

3 is a cross-sectional view of an electronic component package (light emitting diode package) according to an embodiment of the present invention.

According to the same figure, an embodiment of the present invention provides a chip-shaped LED element 32; A lower ceramic substrate 30 on which the LED element 32 is mounted; An upper ceramic substrate 40 disposed on the lower ceramic substrate 30 and having a cavity having a predetermined inclination angle in a region corresponding to the region in which the LED element 32 is mounted; Pattern electrodes 34 and 36 formed on the lower ceramic substrate 30 in a predetermined shape; And a reflector plate 44 formed to be in close contact with the inner surface of the cavity of the upper ceramic substrate 40 so as to surround the LED device 32 and having a catching jaw 44a at the upper end of the upper ceramic substrate 40. ).

The lower ceramic substrate 30 can be any substrate as long as the LED element 32 can be mounted with high density. For example, these lower ceramic substrates include alumina, quartz, calcium zirconate, forsterite, SiC, graphite, fusedsilica, mullite, muscle Cordierite, zirconia, beryllia, aluminum nitride, low temperature co-fired ceramic (LTCC), and the like. The ceramic can be used as a multi-layer ceramic package (MLP) through the firing process by forming a metal conductor wiring pattern thereon. When used in these packages, airtightness is excellent. The upper ceramic substrate 40 may also be considered to be the same as the material of the lower ceramic substrate 30 described above.

On the other hand, the lower ceramic substrate 30 has a cavity having a predetermined inner inclination angle (for example, 10 to 45 degrees; an angle of heat dissipation) on the bottom surface (ie, a portion corresponding to the LED element mounting region). Is formed. The shape of the cavity formed on the bottom surface of the lower ceramic substrate 30 may vary, but is preferably formed in a tapered cylindrical shape.

In addition, the lower ceramic substrate 30 includes a plurality of thermal via holes 50; 50a, which are vertically spaced apart between a neighboring portion including an LED element mounting region on an upper surface and a cavity on a bottom surface. 50b, 50c, and the plurality of thermal oil passages 50a, 50b, 50c are filled with thermoelectric fluids 38 (38a, 38b, 38c) made of a conductive material such as metal.

The plurality of heat passage holes 50a, 50b, and 50c into which the heat passage 38 is embedded may be formed in a circle, a rectangle, a polygon, or the like. In the case of a circular shape, the heights of the respective heat transfer holes 50a, 50b and 50c are 100 to 800 mu m, the diameter is 0.3 to 0.8 mm, and the spacing between the heat transfer holes 50a, 50b and 50c is the LED array. Depending on the spacing, it should be at least 0.15mm apart from the outside of the hole.

In FIG. 3, the embedding of the thermal fluid in a wider range than the size of the LED element 32 under the LED element mounting region of the lower ceramic substrate 30 allows rapid release of heat generated from the LED element 32. To do this.

In the case where one LED is mounted on a ceramic substrate, the heat-transfer holes 50 may appear to be three in the same figure, but they may be more or more integrated into one. One of the plurality of thermally transmissive holes 50a, 50b, 50c has a diameter greater than or equal to the size of the LED element 32, and the remainders 50a, 50c vary in diameter from 0.2-0.8 μm. . Then, the heat transfer hole 50b having a diameter greater than or equal to the size of the LED element 32 is located directly under the LED element 32. The reason why the heat passage hole 50b having a diameter greater than or equal to the size of the LED element 32 is placed directly below the LED element 32 is that the heat in the LED element 32 is higher than that of the other heat passage holes 50a and 50c. This is because the first and the most received position to quickly dissipate a large amount of heat through the thermal fluid 38b first. If the heat generated by the LED device 32 is not effectively radiated, the temperature of the LED device 32 rises, causing deterioration, thereby lowering the luminous efficiency and reducing the service life. Of course, the diameters of the heat passage holes 50a and 50c may be larger or smaller than the size of the LED element 32.

Even when a plurality of LED elements (chips) are arrayed, the thermal fluid 38b is present directly below each LED element, and the thermal fluids 38a and 38c are present around the respective LED elements. Releases the heat emitted by the.

The pattern electrodes 34 and 36 may be formed of an anode electrode 34 and a cathode electrode 36 spaced apart from each other. The anode electrode 34 and the cathode electrode 36 each consist of an Ag / Ni / Ag (Au) layer.

The anode electrode 34 is formed on one side of the upper surface of the lower ceramic substrate 30 so as to be spaced apart from the cathode electrode 36 formed in the LED device mounting area for electrical insulation. It is formed spaced apart. The anode electrode 34 is also formed on the bottom surface of the lower ceramic substrate 30, and the anode electrode 34 formed on the bottom surface of the lower ceramic substrate 40 is formed on the top surface of the lower ceramic substrate 30. The anode electrode 34 may be extended or may be electrically connected to the anode electrode 34 formed on the upper surface of the lower ceramic substrate 30.

The cathode electrode 36 is formed in a direction opposite to the anode electrode 34. The cathode electrode 36 has an upper surface of the heat passage holes 50a, 50b, and 50c and an inner surface of the cavity of the bottom surface of the lower ceramic substrate 30. Cover. Accordingly, in the present invention, the LED element 32 is mounted on the cathode electrode 36, and is electrically connected to the anode electrode 34 and the cathode electrode 36 through the wire 42. Although not shown in the figure, the LED element 32 and the cathode electrode 36 are insulated by an insulating material. Of course, if necessary, the anode electrode 34 may be used as a cathode and the cathode electrode 36 may be replaced with an anode. In this case, the driving power application method may be reversed.

In addition, the cavity formed on the bottom surface of the lower ceramic substrate 30 is filled with a metal core 46 made of a conductive material such as Cu or Al. The metal core 46 serves as a thermal sink.

The reason for covering the cathode electrode 36 to the inner surface of the cavity of the bottom surface of the lower ceramic substrate 30 is that the metal cathode is not easily adhered to each other when the metal core 46 is simply filled in the ceramic cavity. By covering the electrode 36 to the inner side of the cavity of the bottom surface, the adhesion rate of the metal core 46 can be increased.

When the shape of the cavity formed on the bottom surface of the lower ceramic substrate 30 is a tapered cylindrical shape, the inner diameter D1 of the cavity is, for example, at least 1.0 mm and the outer diameter D2 is at most 3.5 mm. do. This is the data given as an example of a 5 x 5 mm LED. The shape and size of the cavity are modified according to the size of the LED element 32 to be mounted. For the LED element 32 of 3 x 3 mm, the inner diameter D1 of the cavity formed on the bottom surface of the lower ceramic substrate 30 in order for the metal core 46 to have an effect of a thermal synchro is, for example, at least 0.3 mm. The outer diameter D2 can be at most 2.0 mm.

4A to 4E are views for explaining a cavity forming process of the upper ceramic substrate 40 shown in FIG. 3. First, as shown in FIG. 4A, holes having holes formed by punching holes having different diameters r from each other are formed. When a plurality of ceramic sheets are stacked, the jig 60 as shown in FIG. 4B is pressed toward the holes of the stacked plurality of ceramic sheets. Then, as shown in FIG. 4D, when the jig 60 is raised in the upright direction, the upper ceramic substrate 40 having the cavity inclined on the inner side as shown in FIG. 4E is obtained.

Here, the reflecting plate 44 is installed on the inner surface of the cavity of the upper ceramic substrate 40 so that the light emitted from the side of the LED element 32 can be reflected from the reflecting plate 44 to emit light to the front side. For this reason, the inclination angle of the cavity of the upper ceramic substrate 40 is set to 10 to 45 degrees. Preferably, the reflective plate 44 may be manufactured separately and installed on the inner surface of the cavity of the upper ceramic substrate 40 by a silicon-based bonding material. Alternatively, when using a low temperature co-fired ceramic method, the reflector plate 44 is a low temperature co-fired ceramic method after printing 2 to 20 microns of Ag on the ceramic surface After the sintering is performed, the Ag sintered surface is plated with 2 to 10 microns of Ni, and then 2 to 10 microns of Ag (Au) is plated again. When sintering by low temperature co-fired ceramic method, it starts at 25 ℃ and increases by 2 ℃ / min and reaches 830 ~ 900 ℃. It keeps about 20 minutes and then drops by 2 ℃ / min and reaches 25 ℃. do. The above mentioned plating and firing conditions are general and there are some differences depending on the composition and additives.

On the other hand, the lower end of the reflecting plate 44 is slightly spaced apart from the anode electrode 34 and the cathode electrode 36, which is to insulate the reflecting plate 44 and the electrodes 34, 36 of the LED element 32 In order to prevent the light emitted from the side surface from being absorbed (leaked) into the body of the upper ceramic substrate 40, the smaller the spacing is, the better. In the embodiment of the present invention, the distance between the lower end of the reflecting plate 44 and the anode electrode 34 and the distance between the lower end of the reflecting plate 44 and the cathode electrode 36 are set to 30 to 200 m. As the spacing decreases, the light absorbed into the body of the upper ceramic substrate 40 decreases, so that the brightness of the light increases, and when the spacing decreases, the heat release rate by the reflector plate 44 increases. You get

In the exemplary embodiment of the present invention, although the latching jaw 44a of the reflecting plate 44 is fixed to the upper surface of the upper ceramic substrate 40 by a predetermined value, the area of the catching jaw 44a exposed to the outside increases the heat dissipation effect. In order to increase the height, the external shape of the locking jaw 44a may cover the upper surface of the upper ceramic substrate 40. As such, the shape of the locking projection 44a may be modified in various forms in consideration of the package body appearance and the heat dissipation effect, and such modification is also within the scope of the present invention.

On the other hand, the present invention is not limited only to the above-described embodiment, but can be modified and modified within the scope not departing from the gist of the present invention, the technical idea to which such modifications and variations are also applied to the claims Must see For example, in the above-described embodiment of the present invention, a thermosetting fluid is embedded below the light emitting device mounting area of the lower ceramic substrate in a wider range than the size of the light emitting device, but below the light emitting device mounting area of the lower ceramic substrate. The thermosetting fluid may be embedded in the same or wider range than the size of the light emitting element.

As described in detail above, according to the present invention, due to the effective heat dissipation structure, it is possible to efficiently discharge heat generated from the LED device, thereby minimizing thermal stress of the LED device, and enabling stable driving of the LED device.

In addition, the heat generated from the LED device can be easily discharged, and the LED device can be mounted on a large-area substrate with high density.

Claims (14)

delete An electronic component package comprising a lower ceramic substrate having an upper surface on which a light emitting device mounting region is mounted, and an upper ceramic substrate disposed on the lower ceramic substrate and having a cavity formed in a region corresponding to the light emitting device mounting region. In Under the light emitting device mounting area of the lower ceramic substrate, a thermosetting fluid is embedded in a wider range than the size of the light emitting device, and the thermosetting fluid is divided into a plurality of areas and embedded. An electronic component package, characterized in that a thermofluid region having a diameter greater than or equal to a size is disposed directly below the light emitting device. The method of claim 2, The electronic component package, characterized in that the pattern electrode is formed to cover all the upper surface of the region of the thermosetting fluid in the lower portion of the light emitting device. An electronic component package comprising a lower ceramic substrate having an upper surface on which a light emitting device mounting region is mounted, and an upper ceramic substrate disposed on the lower ceramic substrate and having a cavity formed in a region corresponding to the light emitting device mounting region. In The cavity is formed on the bottom surface of the lower ceramic substrate, and the thermosetting fluid is wider than the size of the light emitting device between the portion including the light emitting device mounting region on the upper surface of the lower ceramic substrate and the cavity of the bottom surface of the lower ceramic substrate. Electronic component package, characterized in that the purchase. The method of claim 4, wherein The thermofluid is divided into a plurality of regions and is embedded, wherein the thermofluid region having a diameter greater than or equal to the size of the light emitting element among the plurality of thermofluid regions is disposed directly below the light emitting element. . The method of claim 5, The electronic component package, characterized in that the pattern electrode is formed to cover all the upper surface of the region of the thermosetting fluid in the lower portion of the light emitting device. An electronic component package comprising a lower ceramic substrate having an upper surface on which a light emitting device mounting region is mounted, and an upper ceramic substrate disposed on the lower ceramic substrate and having a cavity formed in a region corresponding to the light emitting device mounting region. In The cavity is formed on the bottom surface of the lower ceramic substrate, and the thermosetting fluid is wider than the size of the light emitting device between the portion including the light emitting device mounting region on the upper surface of the lower ceramic substrate and the cavity of the bottom surface of the lower ceramic substrate. And a portion of the pattern electrode formed on an upper surface of the thermosetting fluid and an inner surface of the cavity of the lower ceramic substrate. The method of claim 7, wherein The thermofluid is divided into a plurality of regions and is embedded, wherein the thermofluid region having a diameter greater than or equal to the size of the light emitting element among the plurality of thermofluid regions is disposed directly below the light emitting element. . The method according to claim 4 or 7, The cavity formed on the bottom surface of the lower ceramic substrate is filled with a thermal conductor, characterized in that the electronic component package. The method of claim 9, The thermal conductor is an electronic component package, characterized in that made of a conductive metal material of Cu, Al. The method according to claim 4 or 7, The thermosetting fluid is an electronic component package, characterized in that made of a metal of Ag. The method according to claim 4 or 7, The cavity formed on the bottom surface of the lower ceramic substrate has an inclination angle of 10 to 45 degrees. The method according to claim 4 or 7, The inner surface of the cavity of the upper ceramic substrate is provided with a reflecting plate, the lower end of the reflecting plate is an electronic component package, characterized in that installed at a distance of 30 ~ 200μm and the pattern electrode formed on the lower ceramic substrate. An electronic component package comprising a lower ceramic substrate having an upper surface on which a light emitting device mounting region is mounted, and an upper ceramic substrate disposed on the lower ceramic substrate and having a cavity formed in a region corresponding to the light emitting device mounting region. In And a thermosetting fluid is embedded below the light emitting device mounting area of the lower ceramic substrate in the same or wider range than the size of the light emitting device.

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