KR100626554B1 - Non-metal cutting device and cutting depth control method when cutting - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser cutting device capable of stably cutting non-metal materials including glass materials. In particular, the focal position of a short wavelength laser beam during glass cutting in the manufacture of display modules such as TFT-LCD, PDP, and OLED The purpose is to enable selective substrate cutting such as simultaneous cutting of the upper and lower plates or cutting of only the upper plate by controlling the control.

To this end, the present invention comprises a laser beam generating device for generating a short wavelength laser beam in the ultraviolet region; An irradiation tool for irradiating a desired point on the nonmetallic substrate to cut the short wavelength laser beam; Focus shifting means for varying a focus position of the laser beam in the substrate depth direction; A non-metallic cutting device and a method for controlling depth of cut are provided, including a relative movement means for allowing the substrate and the laser beam to move relative to each other so as to cut the substrate.

Plate, Marking, Substrate, Cutting, Laser, Relative Distance, Calibration

Description

Device for Cutting Glass Substrate in Manufacturing Process of Flat Type Display and Method for controlling depth of cutting for the Glass Substrate}

1 is a view showing a configuration according to an embodiment of a substrate cutting device for manufacturing a flat panel display device of the present invention

2A and 2B are reference diagrams and flowcharts illustrating a first example of the apparatus and method for controlling the laser beam focus position in the substrate cutting apparatus of the present invention.

3A and 3B are reference diagrams and flowcharts illustrating a second example of the apparatus and method for controlling the laser beam focus position in the substrate cutting device of the present invention.

4A and 4B are reference diagrams and flowcharts illustrating a third example of the apparatus and method for controlling the laser beam focus position in the substrate cutting device of the present invention.

5A and 5B are reference diagrams for explaining practical application examples of the substrate cutting apparatus of the present invention.

Figure 5a is a reference diagram showing a case of cutting the upper and lower surfaces of the bonding panel at the same time

Figure 5b is a reference diagram showing the case of step cutting to cut only one side of the upper and lower surfaces of the bonding panel

Explanation of symbols on the main parts of the drawings

1: Base 2: Table

3: left and right direction guide column 4: front and rear direction guide column

5: mover 6: probe

7: probe mounting block 8: focus shifting means

9 laser displacement sensor 10 laser beam generator

11: optical system

The present invention relates to a substrate cutting device for manufacturing a flat panel display device and a laser beam focus control method thereof, and more particularly, to a short wavelength laser when cutting a glass substrate for manufacturing a flat panel display device such as TFT-LCD, PDP, OLED, etc. using a laser beam. By controlling the cutting depth through the focal position of the beam, it is possible to selectively cut the substrate such as simultaneous cutting of the upper and lower plates or cutting of only the upper plate.

In general, in the process of manufacturing flat panel display devices such as TFT-LCD, PDP, and OLED, it is necessary to cut the glass of the disc to fit the size of each module after the cell process bonding process. In addition, it is necessary to selectively cut only the glass of the upper plate in the bonded substrate.

Conventional methods for such cutting include cutting methods using mechanical means such as diamond bond wheels. In this case, primary cracks caused by the direct impact of the wheels and secondary cracks caused by the further development of the primary cracks. The cutting depth of the glass is determined, but the degree of occurrence of the primary and the secondary cracks generated at this time is different, so that the cutting depth is not uniform, and thus the cutting surface of the substrate is not precise.

As another cutting method, a cutting method using a CO2 laser is used. The first microcracks are mechanically formed by using a wheel, which is a mechanical means, at the starting point of the scribe line, and the heating beam is secondly glassed using a CO2 laser. After irradiating and heating, there is a laser cutting method of rapidly cooling the heated glass part using a tertiary cooling device (Quencher) to cause secondary cracks due to instantaneous thermal deformation.

Even in the cutting method as described above, there is no method of accurately controlling the cutting depth of the glass, which causes a problem that the cutting surface becomes inaccurate.

Among the two cutting methods described above, a schematic configuration of a conventional apparatus for a cutting method using a CO 2 laser is as follows.

Conventional laser cutting device, a support (or table) for supporting a glass substrate to be cut, an auxiliary cracker for forming an auxiliary crack in accordance with the cutting direction on the substrate, and irradiating a heating beam along the cutting schedule line A heating optical device for heating the substrate, and a cooling device for quenching the portion heated by the heating optical device to generate cracks.

Glass cutting by such a conventional laser cutting device, the formation of the cutting crack by rapid cooling by spraying a coolant, such as He while the auxiliary crack forming process by the wheel, the heating process along the auxiliary crack, the cooling device moves in the same direction Process, re-irradiation of the scribe laser beam and re-cooling process.

And, for more detailed configuration and operation of such a conventional cutting device using a laser, refer to Korea Patent Publication No. 2002-88258, so a detailed description thereof will be omitted.

However, in the conventional cutting method described above, only a single plate can be cut, so that a cutting device must be formed on both upper and lower sides of the substrate to simultaneously cut the upper and lower plates of the cemented panel.

That is, in the conventional cutting method using a mechanical means such as a diamond bond wheel, only one end plate can be cut by one wheel, so that the upper and lower plates of the cemented panel can be cut at the same time. none. In addition, a support roller supporting each of the dedicated wheels on the lower and upper surfaces of the cementing panel should be provided, and a braking device must also be provided for separation of the cut surfaces, and thus it is not easy to utilize them.

In particular, the conventional mechanical cutting device, each of which is provided on the upper and lower sides of the joining panel, has to perform the cutting operation by exactly matching the upper and lower side wheels, so that the correcting work for the matching of the upper and lower side wheels must be accompanied. In this case, the cut surface is displaced, which adversely affects the quality of the product.

In addition, in the case of a cutting method using another CO 2 laser, a CO 2 laser, an auxiliary cracker, a cooling device, and the like must be provided on the upper and lower sides of the bonding panel, respectively, and the device configuration becomes complicated, and thus the product productivity is reduced.

In addition, this cutting method is also required to perform a cutting operation by exactly matching the CO2 lasers respectively provided on the upper and lower sides of the bonding panel, so that a corrective operation for matching the upper and lower dedicated wheels should be accompanied. It will adversely affect the quality of the product.

In particular, since the cutting method cannot accurately control the cutting depth of the glass as described above, a problem in which the precision of the cutting surface is significantly lowered appears.

The present invention has been made to solve the above problems, the depth of cut through the focal position in the substrate depth direction of the short wavelength laser beam during the glass cutting in the production of display modules such as TFT-LCD, PDP, OLED By controlling precisely as desired, the purpose is to enable selective substrate cutting such as simultaneous cutting of the upper and lower plates or cutting of only the upper plate.

According to a first aspect of the present invention for achieving the above object, a laser beam generating device for generating a short wavelength laser beam in the ultraviolet region; An irradiation tool for irradiating a desired point on the nonmetallic substrate to cut the short wavelength laser beam; A focus shifting means for varying a focus position of the laser beam in the substrate depth direction; And a relative movement means for cutting the substrate so that the substrate and the laser beam move relative to each other. A non-metallic material cutting device is provided.

On the other hand, according to a second aspect of the present invention for achieving the above object, a laser beam generating device for generating a short wavelength laser beam in the ultraviolet region; An irradiation tool for irradiating a desired point on the nonmetallic substrate to cut the short wavelength laser beam; Measuring means for measuring the distance from the irradiation port to the substrate and the relative distance between the substrate and the laser beam; A focus shifting means for varying the focus position of the laser beam in the substrate depth direction and for varying the height from the substrate to the irradiation port so as to correspond to the measured relative distance in order to keep the cutting depth constant during cutting; And a relative movement means for cutting the substrate so that the substrate and the laser beam move relative to each other. A non-metallic material cutting device is provided.

On the other hand, according to the third aspect of the present invention for achieving the above object, a non-metal substrate cutting method using a short wavelength laser beam in the ultraviolet region; Setting the focal position of the laser beam in the substrate depth direction, measuring the distance from the laser beam irradiation port to the main surface of the substrate, and setting the focal position of the laser beam based on the distance to the main surface of the substrate and the set focal position data. A cutting depth control method when cutting a non-metallic material, characterized in that it comprises the step of moving to a position.

On the other hand, according to a fourth aspect of the present invention for achieving the above object, there is provided a method for cutting a non-metallic substrate using a short wavelength laser beam in an ultraviolet region; By setting the focal position of the laser beam in the substrate depth direction, measuring the distance from the laser beam irradiation port to the main surface of the substrate, and adjusting the variable focus lens based on the distance to the main surface of the substrate and the set focal position data. Provided is a method for controlling the depth of cut when cutting a non-metallic material, including moving the focus position of the laser beam to a set position.

Hereinafter, exemplary embodiments of a substrate cutting apparatus and a cutting method for manufacturing a flat panel display device according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a view illustrating a structure according to an embodiment of a substrate cutting apparatus for manufacturing a flat panel display device according to an embodiment of the present invention, and a table 2 supporting a glass substrate (not shown) is provided at the center of the base 1. Front and rear direction guide columns 4 are provided on both sides of the table 2, and linear motors and movers 5 are provided on the front and rear direction guide columns 4, respectively.

Then, each mover (5) is equipped with a left and right guide column (3) for guiding the movement in the left and right direction of the irradiation sphere 6 to cause a relative movement with respect to the substrate, the left and right guide column (3) The linear motor and the mover, which are separate from the linear motor and the mover 5 installed in the front and rear direction guide column 4, are respectively provided.

In addition, a mover mounting block 7 for mounting the irradiation port 6 is mounted on the mover on the left and right guiding column 3, and the irradiation hole mounting block 7 collects a short wavelength laser beam in an ultraviolet region. The irradiation tool 6 (torch) which irradiates to a predetermined position of a glass substrate is mounted.

On the other hand, the substrate cutting device of the present embodiment is provided with an optical system 11 for guiding a laser beam to the irradiation port 6 side, and a laser beam generator 10 for generating a short wavelength laser beam in the ultraviolet region.

On the other hand, the substrate cutting device of the present invention includes measuring means 9 for measuring the relative distance between the substrate and the focal point of the laser beam and the distance from the irradiation port 6 to the substrate main surface (ie, the upper surface of the substrate). .

At this time, the measuring means 9 is provided with a non-contact displacement sensor, more specifically, it is preferable that a laser displacement sensor installed at the front end of the cutting laser beam to irradiate the laser beam.

As the non-contact displacement sensor, an LED sensor or other ultrasonic sensor, which is an optical sensor, may be applied.

On the other hand, in the substrate cutting device of the present invention, when adjusting the focus to be located at the cutting depth of the substrate prior to cutting, the focus shift for changing the focus position of the laser beam in the substrate depth direction to match the focus position with the cutting depth. Means 8 are provided.

At this time, the focus shifting means 8 has a height from the substrate to the irradiation aperture 6 so as to correspond to the relative distance between the focal point of the laser beam and the main surface of the substrate measured so as to keep the cutting depth constant when cutting the substrate. It also acts as a variable.

The laser beam focusing means 8 includes a step motor as a driving source, a ball screw shaft coupled to the step motor, and a ball screw block coupled to the ball screw shaft and mounted with the irradiation hole 6. Can be configured.

Another example of the laser beam focusing means 8 may include a linear motor and a mover coupled to the liner motor to move up and down, and to which the irradiation port 6 is mounted.

In addition, another example of the laser beam focal shifting means 8 may be a piezoelectric element coupled to the irradiating sphere to be mechanically deformed to move the position of the irradiating sphere 6 when a predetermined voltage is applied. .

On the other hand, the laser beam focusing movement can be implemented through optical adjustment, not mechanical position adjustment, the laser beam focusing means is achieved by the variable focus lens (8a) is installed in the irradiation port (6) It could be.

In this case, the distance between the lens constituting the variable focus lens 8a and the lens is different from the case where the focus position is controlled by changing the distance between the irradiation aperture 6 and the substrate without changing the focal length. By varying the focal length through it is possible to control the cutting depth without changing the distance between the irradiation sphere 6 and the substrate, of course.

On the other hand, the irradiation port 6 is preferably provided with at least two or more to improve the cutting speed, therefore, by installing two laser oscillation device to be used in each of the irradiation port and using a single laser oscillation device The laser beam path conversion device may be installed so that the generated laser beams can be selectively incident on each irradiation hole, and a method of using two irradiation holes may be applied.

In addition, a method of dividing a laser beam generated by one laser oscillator through a spectrometer and receiving and cutting the laser beam into two irradiation holes may be applied. In this case, the energy may also be relatively lowered when the laser is divided. However, even if the energy is initially output is enough, even if the beam is divided, if the energy of the size required for cutting can be secured.

According to the above-described configuration, the substrate placed on the table 2 is cut while the substrate is cut by the relative movement of the irradiation aperture 6 and the short wavelength laser beam in the ultraviolet region. The configuration of the relative movement means for causing the laser beam to move relative to the cutting operation of the substrate is not limited to the above-described example.

That is, unlike the above-described configuration, the irradiation tool 6 may be cut in the glass substrate while the table 2 on which the substrate is placed moves in the front and rear and left and right directions while remaining still. It is also possible to proceed with the cutting operation to move all the irradiation sphere (6).

On the other hand, the laser beam generator 10 is a laser oscillator of the Nd-YAG medium, a laser diode for providing a light source for excitation to the laser oscillator, and converts the wavelength of the laser beam generated by the laser oscillator to a short wavelength It is configured to include a wavelength converter.

In addition, the long-wavelength laser beam from the Nd-YAG medium is converted into a short wavelength in the ultraviolet region of 200 nm to 400 nm (nanometer) through a crystal that performs a wavelength conversion function.

On the other hand, and the frequency of the laser beam is characterized in that it belongs to the range of several KHz to several tens of KHz.

In particular, the frequency of the laser beam is preferably 10KHz or more, more preferably in the range of 10KHz to 30KHz. Of course, the frequency of the laser beam may be greater than or equal to 30 KHz depending on the situation.

For reference, YAG is a method using Yttrium, Aluminum, and Garnet when creating an oscillator for generating a laser beam. Here, Neodymium (Nd: neodymium, atomic number 60, atomic weight 144.2) is used. Addition is Nd-YAG.

The glass substrate cutting process of the flat panel display device using the substrate cutting device of the present invention configured as described above is as follows.

In the process of manufacturing display devices such as TFT-LCD, PDP, and OLED, a substrate cutting process of cutting the substrate after bonding the substrates is performed.

The substrate is formed of a plurality of display unit cells on the original substrate of the glass, it is necessary to cut each of these cells.

In addition, in order to control the display information of the substrate, the TAB is attached to a specific surface of the substrate. In this surface, it is necessary to cut only the single plate of the panel P bonded in two sheets.

To this end, first, the glass substrate is externally placed on the table 2 into which the substrate is loaded and mounted by a transport robot or the like.

At this time, the substrate placed on the table 2 is fixed in a horizontal state on the table 2 by a support pin (not shown) installed in the table 2 or a plurality of vacuum holes (not shown) formed in the table 2. It is supported in a stable state.

Then, the relative position of the laser beam to be irradiated with the substrate is corrected so that the substrate fixed on the table 2 as described above can be cut into a desired shape.

This calibration is performed by an image recognition device (e.g., a vision camera) that recognizes a mark for position correction formed on a substrate, confirms its position, and irradiates a laser beam to the table 2 on which the substrate is mounted. By moving relative).

The position of the laser beam is determined by irradiating a test laser beam to the dummy glass, and detecting the position of the laser beam trace on the glass formed by using an image recognition device such as a vision camera, or the laser beam The irradiated opening 6 to be irradiated can be grasped | ascertained by recognizing the position of the irradiating opening 6 using the image recognition apparatus provided in the lower part.

On the other hand, after correcting the relative position of the substrate and the laser beam as described above, the substrate is cut into a desired shape by relative movement of the substrate and the laser beam.

That is, the laser beam generated by the laser oscillator using Nd-YAG as a medium is provided to the irradiation port 6, which is a light collecting part of the laser beam, through the installed optical system 11, and irradiated to a predetermined position on the substrate. The table 2 on which the substrate is mounted is fixed without moving, and the irradiation port 6 is moved, which results in the substrate being cut by the movement of the laser beam.

Here, the laser beam generated by the laser oscillator is a laser diode as a light source, and the generated laser beam passes through the optical system 11 made of a plurality of mirrors, and changes its path to the irradiation hole 6 which is the laser beam condenser. Millers on the optics 11 which send the laser beam towards the irradiating opening 6 and the irradiating opening 6 are simultaneously moved in parallel so that irradiation of the ultraviolet region on the substrate is independent of the change of the position of the irradiating opening 6. The substrate can be cut into a desired shape by irradiating a short wavelength laser beam.

At this time, the wavelength of light generated from the diode, which is a light source, is provided to the Nd-YAG medium to excite in the gain medium to oscillate the laser in the 1000 nm band. The laser thus oscillated is passed through a wavelength conversion crystal and oscillated at a short wavelength of 200 nm to 400 nm.

The reason why the laser is converted to a short wavelength is to use the short wavelength in the ultraviolet region because the damage of the product caused by the heat deformation caused by the long wavelength can be minimized when the laser beam is irradiated to the non-metallic material such as the glass substrate to be cut. to be.

In addition, Q-switching is optically performed using an optical resonator to increase the energy of the laser beam, and ultrashort pulses of several ns (nanoseconds) to several tens of ns or less are generated through Q-switching.

In addition, the laser beam is irradiated by generating a frequency of several tens of KHz or more in order to increase the cutting speed, because clean cutting is performed even if the moving speed of the irradiation hole 6 is fast or the moving speed of the table 2 is fast.

On the other hand, when the actual glass substrate is cut, when the unit cell on the substrate is cut in the front-rear direction, the left-right guide column 3 is moved by the linear guide column 4 by the front-rear guide column 4 by the action of the linear motor. While the laser beam is irradiated through the irradiation hole 6, the substrate is cut in the front-rear direction.

When the substrate is cut in the left and right directions, the irradiation hole mount block 7 and the irradiation hole 6 mounted thereon are moved by the action of the linear motor provided on the left and right direction guide columns 3. The laser beam is irradiated through the irradiation hole 6 while moving in the left and right direction under the guidance of 3), thereby cutting the substrate in the front-rear direction.

As described above, as the short-wavelength laser beam in the ultraviolet region alternates between forward and backward movements and left and right movements, each cell on the glass substrate is completely individually singulated.

On the other hand, when cutting the glass substrate using the short-wavelength laser beam in the ultraviolet region as described above, the cutting depth on the substrate must be set accurately before the actual cutting operation.

And, for this purpose, the position where the focus of the laser beam is focused should be controlled to match the cutting depth of the substrate to be cut. The process is as follows.

First, referring to FIGS. 2B and 3B, the focal position of the laser beam in the substrate depth direction is set to a desired value, and then the distance measurement from the laser beam irradiation port 6 to the substrate main surface is performed.

Therefore, the actual focus position of the laser beam is moved to coincide with the preset focus position based on the distance to the main surface of the substrate and the set focus position data.

At this time, the focal position control of the laser beam is made by raising and lowering the irradiation hole 6 as shown in Figs. 2a and 2b, or as shown in Figs. 3a and 3b, raising and lowering the substrate. Will be done by

That is, as the distance from the laser beam irradiator 6 to the main surface of the substrate is changed without changing the focal lengths B1, B2, B3; B1 = B2 = B3, the cutting depths D1, D2, D3; D1 <D2. It is possible to vary <D3).

Meanwhile, referring to FIGS. 4A and 4B, the depth of cut can be controlled without changing the distance between the irradiation tool 6 and the substrate by varying the focal length.

That is, first, the focal position of the laser beam in the substrate depth direction is set, and then the distance measurement from the laser beam irradiation port 6 to the main surface of the substrate is performed.

Therefore, the focus position of the laser beam is moved to the set position based on the distance to the main surface of the substrate and the set focus position data. In this case, according to the present embodiment, the variable focus lens 8a installed in the irradiation port 6 is provided. By adjustment, the focal length of the laser beam is changed (B1, B2, B3; B1 &lt; B2 &lt; B3 in Fig. 4A).

In other words, by increasing or decreasing the focal length of the laser beam, the focal position is controlled without changing the distance between the irradiation port 6 and the substrate.

At this time, the distance measurement from the laser beam irradiator 6 to the main surface of the substrate is made non-contact, and is made by irradiation of a distance measuring beam separate from the short wavelength laser beam in the ultraviolet region for cutting. .

As described above, the non-metal material cutting device of the present invention can be cut precisely with respect to the non-metal material, so that the step cutting (cutting form of cutting only one of the upper and lower plates) to the panel P such as a flat panel display device or Simultaneous cutting of the upper and lower surfaces of the bonding panel P can be selectively performed.

That is, in order to simultaneously cut the upper and lower surfaces of the bonding panel P to separate the unit cells, as shown in FIG. 5A, the laser beam is focused on the bottom surface of the lower panel according to the overall thickness of the bonding panel P, and then the cutting is performed. Just do it.

When the step cutting is performed to cut only one of the upper and lower plates of the bonding panel P, the focus of the laser beam is matched to the bottom of the upper plate according to the thickness of the upper plate as shown in FIG. 5B. This is done by cutting.

Hereinafter, the Q-switching optically performed to increase the energy of the laser beam and the optical resonator applied thereto will be described.

Under normal oscillation, the gain of the laser medium is small enough to just exceed the loss that includes the output extraction. At this time, the inverted distribution amount is increased to a threshold value or more to obtain a more powerful laser beam.

Looking at this, the loss of the resonator is increased in order to increase the inversion distribution amount above the oscillation threshold. That is, the Q value becomes small.

When the Q value is artificially reduced and the inversion distribution has a certain value, if the Q value is increased again, the gain coefficient is much larger than the oscillation threshold, and thus a powerful laser beam may be oscillated. This technique is called a Q-switch.

On the other hand, when the optical resonator is described, a parallel mirror capable of resonating a beam is used because an amplification of the beam by induced emission alone does not produce an efficient laser beam.

Induction emission occurs while the inversion distribution continues, and the beam is amplified when the beam is returned to the laser medium section by the reflection mirror. Since a standing wave is generated and the induced emission is rapidly increased, the structure having such a structure is called a resonator and a laser beam comes out.

According to the present invention as described above, by controlling the focal position of the short-wavelength laser beam when cutting the glass in the manufacture of display modules such as TFT-LCD, PDP, OLED, the cutting depth can be accurately controlled as desired For example, when the display module is manufactured, selective substrate cutting, such as simultaneous cutting of the upper and lower plates or cutting of only the upper plate, becomes possible.

Claims (20)

delete delete delete delete delete delete delete delete A laser beam generator for generating a short wavelength laser beam in the ultraviolet region; An irradiation tool for irradiating a desired point on the nonmetallic substrate to cut the short wavelength laser beam; Focus shifting means for varying a focus position of the laser beam in the substrate depth direction; Relative moving means for causing the substrate and the laser beam to move relative to each other so as to cut the substrate; The laser beam focusing means is a non-metallic material cutting device characterized in that it comprises a linear motor and a mover coupled to the linear motor, the lifter is mounted. A laser beam generator for generating a short wavelength laser beam in the ultraviolet region; An irradiation tool for irradiating a desired point on the nonmetallic substrate to cut the short wavelength laser beam; Focus shifting means for varying a focus position of the laser beam in the substrate depth direction; Relative moving means for causing the substrate and the laser beam to move relative to each other so as to cut the substrate; The laser beam focusing means is a non-metallic material cutting device, characterized in that the piezoelectric element coupled to the irradiation sphere to move the position of the irradiation sphere mechanically deformed when a predetermined voltage is applied. A laser beam generator for generating a short wavelength laser beam in the ultraviolet region; An irradiation tool for irradiating a desired point on the nonmetallic substrate to cut the short wavelength laser beam; Focus shifting means for varying a focus position of the laser beam in the substrate depth direction; Relative moving means for causing the substrate and the laser beam to move relative to each other so as to cut the substrate; The laser beam focusing means is a non-metallic material cutting device, characterized in that the variable focus lens installed inside the irradiation port. The method according to any one of claims 9 to 11, And a measuring means for measuring a distance from the irradiation port to the substrate. The method according to any one of claims 9 to 11, The measuring means, Non-metal cutting device characterized in that the laser displacement sensor is installed to irradiate the laser beam for distance measurement in front of the laser beam irradiation port. The method according to any one of claims 9 to 11, The irradiating tool is a non-metallic cutting device, characterized in that at least two or more irradiating holes having a different focal length of the laser beam. In the non-metal substrate cutting method using a short wavelength laser beam in the ultraviolet region, Setting a focal position of the laser beam in the substrate depth direction; Measuring the distance from the laser beam irradiation port to the main surface of the substrate; And moving the focus position of the laser beam to the set position based on the distance to the main surface of the substrate and the set focus position data. The method of claim 15, Focus position control of the laser beam is a cutting depth control method when cutting a non-metal material, characterized in that made by moving the irradiation port. The method of claim 15, The depth control method of cutting the non-metal material, characterized in that for controlling the focus position of the laser beam is made by moving the substrate. In the non-metal substrate cutting method using a short wavelength laser beam in the ultraviolet region, Setting a focal position of the laser beam in the substrate depth direction; Measuring the distance from the laser beam irradiation port to the main surface of the substrate; And shifting the focus position of the laser beam to the set position by adjusting the variable focus lens based on the distance to the main surface of the substrate and the set focus position data. The method according to claim 15 or 18, A method for controlling the cutting depth of a nonmetallic material, characterized in that the distance measurement from the laser beam irradiation port to the main surface of the substrate is performed in a non-contact manner. The method of claim 19, The distance measuring method of the said laser beam irradiation port from the main surface of a board | substrate is performed by irradiation of the distance measuring beam, The cutting depth control method of the nonmetallic material characterized by the above-mentioned.

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