KR100638087B1 - Method for manufacturing elastic functional beam of probe card and its structure - Google Patents

Abstract

The present invention relates to a method for manufacturing an elastic functional beam of a probe card, and a structure thereof. After the probe needle 100 including the metal base 150 and the cantilever beam 200 is manufactured, the cantilever beam 200 and the substrate member 110 are manufactured. By filling the polymer elastic material between the) to form the polymer elastic layer 300 to elastically support the cantilever beam 200 to control the elasticity and reaction force, to prepare a metal structure constituting the probe needle 100 first Since the polymer elastic layer 300 is formed by applying the polymer elastic material, the production of the polymer elastic layer 300 may be easy and the process may be simplified, thereby increasing productivity.

In addition, the polymer elastic material may be subjected to a high temperature treatment before the lamination process, so that the conductive metal forming the metal proximal end 150 and the cantilever beam 200 may be heat treated to increase the overall durability of the probe needle 100. .

In addition, when elasticity and reaction force are required for each position in a plurality of cantilever beam array structures, the polymer elastic layer 300 is formed to have a shape and a material suitable for each requirement. The elasticity and reaction force can be easily adjusted according to the shape, and thus the use range and application of the microcantilever beam and the design safety area can be expanded.

Description

Manufacturing Method and Structure of Tensible Beam for Probe Card

1 is a side view showing a conventional probe card

2 is a schematic configuration diagram of wafer inspection by a probe card;

Figure 3 is a process chart showing a method for producing an elastic functional beam of the present invention probe card

Figures 4a to 4j is an illustration showing an embodiment of the polymer elastic refilling process of the present invention

Figure 5 is a side view showing the configuration of a probe card to which the present invention is applied

* Description of the major symbols in the drawings *

100: probe needle 110: substrate member

150: metal base 200: cantilever beam

210: probe tip 300: polymer elastic layer

 The present invention relates to a method of manufacturing an elastic functional beam of a probe card and its structure, and more particularly, to the cantilever beam of the probe card can be supported by a polymer elastic body to obtain various required elasticity and reaction force.

In general, the electrical and electronic device should perform a performance test on the electrical operation after manufacturing to screen the defective and good products.

Semiconductor chips, packaged semiconductor chips, and printed circuit boards, which are electrical and electronic devices, are tested for performance using a probe card. In this case, a probe tip protruding from the needle of the probe card is a battery. The inspection is performed by whether or not the electrode pad of the electronic device is electrically contacted.

As shown in FIG. 1, the probe card is connected to a pogo-pin 12 or a ZIF connector mounted on a frog ring 11 of a test head 10. A printed circuit board 21 electrically and mechanically connected, a probe ring 22 of an epoxy resin fixedly installed on the printed circuit board 21, and an epoxy adhesive fixed to the probe ring 22 to be connected to one end of the device. A probe needle 23 having a probe tip 23a made of thousands of tungsten materials in contact with an electrode pad, and one strip line on one end of the probe needle 23 and the printed circuit board 21. ) Is composed of a wire 24 for connecting.

The probe card is electrically connected to the tester as shown in FIG. 2 to inspect the wafer 3 placed on the prober 2.

The probe needle 100 is usually formed of a conductive material at a proximal end 101 protruding with a height onto the probe ring 22, and is wired to each strip line on the printed circuit board 21. One end of the cantilever beam 200 to be connected is fixed.

In addition, the cantilever beam 200 forms a probe chip 23a sharply through chemical etching at an end thereof, and the probe chip 23a contacts the electrode pad of the measuring device to be tested for performance to determine whether the device is defective. It is.

As the recent semiconductor chips are highly integrated and not only use large-area wafers as process substrates, but also develop fast response speeds of high frequency bands, corresponding probe cards 20 also have reduced pad pitches of semiconductor chips. (Less than 100 microns), an increase in the number of devices measured simultaneously (more than 64), and a fast signal response rate (1 Hz).

However, the conventional cantilever beam 200 is not only a problem that can not be fast signal response due to the impedance matching problem, but if there are more than 64 devices that can be measured, the probe needle 100 is about 5000 or more manually When mounted to the proximal end there is a problem that the failure rate is very high.

In addition, when the pad pitch spacing of the semiconductor chip is 100 microns or less, the diameter of the tungsten cantilever beam 200 is 100 ± 10 microns, so that they are stuck to each other and thus cannot be coped with.

In order to solve this problem, the applicant has applied for a photolithography using a photoresist on a ceramic substrate in Patent Registration No. 0515235, 'Needle of a probe card using a micro fabrication technology, a manufacturing method thereof, and a probe card embodied with the needle'. After photolithography, a probe needle proximal end made of a conductive metal and having an island seed layer is formed, and a polymer elastomer is formed on a separate silicon wafer, and then the polymer elastomer is separated from the silicon wafer and embedded on the ceramic substrate. In addition, it has been proposed to form a conductive metal on the probe needle proximal end and the polymer elastic body so that the polymer elastic body supports and form a probe tip at the end thereof.

That is, the seed layer of the probe needle base end that is directly energized by a metal material is formed on the ceramic substrate, and a photoresist is applied on the seed layer to form a pattern, and the polymer elastomer is embedded in the recessed portion, and then the photoresist is removed on the seed layer. The probe needle base is then plated with a conductive metal to match the height of the embedded polymer elastomer, and then the probe needle is completed by laminating a conductive metal on the probe needle base and the polymer elastomer and forming a top needle tip at the end thereof. .

However, the conventional method of manufacturing the probe needle is prepared by embedding the polymer elastic body in advance before forming the cantilever beam and by stacking a conductive metal forming the cantilever beam on top thereof so that the polymer elastic body is formed to match the height of the proximal end portion to be formed. There was a hassle to precisely landfill.

In addition, when the high temperature treatment process is performed to improve the mechanical strength of the proximal end of the probe needle or the conductive metal forming the cantilever beam, the polymer elastic body is deformed, and thus the proximal end or the cantilever beam is unstable. There was a dissolution.

In the array structure of multiple cantilever beams, each cantilever beam is supported by the same polymer elastomer so that the elasticity and reaction force generated in the cantilever beam are constant so that many cantilever beams require different elasticity and reaction force by position. There was a problem that is difficult to design and manufacture.

In addition, if the polymer elastic layer is corroded and damaged by prolonged use of the probe card, the repair and replacement of the polymer elastic layer is virtually impossible.

In addition, in the case of a probe card equipped with probe needles not supported by the polymer elastic layer, the installation cost is increased because the probe card itself must be replaced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing an elastic functional beam of a probe card and a structure thereof, by manufacturing a probe needle of a probe card and then forming a polymer elastic layer supporting the cantilever beam, thereby simplifying the manufacturing process and improving productivity. There is.

Another object of the present invention is to provide a method for producing an elastic functional beam of a probe card and its structure capable of stably manufacturing the proximal end of the probe needle and the cantilever beam through a high temperature treatment process.

Still another object of the present invention is to provide a method and a structure for manufacturing an elastic functional beam of a probe card, which can reduce equipment cost and equipment maintenance cost, and support a plurality of cantilever beams with required elasticity and reaction force, respectively.

It is still another object of the present invention to provide a method of manufacturing an elastic functional beam of a probe card corresponding to a micro system that can be miniaturized while maintaining the elasticity and reaction force necessary for inspection of the probe needle of the probe card. To provide that structure.

An object of the present invention is made of a conductive metal on the substrate member and the base end forming step of forming a metal base having a predetermined height, and the base end formed through the base end forming step is made of a conductive metal, one end of the metal base And a cantilever beam forming step of forming a cantilever beam having a probe tip at the end thereof, the end being protruded outwardly, and a polymer elastic material filled between the cantilever beam and the substrate member formed through the cantilever beam forming step. This is achieved by sequentially performing a polymer elastic refilling step of forming a polymer elastic layer.

On the other hand, the elastic functional beam structure of the probe card manufactured by the above method is a metal base end portion protruding and formed with a height of the conductive metal on the substrate member, the upper end of the metal base portion is formed of a conductive metal, one end is fixed to the metal base end And a cantilever beam protruding to one side, a probe tip formed at the end of the cantilever beam such that the conductive metal gradually decreases in size, and a polymer tip is filled between the cantilever beam and the substrate member. It is achieved by including a polymer elastic layer formed.

That is, after the polymer elastic layer is manufactured of the metal base and the cantilever beam, the polymer elastic layer is elastically supported by filling the polymer elastic material between the cantilever beam and the substrate member to easily form a polymer elastic layer that controls elasticity and reaction force. It provides a way to be present and its structure.

When described in detail by the accompanying drawings a preferred embodiment of the present invention as follows.

3 is a process diagram sequentially illustrating a method for manufacturing an elastic functional beam of a probe card of the present invention, which shows that a proximal end forming process, a cantilever beam forming process, a polymer elastic layer coating process, and an etch back process are sequentially performed.

Figures 4a to 4j is an exemplary view showing an embodiment of the polymer elastic refilling process of the present invention, showing the shape of the polymer elastic layer formed by the polymer elastic refilling process.

Fig. 5 is a side view showing the configuration of a probe card to which the present invention is applied and shows a probe card having the elastic functional beam structure of the present invention.

Hereinafter, as shown in FIG. 3, the method of manufacturing an elastic functional beam of the probe card according to the present invention includes a proximal end forming process for forming a metal proximal end 150, and a cantilever beam 200 over the photoresist manufactured through the proximal end forming process. And the cantilever beam 200 generated by the height of the metal base end 150 after the cantilever beam forming process of forming a probe tip 210 gradually formed at the end of the cantilever beam 200. The polymer elastic material filling process of filling the polymer elastic material between the substrate members 110 to form the polymer elastic layer 300 is sequentially performed.

In the polymer elastic material filling process, the polymer elastic layer 300 may be formed by filling an appropriate amount of the polymer elastic material capable of supporting the cantilever beam 200 between the cantilever beam 200 and the substrate member 110.

In addition, when the probe needle 100 including the cantilever beam 200 and the metal base 150 is manufactured in an ultra-miniaturized manner, the gap between the cantilever beam 200 and the substrate member 110 is minute and the polymer elastic material is interposed therebetween. Since a very precise work is required to fill a proper amount, the polymer elastic material filling process applies a polymer elastic material to the upper portion of the cantilever beam 200 to fill the polymer elastic material between the cantilever beam 200 and the substrate member 110. A polymer elastic layer having a shape for supporting the cantilever beam 200 and exposing the probe chip by etching the polymer elastic material covering the upper portion of the cantilever beam 200 through the polymer elastic material applying process and the polymer elastic material applying process ( An etch back process to form 300.

In the etch back process, a polymer elastic material is melted by using a chemical solvent to control the shape of the polymer elastic layer 300 so that the polymer elastic layer 300 may be formed to protrude slightly over the cantilever beam 200. have.

In addition, the etch back process may form the polymer elastic layer 300 in close contact with the lower surface of the cantilever beam 200.

In the etch back process, the polymer elastic layer 300 may be formed in a shape spaced apart from the lower surface of the cantilever beam 200.

In this case, the height of the polymer elastic layer 300 forms a gap between the cantilever beam 200 and the substrate member 110, but exceeds 0% and 100% depending on the prevention of particle inflow into the substrate and the degree of elasticity of the functional beam. To form an effective elastic layer height of less than, preferably to form an effective elastic layer height of 50% or more and less than 100%.

The polymer elastic layer 300 only needs to have a height of more than 0% to prevent the inflow of particles, and preferably has a height of 50% or more to support the reaction force and pin pressure required for the cantilever beam 200. .

On the other hand, the proximal end forming process is a photoresist process of applying a photoresist to form a photoresist layer, and then exposing and developing a portion where the metal proximal end 150 is to be formed by exposure according to a mask pattern; It is also possible to use a micro fabrication technique in which a metal lamination process of forming a metal base layer is repeated by coating and laminating a conductive metal on the metal layer, and bending a metal plate having a predetermined length to form a metal base end portion 150, The part may be manufactured to form the cantilever beam 200 to be described later, and any method of forming the metal base end 150 having a predetermined height to support the cantilever beam 200 to be described later is included in the present invention. To reveal.

The number of repetitions of the photoresist process and the metal lamination process may be changed at the time of manufacture according to the design height of the metal base 150 and the thickness of the photoresist layer.

The metal base end 150 formed by the base end forming process may be formed of a conductive metal of one material, or may be formed by sequentially stacking two or more conductive metals.

The conductive metal used in the base end forming process may include titanium (Ti), chromium (Cr), copper (Cu), aluminum (Al), cobalt (Co), tungsten (W), tantalum (Ta), nickel alloys, It is noted that there are gold alloys and any other electrically conductive metals or alloys can be used.

On the other hand, the cantilever beam forming process forms a photoresist layer by applying photoresist, and then develops and exposes a portion where the cantilever beam 200 is formed and a portion where the probe tip 210 is to be formed by exposure according to a mask pattern. The resist process and the beam layer forming process of forming a cantilever beam 200 and a top needle team protruding sharply at the end of the cantilever beam 200 by applying and laminating a conductive metal on the exposed portion are alternately repeated and then laminated. The micro fabrication technique may be used to go through the photoresist removal process of removing the photoresist, and the cantilever beam 200 may be manufactured using one conductive metal plate, and the metal is formed of one conductive metal plate having a predetermined length. By bending the proximal end 150, the cantilever beam 200 may be manufactured integrally with the metal proximal end 150. It is noted that the present invention includes any method for forming a cantilever beam 200 having one end supported on the short end 150 and having a pointed probe team 210 at the end.

Thereafter, while the cantilever beam forming process is performed in the proximal end forming process, the manufacture of the probe needle 100 including the cantilever beam 200 and the metal proximal end 150 is completed.

In addition, the tip of the probe 210 is formed in a shape in which the size of the end gradually decreases in size, so that the end may be sharply formed.

In the cantilever beam forming process of the micro fabrication method, the number of repetitions of the photoresist process and the beam layer forming process may be changed at the time of manufacture according to the design of the cantilever beam 200 and the design of the probe tip 210. Be included.

In addition, the probe tip 210 formed in the cantilever beam forming process may be formed in various forms according to the electrical and electronic device to check the shape of the pointed end, which is a mask pattern used in the final photoresist process in the micro fabrication method It is understood that the end shape of the top needle tip 210 which is possible by changing the shape of the needle tip and protrudes sharply by etching or grinding operation can be formed in various forms.

Although not illustrated, the shape of the probe tip 210 may be formed in a cross or rhombus shape for a line pad or a grid array pad, and may be formed in a trapezoid shape for a general line pad, and may be easily contacted by contacting an electric and electronic device. It is to be understood that any shape which makes it possible is included in the present invention.

The cantilever beam 200 and the tower tip 210 formed by the cantilever beam forming process may be formed of a conductive metal of one material, or may be formed by sequentially stacking two or more conductive metals.

The conductive metals used in the cantilever beam forming process include titanium (Ti), chromium (Cr), copper (Cu), aluminum (Al), cobalt (Co), tungsten (W), tantalum (Ta) and nickel alloys. It is noted that there is a gold alloy and any other metal or alloy may be used.

In addition, it is preferable to perform a high temperature treatment step of high temperature treatment of the metal base end 150 and the cantilever beam 200 after the cantilever beam forming process and before the polymer elastic refilling refilling process.

This high temperature treatment process serves to more firmly bond the joint between the metal base 150, the cantilever beam 200, the conductive metal of the probe tip 210.

Meanwhile, as described above, the cantilever beam 200 having one end fixed to the metal base 150 through the cantilever beam forming process is deflected by a force generated when the probe tip 210 comes into contact with the electrical element to be inspected. ), The elasticity and reaction force caused by this deflection should be removed to the original position, and then returned to its original position so that the electrical element can be repeatedly and accurately inspected with a constant pin pressure.

The maximum value of the pressing force applied to the cantilever beam 200 during the electric device inspection and the maximum value of the over travel of the cantilever beam 200 deformed thereby are limited.

The larger the deflection, the more favorable the electric device inspection, but limited to the constraints such as the elastic limit of the cantilever beam 200 and the metal base 150 height.

In the case of the pressing force, a limited reaction force must appear in the cantilever beam 200 at a constant over travel, and when the reaction force is too small, the probe tip 210 cannot penetrate the surface of the metal pad oxide layer, resulting in unstable connection and thus accuracy of inspection. On the other hand, if the reaction force is too strong, it causes a deep scratch on the metal pad and damages the wafer of the inspected electrical and electronic device. Therefore, the reaction force is generally adjusted to have 4 to 5 gf at 70 μm. .

In addition, in order to deflect the cantilever beam 200 more than a predetermined range so that the cantilever beam 200 is in stable contact with the electrical and electronic device, the length of the beam must be maintained at a predetermined length or more. Although the thickness of the beam may be increased, the pad pitch to be inspected according to the miniaturization of the electric element may be difficult to cope with fine pitch.

On the contrary, when the length of the beam is reduced and the thickness is reduced, the length and the thickness are changed linearly, so that the maximum stress is easily out of the plastic range, and the cantilever beam 200 does not have elasticity and plastic deformation.

That is, when the probe needle 100 is reduced below a certain threshold due to the ultra miniaturization of the electrical and electronic device due to the above-mentioned problem, the deflection generated in the cantilever beam 200 during the inspection is beyond the elastic limit of the metal and the cantilever beam 200 ) Does not have elasticity and causes plastic deformation, and in order to prevent such plastic deformation, when the thickness of the cantilever beam 200 is thinned, it has elastic force due to deflection, but pin pressure for contacting and punching an oxide film on an electrical and electronic device during inspection contact force cannot be obtained.

In addition, the non-memory chips among the electrical and electronic devices inspected by the probe card are often positioned in a peripheral or grid array type, and thus the length of the cantilever beam 200 is shorter to cope with this. Plastic deformation due to this is inevitable.

Therefore, in order to reduce the length of the cantilever beam 200 and to obtain a desired reaction force while limiting the thickness so that the stress applied to the cantilever beam 200 is within the plastic stress of the beam, in addition to the reaction force generated by the cantilever beam 200 itself. It is necessary to apply force to the beam independently.

For this reason, a polymer elastic material filling process for forming a polymer elastic layer 300 by filling a polymer elastic material such as a rubber material to play an elastic role in the lower part of the cantilever beam 200 manufactured through the cantilever beam forming process is performed. The polymer elastic layer 300 compensates for the elasticity and pin pressure of the cantilever beam 200 lost by miniaturization to prevent plastic deformation during inspection and to obtain a pin force required for close inspection. will be.

The polymer elastomers include thermoplastic elastomers, polybutylene telephthalate, polyesters, rubbers, hydrogel polymers, urethane elastomers, and silicone elastomers. Silcone elastomer), polydimethyl siloxane, and the like.

In addition, the shape of the polymer elastic layer 300 formed through the polymer elastic refilling process is as shown in Figures 4a to 4j.

As shown in FIG. 4A, the polymer elastic layer 300 is formed to fill the gap between the cantilever beam 200 and the substrate member 110 with a polymer elastic material to support the cantilever beam 200.

The polymer elastic layer 300 thus formed supports the entire cantilever beam 20 to absorb and cushion most of the vibration that may occur when the cantilever beam 200 returns to its original position by reaction force and elasticity after inspection. It is suitable for the case where strong contact force is required.

As shown in FIG. 4B, the polymer elastic layer 300 is formed such that the polymer elastic material is applied to a length corresponding to the entire length of the cantilever beam 200 to be spaced apart from the lower portion of the cantilever beam 200.

This is because the cantilever beam 200 maintains the pin pressure by the elasticity and reaction force of the cantilever beam 200 until the deflection is not plastic deformation, and the elasticity and reaction force of the polymer elastic layer 300 is the deflection of the cantilever beam 200 from the plastic deflection. The cantilever beam can be kept constant by its elasticity and reaction force of the cantilever beam 200 by preventing plastic deformation, and the cantilever beam due to the polymer elastic layer 300 which is expanded and contracted finely according to temperature change. It is to prevent the 200 from tilting.

As shown in FIG. 4C, the polymer elastic layer 300 has a height of a predetermined portion of the metal base 150 inside the end of the cantilever beam 200 to support the polymer elastic material in close contact with a portion of the end of the cantilever beam 200. It is formed by filling in.

When the pin pressure required for the inspection is not largely required, when the polymer elastic layer 300 is applied over the entire surface of the cantilever beam 200, the polymer elastic material is consumed and manufacturing costs are high, so that the end side of the cantilever beam 200 is increased. Only by applying the polymer elastic material to form the polymer elastic layer 300 is to prevent waste of the polymer elastic material.

As shown in FIG. 4D, the polymer elastic layer 300 supports the polymer elastic material so as to support only a portion of the end portion of the cantilever beam 200 while being spaced apart from the end of the cantilever beam 200. Filled in a predetermined portion but is formed by filling the gap with the cantilever beam 200.

In this case, the polymer elastic layer 300 is formed to be lower than the height of the metal base portion 150, the height of the substrate member 100 and the metal base portion in accordance with the prevention of particles (particles) to the substrate and the degree of elasticity of the functional beam function It is to form an effective elastic layer height of 0% or more and less than 100% between 150, and preferably to form an effective elastic layer height of 50% or more and less than 100%.

The polymer elastic layer 300 only needs to have a height of 0% or more to prevent the inflow of particles, and preferably has a height of 50% or more to support the reaction force and pin pressure required for the cantilever beam 200.

This prevents the waste of the polymer elastic material when the required pin pressure is not largely required for inspection, and maintains a constant pin pressure by the reaction force and elasticity of the cantilever beam 200, and the polymer elastic layer 300 shrinks and expands according to temperature change. Since the horizontality of the cantilever beam 200 is not affected, the level can be kept constant.

As shown in FIG. 4E, the polymer elastic layer 300 is formed to support the lower portion of the cantilever beam 200 by filling a portion of the polymer elastic material protruding to an end of the cantilever beam 200 to surround the end from the outside.

When the cantilever beam 200 returns to its original position with reaction force and elasticity after the deflection occurs due to contact with the wafer surface of the electrical and electronic device, the vibration occurs at the end of the cantilever beam 200 so that the end thereof is the polymer elastic layer ( By forming a wrap 300, the cantilever beam 200 can be stably returned to the original position after the inspection, and stable and accurate inspection is possible even if the inspection speed is advanced.

As shown in FIG. 4F, the polymer elastic layer 300 is filled with the polymer elastic material slightly covered with the upper portion of the cantilever beam 200 such that only the pointed end of the probe tip 210 protrudes, thereby lowering the lower portion of the cantilever beam 200. It has a supporting shape.

This wraps the cantilever beam 200 with the polymer elastic layer 300 to support its reaction force and elasticity, and is used when the most pressing pin pressure is required during the inspection, and protects the cantilever beam 200 from external contact by preventing foreign matter and external environment. This can prevent the cantilever beam 200 from being corroded or damaged.

As shown in FIG. 4G, the polymer elastic layer 300 may include a first polymer elastic layer 310 and a probe tip 210 that closely support the inner end of the cantilever beam 200 fixed to the metal base 150. The cantilever beam 200 is formed of a second polymer elastic layer 320 that closely contacts the end of the formed cantilever beam.

As shown in FIG. 4H, the polymer elastic layer 300 has a first polymer elastic layer 310 supporting an inner end of the cantilever beam 200 fixed to the metal base 150. The second polymer elastic layer 320, which is formed to be in close contact and supports the tip of the cantilever beam 200, on which the probe tip 210 is formed, is formed to be supported at intervals from the cantilever beam 200.

As shown in FIG. 4I, in the polymer elastic layer 300, the first polymer elastic layer 310 supporting the inner end of the cantilever beam 200 fixed to the metal base 150 may be spaced apart from the cantilever beam 200. The second polymer elastic layer 320, which is formed to support in an inclined state and supports the end of the cantilever beam 200 on which the probe tip 210 is formed, is formed to be in close contact with the lower portion of the cantilever beam 200.

As described above, when the polymer elastic layer 300 is formed of the first and second polymer elastic layers 310 and 320, the polymer elastic refilling process may include a first polymer elastic layer supporting the inner end of the cantilever beam 200. The first filling process for forming 310 and the second filling process for forming the second polymer elastic layer 320 supporting the end of the cantilever beam 200 are repeated.

As such, forming the polymer elastic layer 300 as the first and second polymer elastic layers 310 and 320 may be required at the inner end of the free end of the cantilever beam 200 and the fixed end of the cantilever beam 200. This is because the reaction force and elasticity are different, and the materials and shapes of the first and second polymer elastic layers 310 and 320 may be changed in design according to the reaction force and elasticity required to support the cantilever beam 200. It is.

As shown in FIG. 4J, the polymer elastic layer 300 is filled in a plurality of separated states between the cantilever beam 200 and the substrate member 110, and is formed to elastically support the cantilever beam 200.

In this case, the polymer elastic material filling process is to repeat the operation of filling a small amount of the polymer elastic material between the cantilever beam 200 and the substrate member 110 to form a plurality of separated polymer elastic layer 300.

Since the polymer elastic layers 300 are separated from each other and support the cantilever beam 200 in an independent state, the shape and material of each polymer elastic layer 300 may be adjusted according to the reaction force and elasticity required in the supported cantilever beam 200. It can be changed in the design can be formed to the polymer elastic layer 300 to support the cantilever beam 200 in an optimal state.

In addition, when the polymer elastic layer 300 is formed as one body to support the cantilever beam 200, there is a risk that stress is concentrated in any part of the operation and thus the stress concentrated part is easily damaged. When the cantilever beam 300 is supported by separating a plurality of elastic layers 300, stress is dispersed and acted on each polymer elastic layer 300 to prevent breakage or damage of the polymer elastic layer 300, thereby increasing durability. It can be done.

The shape and material of the polymer elastic layer 300 formed by the polymer elastic refilling process are determined when the cantilever beam 200 is designed to meet the required reaction force and elasticity. It is possible to change the shape of which is included in the present invention.

In particular, when supporting the cantilever beam 200 with two or more polymer elastic layers 300, the respective polymer elastic materials may be the same, and polymer elastic materials suitable for a design when different elasticity and reaction force are required. Can be used respectively.

In other words, after applying and baking the photoresist as described above, the pattern is formed into a desired shape using a mask pattern, and then the base end portion forming process and the cantilever beam forming process of repeating the lamination of the conductive metal on the exposed portion are simply performed. After manufacturing the 150 and the cantilever beam 200, the polymer elastic material may be applied to the ceramic plate to simply form the polymer elastic layer 300 between the cantilever beam 200 and the substrate member 110.

Although the method for manufacturing the elastic functional beam of the probe card has been described for manufacturing one probe needle 100, it has been found that hundreds and thousands of probe needles 100 are manufactured at the same time with fine pitch by using micro fabrication techniques. Put it.

On the other hand, the probe card according to the present invention described above is a printed circuit board (PCB) (31) connected to the test head for transmitting electrical signals from the tester as shown in Figure 7, and the printed circuit board ( 31) positioned below and electrically connected to the multilayer board member 110, the printed circuit board 31, the plurality of interface pins and the multilayer board member 110 which are electrically connected by the plurality of micro interface pins 33. The holding jig and the plurality of probe needles 100 provided on the lower surface of the multilayer substrate member 110 and in contact with the electronic component are included.

The probe needle 100 includes a metal proximal end 150 and a cantilever beam 200 manufactured by the method of manufacturing an elastic functional beam of the probe card, and the elastic functional beam structure of the probe card includes a proximal end forming process and a cantilever. The polymer base layer 150 and the cantilever beam 200 are manufactured through a beam forming process, and then coated onto the substrate member 110 to fill and support the cantilever beam 200 and the substrate member 110. 300).

The substrate member 110 is based on the use of a ceramic substrate.

The polymer elastic layer 300 is preferably to increase the elastic force and the buffering force is formed a number of fine buffering holes.

That is, the deflection occurs in the cantilever beam 200 due to the pressing force received by contacting the probe tip 210 of the cantilever beam 200 with the electrode pad of the semiconductor wafer during the inspection, and the deflection of the cantilever beam 200 may be supported by the polymer elastic layer 300. When the pressure is released by the buffer hole (release) is to increase the performance.

In addition, the polymer elastic layer 300 may be formed as one body to support the cantilever beam 200, but may be formed to be separated into a plurality of polymer elastic layers 300 to support the cantilever beam 200. have.

According to the above-described method and structure of the present invention, first, the metal structures constituting the probe needle are first laminated and manufactured, and then a polymer elastic layer is formed by applying a polymer elastic material, thereby easily manufacturing and simplifying the process. This has the effect of increasing productivity.

 Second, the high temperature treatment may be performed before the polymer elastic material lamination process, thereby increasing the overall durability of the probe needle by heat-treating the conductive metal forming the metal base and the cantilever beam.

Third, when elasticity and reaction force are required for each position in a plurality of cantilever beam arrangement structures, there is an effect of forming a polymer elastic layer having a shape and a material suitable for each requirement.

Fourth, the elasticity and reaction force can be easily adjusted according to the material and shape of the polymer elastic layer, thereby extending the use range and application of the microcantilever beam and the design safety area.

Fifth, there is an effect of enabling the arrangement structure of the ultra-miniaturized cantilever beam corresponding to the electrical and electronic device to be miniaturized by solving the reaction force degradation problem caused by the ultra-miniaturization of the beam structure.

Sixth, since the polymer elastic layer prevents foreign substances introduced from the outside in the arrangement structure of a plurality of cantilever beams, when the micro cantilever beam serves as a contact medium, electrical problems caused by foreign substances can be protected in advance.

Claims (20)

A proximal end forming process of forming a metal proximal end 150 made of a conductive metal on the substrate member 110 and having a predetermined height; It is made of a conductive metal on the top of the metal base 150 formed through the base end forming process, one end is fixed to the metal base 150, the end is protruded to the outside and the probe tip 210 is provided at the end A cantilever beam forming step of forming the cantilever beam 200; A probe characterized in that the polymer elastic material filling step of forming the polymer elastic layer 300 by filling the polymer elastic material between the cantilever beam 200 and the substrate member 110 formed through the cantilever beam forming process sequentially Method for producing elastic functional beam of card. The method of claim 1, wherein the elastic material filling process is to apply a polymer elastic material to the upper portion of the cantilever beam 200 to fill the polymer elastic material between the cantilever beam 200 and the substrate member 110 and And etching the polymer elastic material covering the upper portion of the cantilever beam 200 through the polymer elastic material coating process to support the cantilever beam 200 and to form the polymer elastic layer 300 having a shape of exposing the probe chip. Method of producing an elastic functional beam of a probe card, characterized in that it comprises a back (etch) process. The method according to claim 2, wherein the etch back process forms the polymer elastic layer (300) in a state of protruding above the cantilever beam (200). The method of claim 2, wherein the etch back process forms the polymer elastic layer 300 in close contact with the bottom surface of the cantilever beam 200. The method of claim 2, wherein the etch back process forms the polymer elastic layer 300 in a shape spaced apart from a lower surface of the cantilever beam 200. The method of manufacturing an elastic functional beam of a probe card according to claim 1, wherein a high temperature treatment step of high temperature treatment of the metal base end (150) and the cantilever beam (200) is performed after the cantilever beam forming step and before the polymer elastic refilling filling. The method of claim 1 or claim 2, wherein the polymer elastic refilling process is a first filling process for forming a first polymer elastic layer 310 for supporting the inner end of the cantilever beam 200, and the cantilever beam 200 Method of producing an elastic functional beam of a probe card, characterized in that repeated in the second filling process for forming a second polymer elastic layer (320) for supporting the end of the. The method of claim 1 or 2, wherein the polymer elastic refilling process is repeated by filling a small amount of the polymer elastic material between the cantilever beam 200 and the substrate member 110 by a plurality of polymer elastic layers ( 300) A method for producing an elastic functional beam of a probe card, characterized in that forming. A metal base end 150 having a height of the conductive metal protruding from the substrate member 110; A cantilever beam (200) formed of a conductive metal on an upper portion of the metal base end, the one end of which is fixed to the metal base end, and the end of which protrudes to one side; A probe tip (210) formed at the end of the cantilever beam (200) such that the conductive metal is gradually reduced in size and whose ends are pointed; The elastic functional beam structure of the probe card, characterized in that it comprises a polymer elastic layer (300) formed by filling a portion of the polymer elastic material in the space between the cantilever beam (200) and the substrate member (110). 10. The elastic functional beam structure of a probe card according to claim 9, wherein the polymer elastic layer (300) is formed with a plurality of fine buffer holes. delete delete 10. The elastic functional beam structure of a probe card according to claim 9, wherein the polymer elastic layer (300) is formed to be in close contact with an end of the cantilever beam (200). 10. The elastic functional beam structure of a probe card according to claim 9, wherein the polymer elastic layer (300) is formed to support an end of the cantilever beam (200) in a state where a gap with the end of the cantilever beam (200) is formed. 10. The method of claim 9, wherein the polymer elastic layer 300 is characterized in that the polymer elastic material is formed to support the lower portion of the cantilever beam 200 by filling a portion protruding to the end of the cantilever beam 200 to surround the end from the outside The elastic functional beam structure of the probe card. 10. The method of claim 9, wherein the polymer elastic layer 300 is filled with the polymer elastic material is covered with the upper portion of the cantilever beam 200 so as to project only the sharp end of the probe tip 210 to support the lower portion of the cantilever beam 200 Elastic functional beam structure of a probe card, characterized in that formed in the shape. The method of claim 9, wherein the polymer elastic layer 300 is a first polymer elastic layer 310 and the probe tip 210 to support the inner end of the cantilever beam 200 fixed to the metal proximal end 150 in close contact The elastic functional beam structure of the probe card, characterized in that formed in the second polymer elastic layer 320 to support the end of the formed cantilever beam (200) in close contact. 10. The method of claim 9, wherein the polymer elastic layer 300 is a first polymer elastic layer 310 for supporting the inner end of the cantilever beam 200 is fixed to the metal base 150, the lower portion of the cantilever beam 200 The second polymer elastic layer 320 which is formed to be in close contact and supports the tip of the cantilever beam 200 in which the probe tip 210 is formed is formed to be supported at intervals from the cantilever beam 200. The elastic functional beam structure of the probe card. The method of claim 9, wherein the polymer elastic layer 300 is spaced apart from the cantilever beam 200 by the first polymer elastic layer 310 supporting the inner end of the cantilever beam 200 is fixed to the metal base end 150 And a second polymer elastic layer 320 supporting the end of the cantilever beam 200 in which the probe tip 210 is formed to be in close contact with the lower portion of the cantilever beam 200. An elastic functional beam structure of a probe card. 10. The elastic functional beam structure of a probe card according to claim 9, wherein the polymer elastic layer (300) is formed of a plurality of separated polymer elastic layers (300).

Images