KR100684818B1 - Electrolytic Precipitation Method of Bronze - Google Patents
Electrolytic Precipitation Method of Bronze Download PDFInfo
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- KR100684818B1 KR100684818B1 KR1020057004846A KR20057004846A KR100684818B1 KR 100684818 B1 KR100684818 B1 KR 100684818B1 KR 1020057004846 A KR1020057004846 A KR 1020057004846A KR 20057004846 A KR20057004846 A KR 20057004846A KR 100684818 B1 KR100684818 B1 KR 100684818B1
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- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 title claims abstract description 35
- 229910000906 Bronze Inorganic materials 0.000 title claims abstract description 34
- 239000010974 bronze Substances 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims description 53
- 238000001556 precipitation Methods 0.000 title claims description 32
- 239000003792 electrolyte Substances 0.000 claims abstract description 111
- 239000000080 wetting agent Substances 0.000 claims abstract description 34
- 239000010949 copper Substances 0.000 claims abstract description 31
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 27
- 125000003118 aryl group Chemical group 0.000 claims abstract description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000002253 acid Substances 0.000 claims abstract description 16
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 229910001432 tin ion Inorganic materials 0.000 claims abstract description 13
- 230000002378 acidificating effect Effects 0.000 claims abstract description 12
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 28
- 229910052718 tin Inorganic materials 0.000 claims description 21
- 239000003112 inhibitor Substances 0.000 claims description 13
- 150000003839 salts Chemical class 0.000 claims description 13
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 12
- 239000003381 stabilizer Substances 0.000 claims description 12
- 238000000151 deposition Methods 0.000 claims description 10
- -1 alkyl sulfonic acids Chemical class 0.000 claims description 8
- 230000003647 oxidation Effects 0.000 claims description 8
- 238000007254 oxidation reaction Methods 0.000 claims description 8
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 7
- 229910052797 bismuth Inorganic materials 0.000 claims description 7
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 7
- 229910052725 zinc Inorganic materials 0.000 claims description 7
- 239000011701 zinc Substances 0.000 claims description 7
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 claims description 6
- 125000001931 aliphatic group Chemical group 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 125000000129 anionic group Chemical group 0.000 claims description 5
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 claims description 4
- 150000007513 acids Chemical class 0.000 claims description 4
- IEORSVTYLWZQJQ-UHFFFAOYSA-N 2-(2-nonylphenoxy)ethanol Chemical compound CCCCCCCCCC1=CC=CC=C1OCCO IEORSVTYLWZQJQ-UHFFFAOYSA-N 0.000 claims description 3
- BSXVKCJAIJZTAV-UHFFFAOYSA-L copper;methanesulfonate Chemical compound [Cu+2].CS([O-])(=O)=O.CS([O-])(=O)=O BSXVKCJAIJZTAV-UHFFFAOYSA-L 0.000 claims description 3
- AICMYQIGFPHNCY-UHFFFAOYSA-J methanesulfonate;tin(4+) Chemical compound [Sn+4].CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O.CS([O-])(=O)=O AICMYQIGFPHNCY-UHFFFAOYSA-J 0.000 claims description 3
- 229920000847 nonoxynol Polymers 0.000 claims description 3
- RGHNJXZEOKUKBD-SQOUGZDYSA-M D-gluconate Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C([O-])=O RGHNJXZEOKUKBD-SQOUGZDYSA-M 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 239000003945 anionic surfactant Substances 0.000 claims description 2
- 150000001728 carbonyl compounds Chemical class 0.000 claims description 2
- 239000008139 complexing agent Substances 0.000 claims description 2
- 229940050410 gluconate Drugs 0.000 claims description 2
- 238000007747 plating Methods 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 239000002736 nonionic surfactant Substances 0.000 claims 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims 1
- 238000000576 coating method Methods 0.000 abstract description 30
- 239000011248 coating agent Substances 0.000 abstract description 20
- 230000008021 deposition Effects 0.000 abstract description 5
- 239000011135 tin Substances 0.000 description 29
- 239000003963 antioxidant agent Substances 0.000 description 10
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 230000003078 antioxidant effect Effects 0.000 description 9
- 229910001128 Sn alloy Inorganic materials 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000011593 sulfur Substances 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003906 humectant Substances 0.000 description 2
- 229910052500 inorganic mineral Inorganic materials 0.000 description 2
- 239000011707 mineral Substances 0.000 description 2
- 235000010755 mineral Nutrition 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000010802 sludge Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 230000002009 allergenic effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001621 bismuth Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 150000003841 chloride salts Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- LFEBAVXLPLPXCX-UHFFFAOYSA-H dibismuth methane trisulfate Chemical compound C.[Bi+3].[Bi+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O LFEBAVXLPLPXCX-UHFFFAOYSA-H 0.000 description 1
- XPPKVPWEQAFLFU-UHFFFAOYSA-J diphosphate(4-) Chemical compound [O-]P([O-])(=O)OP([O-])([O-])=O XPPKVPWEQAFLFU-UHFFFAOYSA-J 0.000 description 1
- 235000011180 diphosphates Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000000176 sodium gluconate Substances 0.000 description 1
- 235000012207 sodium gluconate Nutrition 0.000 description 1
- 229940005574 sodium gluconate Drugs 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
- 231100000925 very toxic Toxicity 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 239000011686 zinc sulphate Substances 0.000 description 1
- 235000009529 zinc sulphate Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
Abstract
본 발명은 적어도 주석과 구리이온, 알킬술폰산 및 습윤제를 포함한 산성 전해질 내에 코팅대상 기판을 침지시킴에 의해 금속화(metallising)하는 것을 포함하는 청동 갈바닉 코팅에 관한 것이다. 본 발명의 목적은, 석출속도를 필수적으로 증가시키고, 우수한 접착성, 높은 구리함량, 다양한 기계적 물성 및 장식특성을 가진 세공없는(non-porous) 청동코팅공정을 수행하기 위한 것이다. 이를 위해, 방향족의 비이온성 습윤제가 상기 전해질에 첨가된다. 또한, 본 발명에 의해, 청동코팅용의 신규 전해질이 개시된다.The present invention relates to a bronze galvanic coating which comprises metallising by immersing a substrate to be coated in an acidic electrolyte comprising at least tin and copper ions, alkylsulfonic acid and a wetting agent. It is an object of the present invention to essentially increase the deposition rate and to perform a non-porous bronze coating process with good adhesion, high copper content, various mechanical properties and decorative properties. To this end, aromatic nonionic wetting agents are added to the electrolyte. In addition, the present invention discloses a novel electrolyte for bronze coating.
청동 코팅, 방향족의 비이온성 습윤제Bronze Coating, Aromatic Nonionic Wetting Agent
Description
본 발명은 청동의 전해석출 방법에 관한 것으로, 적어도 주석과 구리이온, 알킬술폰산 및 습윤제를 포함한 산성 전해질내에서, 코팅대상 기판을 도금하는 방법 및 이러한 전해질의 제조 방법에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for electrolytic precipitation of bronze, and to a method of plating a substrate to be coated in an acidic electrolyte containing at least tin, copper ions, alkylsulfonic acid, and a humectant, and a method for producing such an electrolyte.
다양한 종류의 전해질에 기초한 주석 및 주석 합금의 석출 방법이 당해 기술분야에 공지되어 있으며, 실제 사용되고 있다. 시안 화합물계 전해질로부터 주석 및/또는 주석합금을 석출하는 방법은 통상적인 것이다. 그러나, 이러한 전해질은 매우 독성이 높아 환경면에서 그 사용이 문제시되고 있어, 수년 간, 시안 화합물이 없는 전해질을 개발하고자 하는 시도가 있어왔다. 그 예로서, pH 영역 5-9 에서 작용하는 피로포스페이트 또는 옥살레이트에 기초한 전해질을 들 수 있다. 그러나, 이러한 방법들은, 비교적 낮은 석출 속도 등, 경제적 및 기술적 단점이 있다.Precipitation methods of tin and tin alloys based on various kinds of electrolytes are known in the art and are actually used. The method of depositing tin and / or tin alloy from a cyan compound-based electrolyte is conventional. However, these electrolytes are very toxic and their use is problematic in the environment, and for many years, there have been attempts to develop an electrolyte free of cyanide compounds. As an example, an electrolyte based on pyrophosphate or oxalate acting in the pH region 5-9 may be mentioned. However, these methods suffer from economic and technical disadvantages, such as relatively low precipitation rates.
따라서, 현재는 산성 전해질로부터 주석 및/또는 주석합금을 석출하는 방법을 이용할 수 있도록 하는 방향으로의 개발이 이루어지고 있다. 이는, 2가 주석의 경우 산성 전해질 내에서 금속성 주석으로 매우 쉽게 환원되어 보다 빠른 석출속도에서 질적으로 균일한 코팅(equivalent coating)을 형성할 수 있는 한편, 예를 들어, 세라믹 구조물과 같은 기판에 알칼리성 전해질이 미치는 좋지 않은 영향을 방 지할 수 있기 때문이다.Therefore, the development in the direction which makes it possible to use the method of depositing tin and / or tin alloy from an acidic electrolyte is currently made | formed. This can be very easily reduced to metallic tin in acidic electrolytes in the case of divalent tin to form a qualitatively uniform coating at a faster deposition rate, while alkalinizing to substrates such as, for example, ceramic structures. This is because the bad effects of the electrolyte can be prevented.
따라서, 더 빠른 석출 속도로 고품질의 주석 또는 주석 합금을 석출하기 위한 산성 전해질 및 그 방법이 EP 1 111 097 A2 및 US 6,176,996B1에 개시되어 있다. 이들은 유기 술폰산의 2가 이상의 금속염을 함유하는 전해질로서, 이들로부터, 납땜 가능한 내식성(corrosion resistant) 코팅이 얻어지며, 이들 코팅은, 예를 들어, 전자산업에서 회로기판 등의 제조를 위해 사용하는 납-함유 납땜 코팅물의 대체물로 사용될 수 있다.Accordingly, acidic electrolytes and methods for the precipitation of high quality tin or tin alloys at higher deposition rates are disclosed in EP 1 111 097 A2 and US Pat. No. 6,176,996B1. These are electrolytes containing a divalent or higher metal salt of organic sulfonic acid, from which a solderable corrosion resistant coating is obtained, these coatings being used, for example, in the manufacture of circuit boards and the like in the electronics industry. Can be used as a substitute for a braze-containing coating.
그러나, 상기 방법은, 구리함량이 10% 이상인 소위 진청동(true bronze)과 같은, 구리 함량이 높은 주석-구리 합금의 석출에는 한계를 가진다. 예를 들어, 주석과 구리간에 높은 전위차 때문에, 2가 주석의 산화속도가 보다 높아지고, 이로 인해, 산성 전해질 내에서는 4가의 주석으로 쉽게 산화되어 버린다. 그러나, 이러한 형태의 주석은 더 이상 산성 매질 내에서 전해 석출될 수 없어 상기 공정으로부터 빠져 나오며, 이 때문에 2 종류의 금속간에 불균일한 석출이 이루어지고 석출 속도가 감소된다. 나아가, 4가 주석으로의 산화에 따른 슬러지 형성의 증가는 안정적인 조작과 전해질의 긴 수명을 구현함에 장애가 되고 있다. 또한, 이러한 오염으로 인해, 강한 결합 및 세공없는 코팅을 보장할 수 없다.However, the method has limitations in the precipitation of tin-copper alloys having a high copper content, such as so-called true bronze having a copper content of 10% or more. For example, due to the high potential difference between tin and copper, the oxidation rate of divalent tin becomes higher, and as a result, it is easily oxidized to tetravalent tin in the acidic electrolyte. However, this type of tin can no longer be electrolytically precipitated in an acidic medium and exits from the process, resulting in non-uniform precipitation between the two metals and a reduction in the precipitation rate. Furthermore, the increase in sludge formation due to oxidation to tetravalent tin is an obstacle in achieving stable operation and long life of the electrolyte. In addition, due to such contamination, it is not possible to ensure a strong bond and a pore-free coating.
이러한 기술적 공정 상 불리함으로 인해, 현재, 전해 석출된 청동 코팅의 용도는 다양하지 않다. 청동 코팅은 때때로 고가의 은 금속 또는, 알레르기를 일으키는 니켈의 대체재로서 보석 산업에서 사용되고 있다. 같은 방식으로, 몇몇 기술분야, 예를 들어, 전자산업분야 또는 기계공업 및/또는 가공기술분야에서, 전자부품 의 코팅이나 베어링 아웃레이(bearing outlay)와 마찰층(friction layer)의 코팅을 위해서, 청동의 전해석출 방법이 주목을 받고 있다. 그러나, 이 경우 주로, 공정 조건 의해 구리함량을 낮게 유지할 수 있는, 백 청동(white bronze) 혹은 이른바 "모조 청동"이 니켈 대체재로서 사용된다.Due to this technical process disadvantage, the use of electrolytically deposited bronze coatings is currently not varied. Bronze coatings are sometimes used in the jewelry industry as substitutes for expensive silver metals or allergenic nickel. In the same way, in some technical fields, for example in the electronics industry or in the mechanical and / or processing arts, for the coating of electronic components or for the coating of bearing outlays and friction layers, Electrolytic deposition of bronze has attracted attention. In this case, however, mainly white bronze or so-called "imitation bronze", which can keep the copper content low by the process conditions, is used as the nickel substitute.
따라서, 본 발명은 산성 전해질로부터, 종래 기술에 비해 상당히 높은 석출속도로, 적어도 주석과 구리를 나란히(side by side) 석출시킬 수 있는 청동의 석출 방법을 제공하고자 하는 과제에 기초한 것이다. 본 발명에 따른 방법을 사용할 경우, 다양한 장식적 특성 및 기계적 특성 뿐만 아니라 높은 구리함량 을 가지고, 단단하게 고착되며 세공이 없는 청동 코팅을 석출시킬 수 있다.Accordingly, the present invention is based on a problem to provide a method for depositing bronze from an acidic electrolyte, which can precipitate at least tin and copper side by side at a significantly higher deposition rate than in the prior art. When using the process according to the invention, it is possible to precipitate bronze coatings which have a high copper content as well as various decorative and mechanical properties, which are firmly fixed and free from pores.
또한, 본 발명에 따르면, 높은 함량의 2가의 구리이온을 포함할 수 있고, 산화에 따른 슬러지 형성에 대해 안정할 뿐만 아니라, 장기간 사용시에도 경제적이고 환경 친화적인 산성 전해질이 제공된다.In addition, according to the present invention, an acid electrolyte which may contain a high content of divalent copper ions, is not only stable to sludge formation due to oxidation, but also economical and environmentally friendly even in long-term use is provided.
본 발명에 따르면, 상기 과제는, 전해질에 방향족의 비이온성 습윤제를 첨가하는 것을 특징으로 하는 전술한 종류의 방법에 의해 해결된다.According to this invention, the said subject is solved by the method of the kind mentioned above characterized by adding aromatic nonionic humectant to electrolyte.
본 발명에 따르면, 구리-주석 합금의 애노드 및, 캐소드가 전해질에 의해 코팅 대상 기판에 연결되어 있고 이들을 통하여 직류(direct current)가 흐름에 의해 코팅이 수행되는, 청동 전해석출방법이 제공된다. 추가로, 본 발명에 따르면, 특히 상기 방법에서 사용될 수 있는 전해질과, 상기 방법에 의해 수득 가능한 코팅이 제공된다.According to the present invention, there is provided a bronze electrolytic deposition method, in which an anode of a copper-tin alloy and a cathode are connected to a substrate to be coated by an electrolyte and a coating is performed by direct current flow through them. In addition, according to the present invention there is provided in particular an electrolyte which can be used in the process and a coating obtainable by the process.
종래 기술상의 문제점들은, 본 발명에 따른 방법을 통해 신규한 전해질 조성물을 제공함에 의해 해소되며, 그 결과 보다 나은 석출 결과물을 얻을 수 있다. 나아가, 본 발명의 실시는, 보다 간단하고 경제적이다. 이는, 본 발명에 따른 전해질의 조성에 기초한 것이다. 예를 들어, 상기 방법은, 실온에서, 혹은 17 내지 25℃의 온도에서 수행되며, 코팅대상 기판은 pH < 1 의 강산성 (highly acid) 분위기에서 도금된다. 상기 전해질은, 상기 온도 범위에서 특히 안정하다. 또한, 전해질의 가열을 위한 비용이 들지 않으며, 긴 시간 및 높은 비용을 들여 도금된 기판을 냉각시킬 필요가 없다. 나아가, 본 발명의 경우, pH 값 및 하나 이상의 방향족의 비이온성 습윤제의 첨가 덕분에, 1A/dm2의 전류밀도에서 0.25㎛/분의 석출속도를 달성할 수 있다. 금속 함량을 증가시킬 경우, 상기 속도는, 랙 조작(rack operation)시, 7A/dm2 까지 올릴 수 있고, 연속 플랜트(continuous plant)의 경우는, 심지어 120 A/dm2 까지도 올릴 수 있다. 따라서, 플랜트 형태에 따라 각각의 경우에서, 0.1 - 120 A/dm2 의 범위의 전류밀도를 사용할 수 있다.The problems in the prior art are solved by providing a novel electrolyte composition through the method according to the present invention, which results in better precipitation results. Furthermore, the implementation of the present invention is simpler and more economical. This is based on the composition of the electrolyte according to the invention. For example, the method is carried out at room temperature or at a temperature of 17 to 25 ° C., and the substrate to be coated is plated in a highly acid atmosphere of pH <1. The electrolyte is particularly stable in the above temperature range. In addition, there is no cost for heating the electrolyte and there is no need to cool the plated substrate for a long time and a high cost. Furthermore, in the case of the present invention, a precipitation rate of 0.25 μm / min can be achieved at a current density of 1 A / dm 2 , thanks to the pH value and the addition of one or more aromatic nonionic wetting agents. When increasing the metal content, the speed can be raised to 7 A / dm 2 in rack operation, and even to 120 A / dm 2 in continuous plant. Thus, depending on the plant type, in each case a current density in the range of 0.1-120 A / dm 2 can be used.
놀랍게도, 특히, 하나 이상의 방향족 비이온성 습윤제를 전해질에 첨가함에 의해 도금대상 기판, 특히 복잡한 기판의 습윤특성이 크게 향상된다. 그 결과, 본 발명에 따른 방법을 사용함에 의해 상당히 높은 석출속도를 얻을 수 있고, 나아가, 본 발명의 방법에 의해 제조된 코팅은 균일하고 질적으로 높은 등급을 가지며 매우 우수한 접착특성을 가지고 일반적으로 세공이 없다.Surprisingly, in particular, the addition of one or more aromatic nonionic wetting agents to the electrolyte greatly improves the wetting properties of the substrate to be plated, especially of complex substrates. As a result, a fairly high precipitation rate can be obtained by using the process according to the invention, and furthermore, the coatings produced by the process of the invention have uniform, qualitatively high grades and have very good adhesion properties and are generally fine There is no
방향족의 비이온성 습윤제를 사용하는 또 다른 장점은, 습윤특성이 매우 우수하기 때문에, 소망하는 석출결과를 얻기 위해 전해질 및/또는 상기 전해질 내 기판을 휘저을 필요가 아주 작거나, 심지어 거의 없다는 것이다. 또한, 방향족의 비이온성 습윤제를 유리하게 사용하기 때문에, 전해질로부터 기판을 제거할 경우, 도금된 기판으로부터 전해질 잔류물이 보다 잘 빠져나오므로, 동반손실(entrainment loss)이 줄어들고, 공정 비용을 낮출 수 있다.Another advantage of using aromatic nonionic wetting agents is that, because of their excellent wetting properties, there is very little or even little need to stir the electrolyte and / or the substrate in the electrolyte to achieve the desired precipitation result. In addition, because the aromatic nonionic wetting agent is advantageously used, when removing the substrate from the electrolyte, the electrolyte residue is better escaped from the plated substrate, thereby reducing entrainment loss and lowering the process cost. have.
하나 이상의 방향족의 비이온성 습윤제는 2-40g/L 양으로 첨가하는 것이 특히 유리하며, β-나프톨 에톡실레이트 및/또는 노닐페놀 에톡실레이트를 특히 바람직하게 사용할 수 있다.Particularly advantageous is the addition of at least one aromatic nonionic wetting agent in an amount of 2-40 g / L, with β-naphthol ethoxylate and / or nonylphenol ethoxylate being particularly preferably used.
따라서, 본 발명에 따라 제안된 발명은, 시안화 화합물을 사용한 공정에 비해, 경제적으로 유리하며 환경 친화적이다.Therefore, the invention proposed according to the present invention is economically advantageous and environmentally friendly compared to a process using a cyanide compound.
당해 기술분야에 공지된, 하나 이상의 음이온성 및/또는 지방족 비이온성 습윤제의 추가적 사용은, 상기 방향족의 비이온성 습윤제의 유리한 효과를 지지하거나 상기 효과를 강화시키는 경우에 한해, 선택적으로 가능하다. 바람직하게는, 음이온성 및/또는 지방족의 비이온성 습윤제로서, 폴리에틸렌 글리콜 및/또는 음이온성 계면활성제를 상기 전해질 내에 첨가한다.Further use of one or more anionic and / or aliphatic nonionic wetting agents, known in the art, is optionally possible only if they support or enhance the beneficial effects of the aromatic nonionic wetting agents. Preferably, as anionic and / or aliphatic nonionic wetting agent, polyethylene glycol and / or anionic surfactant are added into the electrolyte.
전술한 바와 같이, 본 발명에 따른 방법은, 특히, 상기 전해질의 특별한 조성을 특징으로 한다. 상기 전해질은, 필수적으로, 주석 및 구리이온, 알킬술폰산 및 방향족의 비이온성 습윤제를 포함한다. 추가로, 안정제 및/또는 배위제(complexing agent), 음이온성 및/또는 비이온성, 지방족 습윤제, 산화 억제제, 광택제(brightener) 및 다른 금속염이, 선택에 따라, 상기 전해질 내에 포함될 수 있다.As mentioned above, the process according to the invention is characterized in particular by the special composition of the electrolyte. The electrolyte essentially comprises tin and copper ions, alkylsulfonic acids and aromatic nonionic wetting agents. In addition, stabilizers and / or complexing agents, anionic and / or nonionic, aliphatic wetting agents, oxidation inhibitors, brighteners and other metal salts may optionally be included in the electrolyte.
본 발명에 따른 상기 청동석출 전해질에 첨가되는 주요금속 (주석 및 구리)은, 가장 먼저, 알킬 술폰산의 염의 형태, 바람직하게는 메탄술포네이트 염, 또는 미네랄산의 염, 바람직하게는 술페이트 염의 형태일 수 있다. 전해질 내의 주석염으로서, 특히, 바람직하게는, 주석 메탄 술포네이트가 전해질 L 당, 5-195 g의 양으로, 바람직하게는 11 - 175g의 양으로 사용된다. 이는, 2-75g/L, 바람직하게는 4-57g/L의 2가 주석이온의 사용에 해당한다. 구리 메탄술포네이트는, 특히 바람직하게는, 구리염으로서 전해질 내에서 사용될 수 있고, 전해질 L 당 8 - 280g의 양으로, 바람직하게는, 16-260g의 양으로 첨가된다. 이는, 2-70g/L 바람직하게는, 4-65g/L의 2가 구리이온의 사용에 해당한다.The main metals (tin and copper) added to the bronze precipitation electrolyte according to the invention are firstly in the form of salts of alkyl sulfonic acids, preferably methanesulfonate salts, or salts of mineral acids, preferably sulfate salts. Can be. As tin salt in the electrolyte, in particular, tin methane sulfonate is preferably used in an amount of 5-195 g, preferably in an amount of 11-175 g, per electrolyte L. This corresponds to the use of divalent tin ions of 2-75 g / L, preferably 4-57 g / L. Copper methanesulfonate is particularly preferably used in the electrolyte as the copper salt, and is added in an amount of 8-280 g per L of electrolyte, preferably in an amount of 16-260 g. This corresponds to the use of 2-70 g / L, preferably 4-65 g / L, divalent copper ions.
석출은, 명확하게, 산성 조건하에서 높기 때문에, 산, 바람직하게는 무기산 및/또는 알킬 술폰산이 전해질 내에, 전해질 L 당 140 -382g, 바람직하게는 175 - 245g의 양으로 첨가된다. 메탄술폰산의 사용이 특히 유용한데, 이는, 상기 사용에 의해 금속염의 용해도가 좋아지며, 그의 산 강도에 의해 공정 중 필요한 pH의 조정이 이루어지거나 촉진되기 때문이다. 추가로, 메탄 술폰산은 상기 욕의 안정성에 상당히 기여하는 특징을 가진다.Since the precipitation is clearly high under acidic conditions, an acid, preferably an inorganic acid and / or an alkyl sulfonic acid, is added to the electrolyte in an amount of 140 -382 g, preferably 175-245 g per L of electrolyte. The use of methanesulfonic acid is particularly useful because the solubility of the metal salts is improved by this use, and its acid strength facilitates or facilitates the adjustment of the required pH during the process. In addition, methane sulfonic acid is characterized by a significant contribution to the stability of the bath.
본 발명의 추가적 특징에 따르면, 전해질에 하나 이상의 추가적 금속 및/또는 염화물이 첨가된다. 유리하게, 상기 금속은 그의 가용성 염의 형태일 수 있다. 특히, 아연 및/또는 비스무스의 첨가는 석출된 코팅의 특징에 상당한 영향을 준다. 전해질에 첨가된 상기 금속 아연 및/또는 비스무스는, 환언하면, 알킬술폰산의 염의 형태, 바람직하게는, 메탄술포네이트, 혹은 미네랄산의 염의 형태, 바람직하게는 술페이트일 수 있다. 아연 술페이트는, 특히 바람직하게는, 전해질 내에서 이연염으로서 사용되며, 유리하게는, 전해질 L 당 0-25g의 양으로, 바람직하게는, 15-20g의 양으로 첨가된다. 특히 바람직하게는, 전해질 내에서 비스무스염으로서 비스무스 메탄 술페이트를 사용하며, 유리하게는 전해질 L 당 0-5g, 바람직하게는, 0.05-0.2g의 양으로 사용한다.According to a further feature of the invention, one or more additional metals and / or chlorides are added to the electrolyte. Advantageously, the metal may be in the form of its soluble salts. In particular, the addition of zinc and / or bismuth has a significant effect on the characteristics of the deposited coating. The metal zinc and / or bismuth added to the electrolyte may, in other words, be in the form of a salt of alkylsulfonic acid, preferably in the form of a salt of methanesulfonate, or a mineral acid, preferably sulfate. Zinc sulphate is particularly preferably used as a lead salt in the electrolyte, and is advantageously added in an amount of 0-25 g per electrolyte L, preferably in an amount of 15-20 g. Particularly preferably, bismuth methane sulfate is used as bismuth salt in the electrolyte, advantageously in an amount of 0-5 g, preferably 0.05-0.2 g per L of electrolyte.
추가로, 주석 함금의 석출을 위해 산성 전해질에서 통상 사용되는, 각종 첨가제, 예를 들어, 안정화제 및/또는 배위화제, 산화억제제 및 광택제를 상기 전해질에 첨가할 수 있다.In addition, various additives commonly used in acidic electrolytes for the precipitation of tin alloys, such as stabilizers and / or coordination agents, antioxidants and brighteners, may be added to the electrolyte.
특히, 전해질의 안정화를 위해 적당한 화합물을 사용하는 것은, 높은 품질의 청동을 빠르게 석출시키기 위해 중요한 조건이다. 유리하게는, 글루코네이트가 상기 전해질 및 안정화제 및/또는 배위화제에 첨가된다. 여기서, 본 발명에 따른 방법에서 나트륨 글루코네이트의 바람직한 사용이 특히 유리하다. 안정화제 및/또는 배위화제의 농도는 전해질 L 당 0-50g, 바람직하게는 20-30g이다. 디히드록시벤젠 계열의 화합물, 예를 들어, 파이로카테콜(pyrocatechol) 또는 페놀술폰산(phenol sulfonic acid)과 같은, 모노- 또는 폴리히드록시페닐 화합물을 산화 억제제로서 바람직하게 사용할 수 있다. 산화억제제의 농도는 전해질 L 당 0-5g이다. 유리하게는, 상기 전해질은 산화 억제제로서, 히드로퀴논을 함유한다.In particular, the use of a suitable compound for the stabilization of the electrolyte is an important condition for the rapid precipitation of high quality bronze. Advantageously, gluconate is added to the electrolyte and stabilizer and / or coordinating agent. Here, the preferred use of sodium gluconate in the process according to the invention is particularly advantageous. The concentration of stabilizer and / or coordinating agent is 0-50 g, preferably 20-30 g per L electrolyte. Dihydroxybenzene-based compounds such as mono- or polyhydroxyphenyl compounds, such as pyrocatechol or phenol sulfonic acid, can be preferably used as oxidation inhibitors. The concentration of the antioxidant is 0-5 g per L electrolyte. Advantageously, the electrolyte contains hydroquinone as an oxidation inhibitor.
본 발명에 따른 방법을 수행함에 의해, 각종 기판상에 청동을 석출시킬 수 있다. 예를 들어, 전자 부품을 제조하는 통상의 모든 방법을 사용할 수 있다. 동일한 방식으로, 본 발명에 따른 방법에 의해, 특히 단단하고 마모 저항성이 있는 청동 코팅을 베어링 등의 재료 상에 석출시킬 수 있다. 본 발명에 따른 방법은 유리하게는, 예를 들어, 가구류 및 보석 등과 같이, 주석, 구리, 아연 및 비스무스를 포함한 다성분 석출이 특히 유용한, 장식 코팅 분야에서도 사용될 수 있다.By carrying out the process according to the invention, it is possible to deposit bronze on various substrates. For example, all the usual methods of manufacturing electronic components can be used. In the same way, by the method according to the invention, a particularly hard and wear resistant bronze coating can be deposited on materials such as bearings. The method according to the invention can advantageously be used in the field of decorative coatings, in which, for example, multicomponent precipitations, including tin, copper, zinc and bismuth, are particularly useful, such as furniture and jewelry.
본 발명의 특히 유리한 장점은, 본 발명에 따른 방법을 사용하여 구리 함량이 60% 보다 많은 이른바 "진청동" 을 제조할 수 있다는 것이며, 이 경우, 구리 함량은 각각 소망하는 특성에 따라, 95 wt%까지 될 수 있다. 한편, 전해질 내에서 주석의 양에 대한 구리의 양의 비는, 청동 코팅의 경도와 색 등의 특성에 상당한 영향을 미친다. 예를 들어, 주석/구리의 비가 40/60 인 경우, 비교적 부드러운(soft) 은-착색 코팅, 이른바, 백 청동이 석출된다. 주석/구리의 비가 20/80 인 경우, 황금-착색 코팅인 이른바, 황 청동이, 주석/구리의 비가 10/90인 경우, 적색 금-착색코팅인 이른바, 적 청동이 석출된다.A particularly advantageous advantage of the invention is that the process according to the invention makes it possible to produce so-called "bronze bronzes" with a copper content of more than 60%, in which case the copper content is each 95 wt%, depending on the desired properties. It can be up to%. On the other hand, the ratio of the amount of copper to the amount of tin in the electrolyte significantly affects properties such as hardness and color of the bronze coating. For example, when the tin / copper ratio is 40/60, a relatively soft silver-colored coating, so-called white bronze, is deposited. When the tin / copper ratio is 20/80, the so-called sulfur bronze, which is a golden-colored coating, and the so-called red bronze, which is a red gold-colored coating, is precipitated when the tin / copper ratio is 10/90.
나아가, 구리함량이 10% 이상인 고함량 주석의 백 청동 (high-tin white bronze)의 석출도 가능하다.Furthermore, precipitation of high-tin white bronzes of 10% or more copper is also possible.
청동코팅의 소망하는 외관에 따라, 각각의 경우, 다양한 구리 함량을 가진 전해질에, 광택제 등의 첨가제를 첨가할 수 있다. 유리하게는, 상기 전해질은 방향족 카르보닐 화합물 및 α,β-불포화 카르보닐 화합물로부터 선택한 광택제를 포함할 수 있다. 상기 광택제의 농도는 전해질 1L 당, 0-5 g이다.Depending on the desired appearance of the bronze coating, in each case, additives such as brighteners can be added to the electrolyte with various copper contents. Advantageously, the electrolyte may comprise a brightener selected from aromatic carbonyl compounds and α, β-unsaturated carbonyl compounds. The concentration of the brightener is 0-5 g, per liter of electrolyte.
본 발명에 대한 예시를 위해 바람직한 실시예가 이하 보다 상세히 제공되지만, 본 발명이 이들 실시예에 한정되는 것은 아니다.Preferred embodiments are provided in more detail below for illustration of the invention, but the invention is not limited to these examples.
전해질 조성:Electrolyte Composition:
본 발명에 따른 강산성 전해질의 기본 전해질: (전해질 L 당)Basic electrolyte of strongly acidic electrolyte according to the present invention: (per L electrolyte)
2가 주석 2-75g 2-75 g divalent tin
2가 구리 2-70g 2-70 g of divalent copper
방향족의 비이온성 습윤제 2-40g 및,2-40 g of aromatic nonionic wetting agent, and
무기 및/또는 알킬술폰산 140-382g.Inorganic and / or alkylsulfonic acid 140-382 g.
선택에 따라, 다른 성분들이 상기 전해질에 첨가될 수 있다 (전해질 L 당):Optionally, other components may be added to the electrolyte (per L electrolyte):
음이온성 및/또는 지방족의 비이온성 습윤제 0-10g0-10 g of anionic and / or aliphatic nonionic wetting agents
안정화제 및/또는 배위제 0-50gStabilizer and / or coordination agent 0-50 g
산화 억제제 0-5gAntioxidant inhibitor 0-5g
광택제 0-5gPolishing 0-5 g
3가 비스무스 0-5gTrivalent Bismuth 0-5g
2가 아연 0-25g.Divalent zinc 0-25 g.
석출된 청동 코팅이 특정 색을 띠도록 하기 위해서는, 상기 전해질의 각 성분을 하기 실시예에 나타낸 바와 같이 변화시킨다. 상응하는 공정에 관한 추가 정보 및 개별 코팅의 다른 특성들은 표 1에 나타내었다:In order for the precipitated bronze coating to have a particular color, each component of the electrolyte is changed as shown in the following examples. Further information on the corresponding process and other properties of the individual coatings are shown in Table 1:
실시예 1 (적 청동) Example 1 (Red Bronze)
Sn2+ 4g/LSn 2+ 4g / L
Cu2+ 18g/LCu 2+ 18g / L
메탄술폰산 286g/LMethanesulfonic acid 286 g / L
방향족 비이온성 습윤제 3g/LAromatic Nonionic Wetting Agent 3g / L
지방족 비이온성 습윤제 0.4 g/LAliphatic nonionic wetting agent 0.4 g / L
산화 억제제 2g/LAntioxidant inhibitor 2g / L
배위화제 20mg/LCoordinating agent 20mg / L
실시예 2a (황 청동) Example 2a (sulfur bronze)
Sn2+ 4g/LSn 2+ 4g / L
Cu2+ 18g/LCu 2+ 18g / L
메탄술폰산 240g/LMethanesulfonic Acid 240g / L
방향족 비이온성 습윤제 32.2g/LAromatic Nonionic Wetting Agent 32.2g / L
산화 억제제 2g/LAntioxidant inhibitor 2g / L
안정화제/배위화제 25mg/LStabilizer / Coordinator 25mg / L
실시예 2b (황 청동) Example 2b (sulfur bronze)
Sn2+ 4g/LSn 2+ 4g / L
Cu2+ 18g/LCu 2+ 18g / L
메탄술폰산 286g/LMethanesulfonic acid 286 g / L
방향족 비이온성 습윤제 32.2g/LAromatic Nonionic Wetting Agent 32.2g / L
광택제 6mg/LPolish 6mg / L
산화 억제제 2g/LAntioxidant inhibitor 2g / L
안정화제/배위화제 50mg/LStabilizer / Coordinator 50mg / L
실시예 3 (백 청동) Example 3 (white bronze)
Sn2+ 5g/LSn 2+ 5g / L
Cu2+ 10g/LCu 2+ 10g / L
메탄술폰산 240g/LMethanesulfonic Acid 240g / L
방향족 비이온성 습윤제 32.2g/LAromatic Nonionic Wetting Agent 32.2g / L
광택제 6mg/LPolish 6mg / L
산화 억제제 2g/LAntioxidant inhibitor 2g / L
안정화제/배위화제 25mg/LStabilizer / Coordinator 25mg / L
실시예 4 [매트(matte) 백청동] Example 4 [matte white bronze]
Sn2+ 18g/LSn 2+ 18g / L
Cu2+ 2g/LCu 2+ 2g / L
메탄술폰산 258g/LMethanesulfonic acid 258g / L
방향족 비이온성 습윤제 9g/L.9 g / L aromatic nonionic wetting agent.
석출된 청동 코팅의 경도 및/또는 연성을 향상시키기 위해서는, 하기 제시한 실시예와 같이, 아연 및/또는 비스무스를 전해질에 첨가할 수 있다. 상응하는 공정 조건의 추가적 자료 및 개별 코팅의 다른 특성들을 표 1에 나타내었다.In order to improve the hardness and / or ductility of the precipitated bronze coating, zinc and / or bismuth may be added to the electrolyte as in the examples given below. Additional data on the corresponding process conditions and other properties of the individual coatings are shown in Table 1.
실시예 5 (고 연성) Example 5 (high ductility)
Sn2+ 4g/LSn 2+ 4g / L
Cu2+ 18g/LCu 2+ 18g / L
메탄술폰산 238g/LMethanesulfonic acid 238g / L
방향족 비이온성 습윤제 32.2g/LAromatic Nonionic Wetting Agent 32.2g / L
광택제 3mg/LPolish 3mg / L
산화 억제제 2g/LAntioxidant inhibitor 2g / L
안정화제/배위화제 25mg/LStabilizer / Coordinator 25mg / L
ZnSO4 20g/LZnSO 4 20g / L
실시예 6 (경도) Example 6 (hardness)
Sn2+ 4g/LSn 2+ 4g / L
Cu2+ 18g/LCu 2+ 18g / L
메탄술폰산 238g/LMethanesulfonic acid 238g / L
방향족 비이온성 습윤제 32.2g/LAromatic Nonionic Wetting Agent 32.2g / L
산화 억제제 2g/LAntioxidant inhibitor 2g / L
안정화제/배위화제 25mg/LStabilizer / Coordinator 25mg / L
Bi3+ 0.1g/LBi 3+ 0.1g / L
실시예 7 (황 청동) Example 7 (sulfur bronze)
Sn2+ 14.5g/LSn 2+ 14.5g / L
Cu2+ 65.5g/LCu 2+ 65.5 g / L
메탄술폰산 382g/LMethanesulfonic acid 382 g / L
방향족 비이온성 습윤제 32.2g/LAromatic Nonionic Wetting Agent 32.2g / L
산화 억제제 4g/LAntioxidant inhibitor 4g / L
안정화제/배위화제 25mg/LStabilizer / Coordinator 25mg / L
ZnSO4 20g/LZnSO 4 20g / L
이들 예시적 전해질 조성으로부터, 하기 표에 나타낸 공정 조건하에 특정한 특성을 가진 코팅을 석출시켰다:From these exemplary electrolyte compositions, coatings having specific properties were deposited under the process conditions shown in the following table:
Claims (35)
Applications Claiming Priority (2)
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EP02022718.7 | 2002-10-11 | ||
EP02022718.7A EP1408141B1 (en) | 2002-10-11 | 2002-10-11 | Process and electrolyte for the galvanic deposition of bronze |
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KR100684818B1 true KR100684818B1 (en) | 2007-02-22 |
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US (1) | US20060137991A1 (en) |
EP (1) | EP1408141B1 (en) |
JP (1) | JP4675626B2 (en) |
KR (1) | KR100684818B1 (en) |
CN (1) | CN1703540B (en) |
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2003
- 2003-10-10 JP JP2004544134A patent/JP4675626B2/en not_active Expired - Lifetime
- 2003-10-10 CN CN2003801012538A patent/CN1703540B/en not_active Expired - Lifetime
- 2003-10-10 KR KR1020057004846A patent/KR100684818B1/en not_active Expired - Lifetime
- 2003-10-10 US US10/531,142 patent/US20060137991A1/en not_active Abandoned
- 2003-10-10 WO PCT/EP2003/011229 patent/WO2004035875A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
EP1408141B1 (en) | 2014-12-17 |
CN1703540B (en) | 2010-10-06 |
WO2004035875A3 (en) | 2005-04-14 |
EP1408141A1 (en) | 2004-04-14 |
ES2531163T3 (en) | 2015-03-11 |
US20060137991A1 (en) | 2006-06-29 |
WO2004035875A2 (en) | 2004-04-29 |
JP4675626B2 (en) | 2011-04-27 |
CN1703540A (en) | 2005-11-30 |
KR20050059174A (en) | 2005-06-17 |
JP2005537394A (en) | 2005-12-08 |
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