KR100628435B1 - Assembly method of tiled liquid crystal display and tiled liquid crystal display - Google Patents

Abstract

In order to drive the LCD panel of a tiled liquid crystal display, a tape carrier package having a small size and a large number of input / output leads is mounted on a printed circuit board, and then the input electrodes of the LCD panel and the output wirings of the printed circuit board are connected by heat seal connectors. Apply the tap method.

Alternatively, the glass substrate on which the drive drive IC is mounted is installed on the lower surface of the mold frame, and the input electrodes of the LCD panel and the output leads of the glass substrate are electrically connected by using a heat seal connector, and the input leads of the glass substrate are Input wiring of the printed circuit board uses a chip-on-board method of connecting to the FPC.

Here, the drive driver ICs mounted on the tape carrier package and the glass substrate are used in general liquid crystal display devices, and have a small size and a large number of input / output pins, thereby increasing the free space of the printed circuit board, and reducing the number of drive drive ICs to integrate the drive unit. You can.

Description

Assembly method of tiled liquid crystal display and tiled liquid crystal display

The present invention relates to a tiled liquid crystal display device and a method of assembling a tiled liquid crystal display device, and more particularly, a tap method using a tape carrier package having a drive drive IC, or a chip having a drive drive IC mounted on a glass substrate. The present invention relates to an assembly method of a tiled liquid crystal display device and a tiled liquid crystal display device by applying an on glass method to electrically connect an LCD panel and a printed circuit board to improve product reliability.

In general, the liquid crystal display device, which has been spotlighted as a substitute for the CRT, has advantages such as light weight, thinness, and low power consumption, and its demand is rapidly expanding. In recent years, the quality of liquid crystal display devices has been improved due to the improved living standards of consumers. And large screens are required.

However, due to the characteristics of the liquid crystal display device, there is a limit to increasing the screen size on which an image is displayed. The screen size of the largest liquid crystal display device known so far is 22 inches, which is theoretically known to be possible to 40 inches.

As a result, a so-called projection TV, which mounts an optical system on a small LCD panel and displays a large image on a screen, has recently emerged. In recent years, a tiled liquid crystal device in which several liquid crystal display devices are connected to make a large display device. The display device is put into practical use.

A tiled liquid crystal display is fixed to a plurality of small LCD modules having a size of 6 × 6 inches or 6 × 8 inches to a mounting frame as shown in US Patent Nos. 4,980,775, 5,067,021, 5,068,740, and 5,079,636. The big screen is implemented.

Here, in order to prevent the image from being interrupted between the LCD module and the LCD module so that the boundaries of the LCD modules are clearly distinguished from the human eye, the distance between the LCD modules and the pixels formed on each LCD module are equally formed. In order to realize the high quality of the tiled liquid crystal display, the gap between the LCD modules is continuously narrowed to increase the number of pixels formed in one LCD module.

As described above, LCD modules used in tiled liquid crystal display devices include a mold frame in which a reflection plate and a lamp are accommodated, a diffusion sheet fixed to an upper surface of the mold frame to diffuse light, and an upper surface of the diffusion sheet and installed on a side surface thereof. LCD panel that displays an image by forming an input electrode, and a quad flat package (hereinafter referred to as QFP) that is fixed to the lower surface of the mold frame and drives the LCD panel on one side is printed to drive the LCD panel. It consists of a circuit board, a heat seel connector which electrically connects an input electrode and a printed circuit board.

The QFP driving the LCD panel is generally applied to a tiled liquid crystal display device having a super twisted nematic (STN) type, and it is difficult to integrate a driving unit due to the characteristics of the QFP.

Since the input / output leads of the QFP are connected to the input / output wires of the printed circuit board by soldering, the pitch between the input / output leads cannot be designed to be 0.5 mm or less that can be soldered, thereby increasing the size of the QFP itself.

In addition, since the number of input / output leads of the QFP is usually about 48 or 96 pins, a large number of QFPs are required to drive the gates and data lines by connecting the gate and data lines of the LCD panel and the input / output leads of the QFP one-to-one. It must be mounted on a printed circuit board. Here, when a large number of input / output leads are formed in the QFP to integrate the driving unit by reducing the number of QFPs mounted on the printed circuit board, the electrical characteristics are deteriorated and the image quality of the tiled liquid crystal display is deteriorated.

On the other hand, when QFP applied to the STN type tiled liquid crystal display device is applied to the TFT (Thin Film Transistor) type tiled liquid crystal display device, the operation of the STN type and the TFT type is different from each other. This can cause a decrease in reliability of the product.

In addition, in the TFT type tiled liquid crystal display, other elements other than the QFP for driving the LCD panel are mounted on the printed circuit board. Therefore, when the QFP is mounted, the driving unit cannot be integrated for the aforementioned reasons. There is not enough space to mount the devices.

Accordingly, an object of the present invention has been made in view of the above problems, by applying the drive driver IC used in the general liquid crystal display device to the tiled liquid crystal display device to integrate the driving unit and improve the electrical characteristics to improve the reliability of the product To improve.

Other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

In order to achieve the above object, the present invention installs an LCD panel on an upper part of a mold frame, fixes a printed circuit board to a lower surface of a mold frame, and mounts a tape carrier package used for a general liquid crystal display device on a printed circuit board. After that, the LCD panel and the printed circuit board are electrically connected by using the heat seal connector.

Alternatively, an LCD panel is installed on the upper part of the mold frame, and a driving drive IC is mounted on the upper surface, and a glass substrate on which the input / output leads bonded to the input / output terminals of the driving drive IC are formed is fixed to the lower surface of the mold frame. After the printed circuit board is installed on the lower surface of the frame where no glass substrate exists, the LCD panel, the organic substrate, and the printed circuit board are electrically connected by using a connecting means.

Preferably, the connecting means comprises a heat seal connector for connecting the LCD panel and the glass substrate, and an FPC for connecting the printed circuit board of the glass substrate.

Hereinafter, a semiconductor chip of a tiled liquid crystal display according to the present invention will be described with reference to FIGS. 1 to 5.

As shown in FIGS. 1 and 3, the LCD module 1 of the tiled liquid crystal display according to the first embodiment to which the tab mounting method is applied has a mold frame 100 in which a lamp 110 that emits light is stored. And a diffusion sheet 120 installed on the upper surface of the mold frame 100 to diffuse light emitted from the lamp 110 and an LCD panel installed on the upper surface of the diffusion sheet 120 to display an image. 200, a printed circuit board 300 mounted on the lower surface of the mold frame 100 to drive the LCD module 1, and a tape carrier mounted on the printed circuit board 300 to drive the LCD panel 200. The package 400 and the heat seal connector 510 electrically connect the LCD panel 200 and the printed circuit board 300 to each other.

As shown in FIG. 1, the LCD panel 200 includes a TFT substrate 210 and a color filter substrate 250 attached to face the TFT substrate 210 and having the same size as the TFT substrate 210. A liquid crystal material driven by an electro-optic property is injected between the substrate 210 and the color filter substrate 250.

A plurality of gate lines 220 are arranged in a line along the width direction on the upper surface of the TFT substrate 210, and a plurality of data lines 230 are arranged in a line along the length direction so as to intersect the gate lines 220. . Here, the gate lines 220 extend long along the longitudinal direction of the TFT substrate 210, and the data lines 230 extend long along the width direction of the TFT substrate 210.

In addition, gate and data input electrodes 225 and 235 are formed at one end of the gate lines 220 and the data lines 230, and the gate and data input electrodes 225 and 235 are electrically connected to the heat seal connector 510. In order to be connected to the LCD panel 200 is exposed to one side of the width direction and one side of the longitudinal direction.

Meanwhile, conductive patterns for transmitting an electrical signal to the printed circuit board 300 and the LCD panel 200 are provided on one surface of the heat seal connector 510 that electrically connects the LCD panel 200 and the printed circuit board 300. A 515 is formed so that one end is connected to the gate and data input electrodes 225 and 235 via the anisotropic conductive film 130, and the other end is connected to the printed circuit board 300.

According to the present invention, the tape carrier package 400 for driving the LCD panel 200 and the LCD module 1 are driven on the rear surface of the printed circuit board 300 which is not in contact with the bottom surface of the mold frame 100. Various elements 350 are mounted, output wirings 320 electrically connecting the tape carrier package 400 and the conductive patterns 515, the tape carrier package 400, and the various elements 350. Input wirings 330 are formed to connect the same.

Here, the output wirings 320 are formed between the edge portion of the printed circuit board 300 and the tape carrier package 400 adjacent to the heat seal connector 510 and the conductive pattern (as shown in FIGS. 1 and 2). 515 and the output side of the tape carrier package 400 is connected.

Meanwhile, as illustrated in FIG. 1, the tape carrier package 400 includes an edge portion of the printed circuit board 300 corresponding to the data input electrode 235 and a printed circuit board 300 corresponding to the gate input electrode 225. It is mounted on the edge part of).

As shown in FIG. 2, a drive drive IC 410 for driving the gate line 220 or the data line 230 is mounted at the center of the base film 405 of the tape carrier package, and is mounted on the base film 405. Output leads 420 connecting the output wires 320 and output terminals (not shown) of the drive drive IC 410, input terminals (not shown) and input wires of the drive drive IC 410 (not shown). Input leads 430 bonded to 330 are formed.

Here, the driving drive IC 410 was developed for use in a general liquid crystal display device having a light weight and a short size, and is advantageous in integration since the chip size is small and the number of input / output terminals is large.

The assembly process of the LCD module to which the tab mounting method is applied is as follows.

First, as shown in FIG. 1, the diffusion sheet 120 for diffusing light onto the upper surface of the mold frame 100 and the LCD panel 200 for displaying an image are sequentially fixed.

Referring to FIG. 3, the tape carrier package 400 is separately mounted on the printed circuit board 300, and the output leads 420 and the output wires 320 are soldered or anisotropically conductive film 130 by using the tape. The input leads 430 and the input wires 330 are electrically connected to each other. In this case, when the pitch of the output leads 420 is 0.5 mm or less, the anisotropic conductive film 130 is used, and when the pitch is more than 0.5 mm, the output leads 420 and the output wires 320 are soldered. Connect.

As such, when the tape carrier package 400 is mounted on the printed circuit board 300, the printed circuit board 300 is fixed to the rear surface of the mold frame 100.

Subsequently, after the gate and the data input electrodes 225 and 235 and the conductive pattern 515 of the heat seal connector 510 are aligned with each other, one end of the heat seal connector 510 is gated using the anisotropic conductive film 130. And a side surface of the LCD panel 200 in which the data input electrodes 225 and 235 are formed.

Next, in order to drive the LCD panel 200, the conductive patterns 515 of the heat seal connector 510 and the output wirings 320 formed at one end in the width direction and the length direction of the printed circuit board 300 are frozen together. After the drawing, the other end of the heat seal connector 510 is connected to the printed circuit board 300 through the anisotropic conductive film 130.

When the LCD panel 200 and the printed circuit board 300 are electrically connected to each other by the heat seal connector 510 as described above, the image signal or the on / off signal generated by the driving drive IC 410 is transferred to the tape carrier package 400. Gate input electrodes 225 of the LCD panel 200 along the output leads 420 of the plurality of output leads 420, the output wirings 320 formed on the printed circuit board 300, and the conductive patterns 515 of the heat seal connector 510. Or is transferred to the data input electrode 235 to drive the LCD panel 200.

As shown in FIGS. 4 and 5, the LCD module 1 of the tiled liquid crystal display according to the second embodiment to which the COG method is applied may include a mold frame 100 in which a lamp 110 that emits light is stored. And a diffusion sheet 120 installed on the upper surface of the mold frame 100 to diffuse light emitted from the lamp 110 and an LCD panel 200 installed on the upper surface of the diffusion sheet 120 to display an image. ), The mold frame 100 except for the glass substrates 600 and 600 'installed on the lower surface of the mold frame 100 to drive the LCD panel 200 and the areas where the glass substrates 600 and 600' are mounted. The printed circuit board 300 and the LCD panel 200, the glass substrate 600, 600 ′, and the printed circuit board 300 are installed on the lower surface of the substrate and electrically connected to the glass substrates 600 and 600 ′. It is composed of a connection portion 500 for connecting.

As illustrated in FIG. 4, the LCD panel 200 includes a TFT substrate 210 and a color filter substrate 250 attached to face the TFT substrate 210 and having the same size as the TFT substrate 210. A liquid crystal material driven by an electro-optic property is injected between the substrate 210 and the color filter substrate 250.

A plurality of gate lines 220 are arranged in a line along the width direction on the upper surface of the TFT substrate 210, and a plurality of data lines 230 are arranged in a line along the length direction so as to intersect the gate lines 220. . Here, the gate lines 220 extend long along the longitudinal direction of the TFT substrate 210, and the data lines 230 extend long along the width direction of the TFT substrate 210.

In addition, gate and data input electrodes 225 and 235 are formed at one end of the gate lines 220 and the data lines 230, and the gate and data input electrodes 225 and 235 are electrically connected to an external circuit. The LCD panel 200 is exposed to one side of the width direction and one side of the longitudinal direction.

Meanwhile, the glass substrates 600 and 600 ′ according to the present invention have a chip on glass method in which a driving drive IC 610 is mounted on an upper surface thereof.

The source glass substrate 600 ′ is installed in the long side direction of the lower surface of the mold frame 100 corresponding to the direction in which the data input electrode 235 is formed and the mold frame 100 corresponding to the gate input electrode 225. The gate glass substrate 600 is installed in a short side direction of the source glass substrate 600 ', the length of the mold frame 100 is the same as the length of the longitudinal direction, the gate glass substrate 600 is the source glass substrate 600'. Because of the width of the) is smaller than the length of the width direction of the mold frame 100.

Meanwhile, at least two driving drive ICs 610 for applying an image signal to the data line 230 are mounted on the source glass substrate 600 ′, and the gate line 220 is turned on / off on the gate glass substrate 600. One or more driving drive ICs 610 to be turned off are mounted.

In addition, a plurality of input leads 630 are formed in an area adjacent to the printed circuit board 300 around the driving drive IC 610 so that one end thereof is connected to an input terminal of the driving drive IC 610, and the printed circuit board A plurality of output leads 620 having a finer pitch than the input leads 630 are formed at a portion far from the 300, and one end is bonded to the output terminal of the driving drive IC 610.

The printed circuit board 300 is formed smaller than the size of the mold frame 100 due to the area occupied by the gate and source glass substrates 600 and 600 ′ in the mold frame 100, and the gate and source glass substrates 600 and 600. ') Is installed inside. In addition, various elements 350 for driving the LCD module 1 are mounted on a rear surface of the printed circuit board 300 that is not in contact with the mold frame 100 and has one end portion adjacent to the glass substrates 600 and 600 '. Input wires 330 electrically connected to the input leads 630 are formed in the predetermined region.

The connection part 500 includes a heat seal connector 510 for connecting the LCD panel 200 and the glass substrate 600, and an FPC 550 for connecting the glass substrates 600 and 600 ′ and the printed circuit board 300. do. Here, conductive patterns 515 and 555 are formed on one surface of the heat seal connector 510 and one surface of the FPC 550. One end of the conductive patterns 515 formed on the heat seal connector 510 is an anisotropic conductive film. The substrate 130 is bonded to the gate and data input electrodes 225 and 235 through the 130, and the other end thereof is bonded to the output leads 620 formed on the glass substrates 600 and 600 ′.

In addition, one end of the conductive patterns 555 formed on one surface of the FPC 550 is bonded to the input leads 630 of the glass substrates 600 and 600 'by the anisotropic conductive film 130, and the conductive patterns ( The other end of the 555 is connected to the input wires 330 of the printed circuit board 300.

The assembly process of the LCD module to which the COG mounting method is applied is as follows.

First, as shown in FIG. 4, the diffusion sheet 120 for diffusing light onto the upper surface of the mold frame 100 and the LCD panel 200 for displaying an image are sequentially fixed.

Separately, a gate glass substrate 600 having a plurality of drive driver ICs 610 for driving the LCD panel 200 is installed in the short side direction of the mold frame 100 corresponding to the gate input electrode 225, and the data is provided. After installing the source glass substrate 600 'at one end of the mold frame 100 corresponding to the input electrodes 235, the printed circuit board 300 is formed inside the gate and the source glass substrates 600 and 600'. Install it.

Here, the reason why the driving drive IC 610 is mounted on the organic substrates 600 and 600 ′ is that the glass substrates 600 and 600 ′ have better flatness than the printed circuit board 300 and the tape carrier package 400. This is because the deformation is less than that, so the defect rate is less generated in the assembly process of the LCD module 1, so that the reliability can be improved. In addition, when a defective drive driver IC 610 is mounted on the glass substrates 600 and 600, a rework is removed to replace the defective drive drive IC 610 and replace it with a new drive drive IC 610. This is because the work is easy to improve the yield of the product.

As such, when the glass substrate 600 and the printed circuit board 300 are installed on the lower surface of the mold frame 100, the LCD panel 200 and the heat seal connector 515 are used to drive the LCD module 1. The glass substrates 600 and 600 'are connected to each other, and the glass substrates 600 and 600' and the printed circuit board 300 are connected to each other using the FPC 550.

At this time, the conductive patterns 515 of the heat seal connector 510 and the gate and data input electrodes 225 and 235 are aligned, and then one end of the heat seal connector 510 is interposed through the anisotropic conductive film 130. It is connected to the side of the LCD panel 200, and the conductive patterns 515 and the output leads 620 formed on the glass substrates 600 and 600 'are aligned, and then the heat seal using the anisotropic conductive film 130. The other end of the connector 510 is connected to one end of the glass substrates 600 and 600 '.

In addition, the conductive patterns 555 of the FPC 550 and the input leads 630 of the glass substrate 600 are aligned with each other, and one end of the FPC 550 is connected to the glass substrate 600 through the anisotropic conductive film 130. 600, 600 ′, and the conductive patterns 555 of the FPC 550 and the input wirings 330 of the printed circuit board 300 are aligned, and then using the anisotropic conductive film 130. The other end of the FPC 550 is connected to the printed circuit board 300.

As such, the drive drive IC mounted on the tape carrier package and the drive drive IC mounted on the printed circuit board are generally applied to the drive drive IC used to drive the LCD panel in a liquid crystal display device. Compared to the tiled liquid crystal display using QFP, the electrical characteristics are better, the reliability is advantageous, and the development cost is low.

In addition, since drive driver ICs for driving STN- and TFT-type general liquid crystal display devices have been developed, respectively, electrical characteristics are improved when a tiled liquid crystal display device adopts and mounts a drive drive IC suitable for each drive method.

In addition, in the case of a general liquid crystal display device, the size of the driving drive IC is small because it is intended to reduce the weight, thickness, and size, and has more than 240 input / output leads, which is advantageous in terms of space.

As described above, in order to drive the LCD panel of the tiled liquid crystal display device, a tape carrier package having a small size and a large number of input / output leads is mounted on a printed circuit board, and then the input electrodes and the printed circuit board of the LCD panel are mounted. The tap method of connecting the output wires to the heat seal connector is applied.

Alternatively, after the glass substrate having the input / output leads formed on the glass and the driving drive IC mounted thereon is installed on the lower surface of the mold frame, the input electrodes of the LCD panel and the output leads of the glass substrate are electrically connected using heat seal connectors. The chip-on-board method uses the FPC to connect the input leads of the glass substrate and the input wiring of the printed circuit board.

Therefore, the size of the drive driver IC mounted on the tape carrier package or the glass substrate is small, the size of the glass substrate and the size of the tape carrier package are small, thereby increasing the free space on the printed circuit board, and increasing the number of input / output leads of the drive drive IC. The number of driving drive ICs mounted on the carrier package and the organic substrate is reduced, thereby integrating the driving unit.

In addition, the drive driver IC mounted on the tape carrier package and the glass substrate is used in a general LCD module and has been recognized for its reliability. When applied to a tiled liquid crystal display device, the electrical characteristics are good and the tiled liquid crystal display of the STN or TFT method is used. Since there exists a drive drive IC corresponding to the driving of the device, there is an effect that can improve the reliability of the product.

1 is a perspective view showing an LCD module of a tiled liquid crystal display according to a first embodiment of the present invention;

2 is an enlarged view illustrating main parts of an enlarged portion A of FIG. 1;

3 is a longitudinal cross-sectional view taken along the line I-I of FIG. 1.

4 is a perspective view illustrating an LCD module of a tiled liquid crystal display according to a second embodiment of the present invention;

5 is a longitudinal cross-sectional view taken along the line II-II of FIG. 4.

Claims (7)

An LCD panel installed on an upper surface of a mold frame, and attached to an upper substrate so as to face a lower substrate on which signal lines are formed, and an input electrode formed on side surfaces of the lower substrate and the upper substrate so as to be electrically connected to the signal lines; A printed circuit board installed on a lower surface of the mold frame and having output wires and input wires formed on one surface thereof; A drive drive IC mounted on one surface of the printed circuit board and mounted on a base film, output leads formed on the base film to connect output terminals of the drive drive IC to the output wires; A tape carrier package comprising input terminals of a drive drive IC and input leads connecting the input wires; And a connecting means for electrically connecting the LCD panel and the printed circuit board. The tiled liquid crystal display of claim 1, wherein the tape carrier package is mounted on the printed circuit board by a conductive adhesive. The tiled liquid crystal display of claim 1, wherein the connection means is a heat seal connector having a plurality of conductive patterns bonded to the input electrodes and the output wirings on one surface thereof. An LCD panel installed on an upper surface of a mold frame, and attached to an upper substrate so as to face a lower substrate on which signal lines are formed, and an input electrode formed on side surfaces of the lower substrate and the upper substrate so as to be electrically connected to the signal lines; A drive drive IC installed in a predetermined region of a lower surface of the mold frame, the drive drive IC driving the LCD panel, output leads bonded to an output terminal of the drive drive IC, and an input lead bonded to an input terminal of the drive drive IC A glass substrate composed of; A printed circuit board installed on a lower surface of the mold frame except for a portion on which the glass substrate is installed, and having input wirings formed on one surface thereof to be electrically connected to the input leads; And connecting means for electrically connecting the LCD panel, the glass substrate, and the printed circuit board. The tiled liquid crystal display of claim 4, wherein the glass substrate is disposed at one end of the mold frame and at one end of the mold frame corresponding to the direction in which the input electrodes are formed. The tiled liquid crystal display of claim 4, wherein the printed circuit board is smaller than the mold frame due to the glass substrates. The display device of claim 4, wherein the connection means comprises: a heat seal connector formed on one surface of the conductive pattern to bond the input electrodes and the output leads to electrically connect the LCD panel and the glass substrate; A tiled liquid crystal display device comprising an FPC which connects the glass substrate and the printed circuit board by forming input leads and conductive patterns bonded to the input wires on one surface thereof.