KR100684043B1 - 백색 발광다이오드 및 그의 제조 방법 - Google Patents
백색 발광다이오드 및 그의 제조 방법 Download PDFInfo
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- KR100684043B1 KR100684043B1 KR1020050081937A KR20050081937A KR100684043B1 KR 100684043 B1 KR100684043 B1 KR 100684043B1 KR 1020050081937 A KR1020050081937 A KR 1020050081937A KR 20050081937 A KR20050081937 A KR 20050081937A KR 100684043 B1 KR100684043 B1 KR 100684043B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
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Abstract
Description
Claims (7)
- 청색 반도체 발광다이오드 칩,상기 발광다이오드로부터 발광하는 청색광의 확산영역에서 이 청색광의 일부를 흡수하여 이 청색광과 다른 파장대의 빛을 발광하는 유로퓸으로 활성화된 바륨실리케이트계 녹색 형광체와상기 청색 반도체 발광다이오드로 부터의 청색광 및 녹색 형광체로 부터의 녹색광의 일부를 흡수하여 다른 파장대의 빛을 발광하는 바륨실리케이트계 적색형 광체를 포함하며,상기 청색 반도체 발광다이오드로 부터의 청색광, 녹색 형광체로 부터의 녹색광과 적색 형광체로 부터의 적색광의 혼색에 의한 백색광을 발광하는 것을 특징으로 하는 백색 발광다이오드.
- 제 1항에 있어서,상기 녹색 형광체는 하기 일반식으로 표시되는 바륨실리케이트계의 녹색 형광체이고,(Ba1-x-y-zRExAy)2SiO4:Euz(상기 화학식에서, RE는 희토류 원소로서 Y, Lu, Sc, La, Gd, Sm, Pr, Nd, Eu, Dy, Ho, Er, Tm 및 Yb으로 이루어진 군으로부터 선택되는 적어도 하나의 원소이고, A는 전형원소의 금속 원소로서 Be, Mg, Ca, Sr, Ba및 Ra으로 이루어진 군으로부터 선택되는 적어도 하나의 원소로서 0 ≤ x < 0.5이고, 0 ≤ y <0.65이고, 0 < z < 0.5이며, 0 < x+y+z < 1이다)상기 녹색 형광체는 200 ㎚ 내지 480 ㎚ 범위에서 흡수피크를 나타내고, 515㎚ 내지 540㎚ 범위에서 발광피크를 나타내는 것을 특징으로 하는 백색 발광다이오드.
- 제 1항에 있어서,상기 적색 형광체는 하기 일반식으로 표시되는 바륨실리케이트계의 적색 형광체이고,(Ba1-x-y-zRExAy)3SiO5:Euz(상기 화학식에서, RE는 희토류 원소로서 Y, Lu, Sc, La, Gd, Sm, Pr, Nd, Eu, Dy, Ho, Er, Tm 및 Yb으로 이루어진 군으로부터 선택되는 적어도 하나의 원소이고, A는 전형원소의 금속 원소로서 Be, Mg, Ca, Sr, Ba및 Ra으로 이루어진 군으로부터 선택되는 적어도 하나의 원소로서 0 ≤ x < 0.5이고, 0 ≤ y <1이고, 0 < z < 0.5이며, 0 < x+y+z < 1이다)상기 적색 형광체는 200 ㎚ 내지 550 ㎚ 범위에서 흡수피크를 나타내고, 550㎚ 내지 650㎚ 범위에서 발광피크를 나타내는 것을 특징으로 하는 백색 발광다이오드.
- 제 1항에 있어서,상기 발광다이오드는 광경로차 감소를 위하여 투명한 실리콘층 또는 투명한 몰드층을 더 포함하는 것을 특징으로 하는 백색 발광다이오드.
- 제 2항 또는 제3항에 있어서,상기 녹색 및 적색 형광체는 구형 입자, 다각형 또는 판형의 형태를 가지며, 입자크기는 0.1㎛ 내지 40㎛의 범위인 것을 특징으로 하는 백색 발광다이오드.
- 청색 반도체 발광다이오드,상기 발광다이오드로부터 발광하는 청색광의 확산영역에서 이 청색광의 일부를 흡수하여 이 청색광과 다른 파장대의 빛을 발광하는 바륨실리케이트계 녹색 형광체와상기 청색 반도체 발광다이오드로 부터의 청색광 및 녹색 형광체로 부터의 녹색광의 일부를 흡수하여 다른 파장대의 빛을 발광하는 바륨실리케이트계 적색형광체로 부터의 혼색에 의한 백색광을 발광하는 장치의 제조 방법에 있어서,상기 발광다이오드로부터 발광한 빛을 반사하기 위한 반사판 내부에 상기 발광다이오드를 위치시키는 단계 및상기 발광다이오드를 상기 녹색 형광체가 혼합된 몰드 수지로 몰딩하고, 그 상부에 적색 형광체를 몰딩하는 단계로 이루어지는 것을 특징으로 하는 백색 발광다이오드의 제조 방법.
- 청색 반도체 발광다이오드,상기 발광다이오드로부터 발광하는 청색광의 확산영역에서 이 청색광의 일부를 흡수하여 이 청색광과 다른 파장대의 빛을 발광하는 바륨실리케이트계 녹색 형광체와상기 청색 반도체 발광다이오드로 부터의 청색광 및 녹색 형광체로 부터의 녹색광의 일부를 흡수하여 다른 파장대의 빛을 발광하는 바륨실리케이트계 적색형광체로 부터의 혼색에 의한 백색광을 발광하는 백색 발광다이오드에 있어서,상기 녹색 및 적색 형광체의 입도는 서로 상이하고,상기 녹색 및 적색 형광체의 입자는 구형, 다각형 또는 판형의 형태를 가지며, 상기 녹색 형광체의 입자크기는 10㎛ 내지 40㎛(대립자)의 범위이고,상기 적색 형광체의 입자크기는 0.1㎛ 내지 10㎛(소립자)의 범위인 것을 특징으로 하는 백색 발광다이오드.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013129854A1 (ko) * | 2012-02-27 | 2013-09-06 | 경기대학교 산학협력단 | 실리콘 산질화물 형광체, 이의 제조 방법 및 이를 포함하는 광소자 |
KR20170024412A (ko) * | 2015-08-25 | 2017-03-07 | 엘지이노텍 주식회사 | 발광장치 |
KR20210062602A (ko) * | 2014-10-08 | 2021-05-31 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
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JP2002060747A (ja) | 1999-09-27 | 2002-02-26 | Lumileds Lighting Us Llc | 3色型白色光ledランプ |
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Patent Citations (2)
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KR20010089509A (ko) * | 1999-09-27 | 2001-10-06 | 추후기재 | 완전한 형광 물질 변환에 의해 백색광을 생성하는 발광다이오드 소자 |
JP2002060747A (ja) | 1999-09-27 | 2002-02-26 | Lumileds Lighting Us Llc | 3色型白色光ledランプ |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013129854A1 (ko) * | 2012-02-27 | 2013-09-06 | 경기대학교 산학협력단 | 실리콘 산질화물 형광체, 이의 제조 방법 및 이를 포함하는 광소자 |
US9030092B2 (en) | 2012-02-27 | 2015-05-12 | Kyounggi University Industry & Academia Cooperation Foundation | Silicon oxynitride phosphore, production method for same, and optical element comprising same |
KR20210062602A (ko) * | 2014-10-08 | 2021-05-31 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
KR102450623B1 (ko) * | 2014-10-08 | 2022-10-07 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
KR20220141262A (ko) * | 2014-10-08 | 2022-10-19 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
KR102648863B1 (ko) * | 2014-10-08 | 2024-03-19 | 서울반도체 주식회사 | 발광 다이오드 패키지 |
KR20170024412A (ko) * | 2015-08-25 | 2017-03-07 | 엘지이노텍 주식회사 | 발광장치 |
KR102432030B1 (ko) | 2015-08-25 | 2022-08-12 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광장치 |
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