KR100649982B1 - Protective cap bonding process line and protective cap bonding method using the same - Google Patents

Abstract

The present invention relates to a protective cap bonding process line and a protective cap bonding method using the same. The present invention relates to a transfer chamber in which a transfer robot system is installed, a glass lamination chamber connected to the transfer chamber and in which organic cell array glasses are stacked, A buffer chamber to which a metal can tray connected to a transfer chamber and arranged with a protective cap is supplied, a dispensing chamber connected to the transfer chamber and applying a sealant to the protective cap, and the organic cell array connected to the transfer chamber, respectively. It comprises a bonding chambers for bonding the protective caps arranged in the glass and metal can tray, and also through the bonding process. Therefore, the present invention not only simplifies the process line for bonding the protective caps to the organic cell array glass, but also the simplification of the bonding process, thereby reducing the line installation cost, increasing productivity, and increasing the stability of the process line. .

Description

PROTECTING CAP ATTACHMENT PROCESSING LINE AND PROTECTING CAP ATTACHMENT METHOD USING THE SAME}

1 is a perspective view illustrating a general organic cell array glass, a protective cap, and a metal can tray;

2 is a plan view schematically showing a conventional protective cap bonding process line,

Figure 3 is a front view schematically showing the alignment equipment constituting the protective can bonding process line,

Figure 4 is a front view schematically showing a bonding apparatus constituting the protective can bonding process line,

5 is a front sectional view showing a state in which a protective cap is attached to the organic cell array glass by the bonding device;

Figure 6 is a plan view schematically showing one embodiment of the protective cap bonding process line of the present invention,

7 and 8 are schematic front and plan views of the bonding apparatus constituting the protective cap bonding process line of the present invention;

9 is a flow chart showing one embodiment of the protective cap bonding method of the present invention,

10, 11 and 12 are front views respectively showing a process of the bonding process in the bonding apparatus constituting the protective cap bonding process line of the present invention.

** Description of symbols for the main parts of the drawing **

110; Transfer robot system 120; Fastening device

121; Loading stage 122; Unloading stage

124; Mask C2; Glass lamination chamber

C4; Buffer chamber C5; Dispensing chamber

C9; Transfer chamber C10; Cementing chamber

G; Organic cell array glass M; Protective cap

T; Metal can tray

The present invention relates to a protective cap bonding process line and a protective cap bonding method using the same, in particular, not only simplify the line for bonding the protective caps to the organic cell array glass, but also simplify the bonding process, and also The present invention relates to a protective cap bonding process line capable of increasing stability and a protective cap bonding method using the same.

Organic Light Emitting Diodes (OLEDs) are display devices that excite molecules by recombining electrons and holes injected through a cathode and an anode into an organic (low molecular or polymer) thin film. ) Is generated, and light of a specific wavelength is generated by the energy from the excitation molecule, which is used to display a desired display. The organic light emitting diode is also called OELD (Organic Electroluminessent Device), hereinafter referred to as organic electroluminescent device.

The organic electroluminescent device is a self-emission display that electrically excites organic materials and emits light, and is attracting attention as a next-generation display due to advantages such as low voltage driving property, thin film property, wide viewing angle, and quick response, and according to its structure, PM It is classified into (Passive Matrix) OLED and AM (Active Matrix) OLED.

As an example of the organic light emitting diode, the organic light emitting diode is formed of an indium-tin oxide glass in which a transparent positive electrode layer is formed on a glass having a predetermined area, and an organic layer formed after the transparent positive electrode layer of the ithio glass. It comprises an EL layer (Organic Electroluminessent Layer) and a negative electrode film formed subsequent to the organic EL layer. The negative electrode film is made of a metal thin film such as aluminum to reflect light.

The organic electroluminescent device is manufactured by various methods, and the manufacturing method is generally a transparent positive electrode layer, an organic EL layer, and a negative electrode on a glass 1 having a predetermined area as a semiconductor manufacturing process, as shown in FIG. To form a film. In the glass, the unit cells 2 including the transparent positive electrode layer, the organic EL layer, and the negative electrode film are arranged, and the glass 1 is cut on the basis of the unit cells 2 to cut the glass. The unit cell element to be constructed is manufactured.

Meanwhile, in order to protect each unit cell 2 formed on the glass 1, that is, the organic EL layer, the negative electrode film, and the like, the protective caps M having a predetermined shape cover the unit cells 2. Attached to 1). The protective cap M includes a metal can 3 formed of a metal plate having a predetermined shape and a getter 4 attached to the metal can 3 to remove moisture.

The protective cap M may be manufactured by first manufacturing a metal can 3 having a predetermined shape by using a press or the like, and then removing the foreign matter attached to the metal can 4 by removing the metal can 3 with a liquid. Will be cleaned. In order to enhance the adhesion of the cleaned metal can 3, the metal can 3 is plasma cleaned and a gather 4 is attached to the inside of the plasma cleaned metal can 3. The protective caps M thus produced are attached to each unit cell 2 of the glass 1 by a sealant 5. In this case, a metal can tray T in which a plurality of protective caps M are arranged is used.

The manufacturing process as described above is carried out in a manufacturing line capable of mass production, and the manufacturing line is a semiconductor unit cell (2) consisting of a transparent positive electrode layer, an organic EL layer and a negative electrode film on the glass (1) usually The line formed by a manufacturing process, the line which manufactures the said protective cap M, the glass in which the unit cell 2 was formed (henceforth organic cell array glass) G, and the said protective cap M are joined together. And a line for cutting a unit cell device by cutting the organic cell array glass G to which the protective caps M are attached.

FIG. 2 illustrates a bonding process line in which organic cell array glass and protective caps are bonded together. As shown in FIG. 2, the process line includes a process chamber C1 in which the organic cell array glass G is manufactured. And a glass lamination chamber C2 connected to the process chamber C1, and a first transfer chamber C3 connected to the glass lamination chamber C2. The cassette 10 is installed in the glass stacking chamber C2, and the organic cell array glasses G manufactured through the process chamber C1 are stacked on the cassette 10. The transfer robot system 20 is installed in the first transfer chamber C3.

A buffer chamber C4, to which a metal can tray T in which protective caps M to which a gatherer 4 is attached, is arranged, is supplied to the metal can 3, is connected to the first transfer chamber C3. . The buffer chamber C4 is located opposite the glass lamination chamber C2.

Two dispensing chambers C5 each having a dispenser 30 for applying the sealant 5 to the protective caps M arranged on the metal can tray T are respectively disposed in the first transfer chamber C3. It is provided to be connected. The two dispensing chambers C5 are located at the side of the buffer chamber C4.

A preliminary alignment chamber C6 is provided to be connected to the first transfer chamber C3, and a second transfer chamber C7 is provided to be connected to the preliminary alignment chamber C6, and the second transfer chamber C7 is provided. And two coalescing chambers C8, each of which is connected thereto. Alignment equipment 40 for pre-aligning the organic cell array glass G and the metal can tray T is installed in the preliminary alignment chamber C6, and the transfer robot system in the second transfer chamber C7. 50 are installed, and the bonding device 60 is installed in the adhesion chamber C8, respectively.

In the bonding process line as described above, the process of bonding the organic cell array glass and the protective caps is as follows.

First, the transfer robot installed in the first transfer chamber C3 transfers the metal can tray T supplied through the buffer chamber C4 to the dispenser 30 installed in the dispensing chamber C5, respectively. When the sealant 5 is applied to the protective caps M arranged on the metal can tray T by the dispenser 30, the transfer robot 20 of the first transfer chamber C3 is moved to the metal can tray. (T) is transferred to the alignment equipment 40 of the preliminary alignment chamber C6.

3 schematically shows an example of the alignment equipment. As shown in the drawing, the metal can tray T transferred to the alignment equipment 40 of the preliminary alignment chamber C6 is placed on the loading stage 41 of the preliminary alignment equipment. When the alignment stage 42 is raised, the metal can tray T placed on the loading stage 41 is placed on the alignment stage 42. The position pins 43 of the alignment stage 41 are inserted into the position holes H formed in the metal can tray T, which causes the metal can tray T to align to the alignment stage 41. It is not only fixed but also positioned in a set position. The alignment stage 42 on which the metal can tray T is seated descends.

At the same time, a transfer robot installed in the first transfer chamber C3 transfers the organic cell array glass G stacked in the glass stacking chamber C2 to the alignment equipment 40 of the preliminary alignment chamber C6. The organic cell array glass G transferred to the alignment equipment 40 is placed on the loading stage 41 of the alignment equipment. The organic cell array glass G placed on the loading stage 41 is adsorbed by the glass adsorption means 44 located above the loading stage 42 and adsorbed on the glass adsorption means 44. (G) and the metal can tray T seated on the alignment stage 42 are primarily aligned and placed on the alignment stage 42.

The primary aligned organic cell array glass G and the metal can tray T are transferred by the transfer robot 50 of the second transfer chamber C7 to attach the bonding unit 60 to the adhesion chamber C8. Is supplied.

4 schematically shows an example of the cementation apparatus 60 installed in the cementation chamber C8. As shown in the drawing, the organic cell array glass G and the metal can tray T supplied to the bonding device 60 of the bonding chamber C8 are placed on the loading stage 61 of the bonding device 60. do. The organic cell array glass G and the metal can tray T placed on the loading stage 61 are placed on the alignment stage 62 as the alignment stage 62 is raised.

The metal can tray T and the organic cell array glass G placed on the alignment stage 62 are aligned with the mask 63 positioned above the alignment stage 62. When the alignment is finished, the alignment stage 62 is raised. The organic cell array glass G is torched on the surface of the mask 63.

When the organic cell array glass G and the mask 63 are torched, as shown in FIG. 5, the can bushers 64 of the alignment stage 62 are arranged in the metal can tray T. The protective caps M are pushed up to be in close contact with the organic cell array glass G. The UV lamp 65 provided on the mask 63 is irradiated with ultraviolet rays to cure the sealant 5 applied to the protective cap M. When curing of the sealant 5 is completed and the protective caps M are attached to the organic cell array glass G, the alignment stage 62 is lowered and the organic cell array glass to which the protective caps M are attached ( G) is transferred to the next process and the metal can tray T is returned to the unloading position.

However, the bonding process line as described above is not only provided with a preliminary alignment chamber C6 in which the alignment equipment 40 is installed for preliminary alignment of the organic cell array glass G and the metal can tray T, but also the preliminary alignment thereof. Since the transfer chamber in which the transfer robot system for transferring the organic cell array glass G and the metal can tray T is installed into the chamber C6 must be provided, not only the process line is complicated but also a lot of space for the process line is installed. There is a problem that is occupied.

In addition, the organic cell array glass G and the metal can tray T are transferred to the preliminary alignment chamber C6 to align the primary path in the preliminary alignment chamber C6, and to align the primary aligned organic cell array glass. Since (G) and the metal can tray (T) are secondly aligned with the mask (63) in the bonding chamber (C8), the organic cell array glass (G) and the metal can tray (T) are not only transferred, but also complicated. Since the transfer time takes a lot, there is a problem that the overall process time is increased to lower the productivity.

In addition, when a failure occurs in the preliminary alignment chamber C6 and the process is stopped, the entire process line is stopped, resulting in an unstable line and deteriorating the reliability of the line.

SUMMARY OF THE INVENTION An object of the present invention devised in view of the above-described problems is not only a process line for bonding protective caps to an organic cell array glass, but also a protection cap bonding process line for simplifying the bonding process and the same. It is to provide a protective cap bonding method used.

In addition, another object of the present invention is to provide a protective cap bonding process line and a protective cap bonding method using the same to increase the stability of the bonding process line.

In order to achieve the object of the present invention as described above, a transfer chamber in which a transfer robot system is installed, a glass lamination chamber connected to the transfer chamber and stacked with organic cell array glasses, and a protective cap connected to the transfer chamber are arranged. A buffer chamber to which a metal can tray is supplied, a dispensing chamber connected to the transfer chamber and applying a sealant to the protective cap, and a protective cap connected to the transfer chamber and arranged in the organic cell array glass and the metal can tray, respectively. A protective cap cementation process line is provided comprising an adhering chamber for adhering them.

In addition, in the protective cap bonding process line including a bonding chamber provided with a bonding stage including a loading stage, an alignment stage, a mask, and a UV lamp, inputting a position of the mask; Placing a metal can tray placed on the alignment stage and moving the alignment stage to align the mask and the metal can tray; placing an organic cell array glass on the loading stage; To raise the organic cell array glass on the metal can tray and move the alignment stage to align the organic cell array glass and the mask; and the alignment stage at the position where the organic cell array glass and the mask are aligned. Lower the organic cell array glass to the loading ste Placing the paper on the paper, moving the alignment stage to move the metal can tray to the position aligned with the initial mask, and raising the alignment stage to place the organic cell array glass on the metal can tray. And to further raise the alignment stage to torch the organic cell array glass and the mask.

EMBODIMENT OF THE INVENTION Hereinafter, the protective cap bonding process line of this invention and the protective cap bonding method using the same are demonstrated according to the Example shown in an accompanying drawing.

6 is a plan view showing one embodiment of the protective cap bonding process line of the present invention. As shown in the drawing, the protective cap bonding process line includes a process chamber C1 in which an organic cell array glass G in which unit cells are formed by a semiconductor manufacturing process is formed on a glass having a predetermined area. The glass lamination chamber C2 is provided to be connected to the chamber C1, and the transfer chamber C9 is provided to be connected to the glass lamination chamber C2.

The cassette 100 is installed in the glass stacking chamber C2, and the organic cell array glasses G manufactured through the process chamber C1 are stacked on the cassette 100. The transfer robot system 110 is installed in the transfer chamber C9.

A buffer chamber C4 is provided to be connected to the transfer chamber C9, and a plurality of dispensing chambers C5 are provided to be connected to the transfer chamber C9.

The metal can tray T in which the protective caps M are arranged is supplied through the buffer chamber C4, and the protective caps M arranged in the metal can tray T are supplied to the dispensing chamber C5. The dispenser 120 for applying the sealant 5 is installed. Preferably, the dispensing chamber C5 is composed of two, and the dispensing chamber C5 may be composed of two or more. The buffer chamber C4 is positioned opposite the glass lamination chamber C2.

A plurality of coalescing chambers C10 are provided to be connected to the transfer chamber C9. A bonding device 120 for bonding the protective caps M arranged on the organic cell array glass G and the metal can tray T is installed in the bonding chambers C10, respectively. The coalescing chambers C10 are located opposite the dispensing chambers C5, and the coalescing chambers C10 are preferably composed of two. Of course, the bonding chambers C10 may be composed of two or more.

As shown in FIGS. 7 and 8, the bonding apparatus 120 is provided in the bonding chamber C10 and is positioned in a loading stage 121 and an alignment stage (below) of the loading stage 121. 122, a mask 123 disposed above the loading stage 121, a UV lamp 124 disposed above the mask 123 to irradiate ultraviolet rays, and an upper portion of the mask 123. It is configured to include a vision camera (125) fixedly installed to position.

The loading stage 121 includes two supports, and the two supports are installed to be movable in a horizontal direction. The alignment stage 122 is configured to be movable in the rotational and horizontal directions as well as to move in the vertical direction. Position pins 126 are also provided at the alignment stage 122. An alignment mark is formed on the mask 123, and the alignment mark becomes a reference coordinate when the alignment mark is aligned with the organic cell array glass G and the metal can tray T.

A process of bonding the protective caps M arranged on the metal can tray T to the organic cell array glass G in the protective cap bonding process line as described above is as follows.

Figure 9 is a flow chart illustrating one embodiment of a method for securing a protective cap of the present invention. A process of attaching the protective caps arranged on the metal can tray T to the organic cell array glass G will be described with reference to this.

First, the transfer robot 110 installed in the transfer chamber C9 transfers the metal can tray T supplied through the buffer chamber C4 to the dispenser 130 installed in the dispensing chamber C5, respectively. When the sealant 5 is applied to each of the protective caps M arranged on the metal can tray T by the dispenser 130, the transfer robot 110 of the transfer chamber C9 moves to the metal can tray T. ) Is transferred to the bonding device 120 of the bonding chamber C10.

The metal can tray T transferred to the bonding device 120 of the bonding chamber C10 is placed on the loading stage 121. The metal can tray T placed on the loading stage 121 receives position information by the vision camera 125 and compares the input position information with the position information of the mask 123 to calculate a position deviation. . When the mask 123 is mounted in the cementation chamber C10, the position information of the mask 123 is input and stored in advance, and the position information may be recognized by the vision camera 125 in the metal can tray T. The alignment mark is formed.

The metal can is moved by inserting the position pins 126 of the alignment stage 122 into the position holes H formed in the metal can tray T. After fixing the tray T to the alignment stage 122, the alignment stage 122 is moved to align the metal can tray T and the mask 123 as shown in FIG. 10. At this time, the loading stage 121 is in an open state. The alignment stage 122 is lowered as it is while the metal can tray T and the mask 123 are aligned. The loading stage 121 is moved to its original position.

At the same time, the transfer robot installed in the transfer chamber C9 transfers the organic cell array glass G stacked in the glass stacking chamber C2 to the bonding apparatus 120 installed in the bonding chamber C10 and the bonding apparatus. The organic cell array glass G transferred to 120 is placed on the loading stage 121.

In the organic cell array glass G placed on the loading stage 121 of the bonding apparatus 120, position information is input by the vision camera 125, and the position information of the organic cell array glass G is compared with the position information of the mask 123. The position deviation is calculated.

 Then, the alignment stage 122 is raised, and the organic cell array glass G is placed on the metal can tray T fixed on the alignment stage 122 and then aligned. The stage 122 is moved to align the organic cell array glass G and the mask 123. The alignment stage 122 is lowered as it is while the organic cell array glass G and the mask 123 are aligned, and the organic cell array glass G is placed on the loading stage 121. The in stage 122 is moved to move the metal can tray T fixed on the alignment stage 122 to an initial position aligned with the mask 123.

After the metal can tray T is moved to a position aligned with the mask 123, as shown in FIG. 12, the alignment stage 122 is raised as it is and on the metal can tray T. The organic cell array glass G is placed, and the alignment stage 122 is further raised by a predetermined height while the organic cell array glass G is placed on the metal can tray T. After checking the alignment state between the organic cell array glass G placed on the alignment stage 122 and the mask 123, the alignment stage 122 is raised to mask the organic cell array glass G. 123) torched. If the positions of the organic cell array glass G and the mask 123 do not coincide with each other, the organic cell array glass G is aligned with the mask 123.

When the organic cell array glass G and the mask 123 are torched, the can bushers 64 included in the alignment stage 122 push up the protective caps M arranged on the metal can tray T. It comes in close contact with the cell array glass G. The UV lamp 124 provided on the mask 123 is irradiated with ultraviolet rays to cure the sealant 5 applied to the protective cap M. When curing of the sealant 5 is completed and the protective caps M are attached to the organic cell array glass G, the alignment stage 122 is lowered and the organic cell array glass G having the protective caps M attached thereto. ) Is transferred to the next process and the metal can tray T is returned to the unloading position.

The present invention eliminates the preliminary alignment chamber C6 in which the alignment equipment 40 is installed in the prior art and the second transfer chamber C7 in which the transfer robot system 50 is provided, thereby protecting the organic cell array glass G. The process line for joining the caps M is simplified. In addition, since the process line is simplified, it takes up less space for installation.

In addition, according to the present invention, the transfer robot 110 of the transfer chamber C9 transfers the metal can tray T and the organic cell array glass G directly to the bonding device 120 of the bonding chamber C10. Not only shortens, but also reduces the number of processes (movements), thereby reducing the overall process time.

In addition, the present invention is provided with a plurality of bonding chambers (C10) to be connected to the transfer chamber (C9) process even if the work is stopped in one of the bonding chambers (C10) is continued in another bonding chamber (C10) The stability of becomes high.

In addition, in the prior art, the metal can tray T and the organic cell array glass G0 are first aligned in the preliminary alignment chamber C6, and then the metal can tray T and the organic cells aligned by the transfer robot 50. Since the array glass G is transferred to the bonding chamber C8, there is a possibility that an alignment error occurs during the transfer. However, in the present invention, the metal can tray T and the organic cell array glass G may be combined with the bonding chamber C10. Since the alignment is immediately performed at, the alignment error is prevented from being raised, thereby increasing the alignment accuracy.

As described above, the protective cap bonding process line of the present invention and the protective cap bonding method using the same not only simplifies the process line for bonding the protective caps to the organic cell array glass, but also the bonding process is simplified, thus the line installation cost. It has the effect of reducing the cost and increasing productivity.

In addition, the present invention has an effect of increasing the stability of the process line because it increases the stability of the process line and the degree of alignment purification.

Claims (6)

A transfer chamber in which a transfer robot system is installed; A glass lamination chamber connected to the transfer chamber and in which organic cell array glasses are stacked; A buffer chamber connected to the transfer chamber and supplied with a metal can tray having a protective cap arranged thereon; Dispensing chambers connected to said transfer chamber and dispensing a sealant to said protective cap; And a bonding chamber for connecting the protective caps respectively connected to the transfer chamber and arranged in the organic cell array glass and the metal can tray. 2. A protective cap cementation process line according to claim 1, wherein the cementation chambers are two. A protective cap bonding process line comprising a bonding chamber provided with a bonding stage including a loading stage, an alignment stage, a mask, and a UV lamp, Inputting a position of the mask; Placing the metal can tray placed on the loading stage on the alignment stage and moving the alignment stage to align the mask and the metal can tray; Placing an organic cell array glass on the loading stage; Raising the alignment stage to place the organic cell array glass on the metal can tray, and moving the alignment stage to align the organic cell array glass and the mask; Lowering the alignment stage at a position where the organic cell array glass and the mask are aligned, and placing the organic cell array glass on the loading stage; Moving the alignment stage to move the metal can tray to an initial position aligned with a mask; Raising the alignment stage to place the organic cell array glass on the metal can tray; And raising the alignment stage to torch the organic cell array glass and the mask. 4. The method of claim 3, wherein the alignment stage is moved in a fixed state such that the metal can tray does not move in the horizontal direction in the alignment stage. The method of claim 4, wherein the alignment stage includes position pins, the metal can tray includes position holes, and the position pins are fixed to each other by being inserted into the position hole. 4. The method of claim 3, further comprising checking an alignment state of the metal can tray and the mask before torching the organic cell array glass and the mask.

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