CN100528455C - Device for cutting glass substrate and its method - Google Patents

Abstract

The invention discloses a non-metal substrate cutting device and a method thereof. The invention is suitable for cutting various non-metal substrates (for example: for manufacturing such as thin film transistor-liquid crystal display (TFT-LCD), plasma display (PDP), For glass substrates of flat-panel displays such as organic light-emitting displays (OLEDs), the method of controlling the cutting depth by adjusting the focus position of the short-wave laser is used to simultaneously cut the upper and lower substrates, or selectively cut the upper and lower substrates. The invention comprises: a laser beam generator (10), used to generate ultraviolet (UV) short-wave laser beams; a laser head (6), applying a short-wave laser beam to a specific position on a non-metallic substrate to be cut; a focus moving device (8), used to change the focus position of the laser beam along the depth direction of the substrate; and relative object moving devices (3, 4), used to allow the substrate and the laser beam to move relative to each other to cut the substrate.

Description

Non-metal substrate cutting equipment and method thereof

technical field

The present invention relates to a kind of non-metallic substrate cutting equipment and method thereof, especially suitable for cutting various non-metallic In the case of glass substrates for flat-panel displays such as light-emitting displays (OLEDs), the upper and lower substrates are simultaneously cut, or the upper and lower substrates are selectively cut by adjusting the focus position of the short-wavelength laser beam to control the cutting depth.

Background technique

Generally speaking, in the manufacture of flat display devices such as thin-film transistor-liquid crystal display (TFT-LCD), plasma display (PDP), organic light-emitting display (OLED), etc., the glass substrate must be cut after the pretreatment of the unit process is completed. to match the size of each module. In addition, it is also necessary to selectively cut the glass of the upper plate only on the bonded substrate.

A glass cutting method according to the related art is cutting by using a mechanical tool such as a diamond wheel. Therefore, the cutting depth of the glass is determined by an initial crack produced by the head-on impact of the grinding wheel and a secondary crack produced by reprocessing the initial crack. Since the sizes of the primary crack and the secondary crack are different from each other, the cutting depth is not uniform, and therefore, the cutting surface of the substrate is not precise.

According to another cutting method of the related art, it is a carbon dioxide (CO2) laser (laser) cutting method, which includes the following steps: using a grinding wheel as a mechanical instrument, forming an initial microcrack at the starting point of a scribe line; secondly, The glass is heated using the heating beam of the CO2 laser; then, the heated portion of the glass is rapidly cooled using a cooler (quencher) to cause a second crack on the glass due to an instantaneous heat change.

In the above cutting method, since the cutting depth of the glass cannot be precisely controlled, the cutting surface of the glass is imprecise.

Among the above two cutting methods, an apparatus for a laser cutting method using a CO2 laser according to the related art is explained below.

First, a laser cutting machine according to the related art includes: a support table or a workbench to support the glass substrate to be cut; an auxiliary cracker (cracker) to form auxiliary cracks consistent with the cutting direction of the substrate; an optical heating system, through applying a heating beam to the substrate along a cutting line to heat the substrate; and a cooler to generate cracks by cooling a portion heated by the optical heating system.

Glass cutting using a laser cutting machine of the related art includes: a step of forming auxiliary cracks using a grinding wheel; a step of heating according to the auxiliary cracks; moving in the same direction using a cooler and spraying a coolant such as helium gas, etc., through rapid cooling. A step of forming cut cracks; a step of repeated irradiation of a scribe laser beam; and a step of recooling.

The detailed structure and operation of the related art are described in Korean Patent Publication No. 2002-88258.

However, the above-mentioned related cutting method that allows cutting of a single board needs to provide cutting devices on the upper and lower sides of the substrate to simultaneously cut the upper and lower boards of the bonded board.

That is, in the cutting method of the related art using a mechanical device such as a diamond grinding wheel, one grinding wheel can only cut one substrate. Therefore, in order to simultaneously cut the upper and lower panels of the bonded board, it is necessary to provide dedicated grinding wheels for the upper and lower panels, respectively. Moreover, it is also necessary to provide support rollers for supporting the special grinding wheel to respectively support the upper and lower surfaces of the bonding board. In addition, a separating device is required to separate the cut surfaces. Therefore, the system configuration of the cutting machine is complicated to make the related art method and system difficult to use.

Especially, in the related art mechanical cutting device in which grinding wheels are provided at the lower part of the bonded plate, the upper and lower dedicated grinding wheels should be precisely aligned for cutting work. Therefore, a correction step should be provided together so that the positioning of the upper and lower special grinding wheels coincides. If misalignment occurs, the cut faces will misalign, reducing product quality.

In the cutting method using a CO2 laser beam, equipment such as a CO2 laser, an auxiliary cracker, a cooler, etc. should be placed above and below the bonded plate, and therefore, the entire system structure is complicated, thereby reducing productivity.

Also, in the cutting method using the CO2 laser beam, since the CO2 laser beams provided above and below the bonding plate need to be precisely aligned respectively to perform the cutting work, alignment correction of the upper and lower dedicated grinding wheels is required. Once a correction error occurs, it will cause the cutting surfaces to misalign, thereby reducing product quality.

In particular, the above cutting method cannot accurately control the cutting depth of the glass substrate, thus greatly reducing the accuracy of the cutting surface.

Contents of the invention

In view of the above problems, the present invention is directed to a non-metallic substrate cutting apparatus and method thereof, which substantially solve one or more problems due to limitations and disadvantages of the related art.

The object of the present invention is to provide a kind of non-metal substrate cutting equipment and method thereof, in cutting various non-metal substrates, for example: be used for making such as thin film transistor-liquid crystal display (TFT-LCD), plasma display (PDP), organic light-emitting For glass substrates of flat-panel displays such as displays (OLEDs), by adjusting the focus position of the short-wave laser to control the cutting depth, the upper and lower substrates can be cut simultaneously, or the upper and lower substrates can be selectively cut.

Other features and advantages of the present invention will be described in the following description, and part of them will be apparent from the description, or can be learned by practicing the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the description and claims hereof as well as the appended drawings.

Therefore, in order to achieve the above-mentioned and other advantages, according to the object of the present invention, as embodied and broadly described, the apparatus for cutting non-metallic substrates according to the present invention includes: a laser beam generator for generating ultraviolet (UV) Short-wavelength laser beam; laser head (torch), used to emit short-wavelength laser beam to a specific position on the non-metallic substrate for cutting; focus moving device, used to change the focus of the laser beam along the depth direction of the substrate position; and a relative object moving device for allowing the substrate and the laser beam to move relative to each other to cut the substrate.

For further realizing these and other advantages, according to the object of the present invention, the equipment for cutting non-metallic substrate comprises: laser beam generator, in order to produce ultraviolet (UV) short-wavelength laser beam; Laser head, in order to short-wavelength The laser beam is emitted to a specific position of the non-metallic substrate for cutting; the laser displacement sensor is used to measure the distance between the laser head and the substrate and the relative distance between the substrate and the laser beam; the focus moving device is used to move along the The depth direction of the substrate changes the focus position of the laser beam, and is used to change the height of the substrate to the laser head to correspond to the measured relative distance, thereby maintaining the consistency of the cutting depth during the cutting process; and the relative object moving device for The substrate is allowed to move relative to the laser beam to cut the substrate.

For further realizing these and other advantages, according to the object of the present invention, the method for cutting non-metallic substrate comprises the following steps: providing ultraviolet (UV) short-wavelength laser beam; setting the focal position of laser beam on the depth direction of substrate ; measuring the distance between the laser head and the main substrate surface; and moving the focus position of the laser beam according to the distance from the laser head to the main substrate surface and the set focus position data.

For further realizing these and other advantages, according to the purpose of the present invention, the method for cutting non-metallic substrate comprises the following steps: providing ultraviolet (UV) short-wavelength laser beam; Providing zoom lens, to change the focal length of laser beam; Setting The focus position of the laser beam in the depth direction of the substrate; measuring the distance between the laser head and the main substrate surface; and moving the focus position of the laser beam to the set point according to the distance from the laser head to the main substrate surface and the set focus position data fixed focus position.

For further realizing these and other advantages, according to the purpose of the present invention, the method for cutting non-metallic substrate comprises the following steps: install non-metallic substrate on the workbench, and be fixed on it; Provide ultraviolet (UV) short-wavelength laser beam; set the focus position of the laser beam along the depth direction of the substrate to a specific value; measure the distance between the laser head and the main substrate surface; according to the distance from the laser head to the main substrate surface and the set focus position data, through moving the actual focus position of the laser beam to be consistent with the preset focus position to correct the relative position between the substrate and the laser beam; applying an ultraviolet (UV) short-wavelength laser beam to a predetermined position on the substrate through the laser head; and relative The substrate and laser beam are moved to cut the substrate into a specific shape.

Therefore, when cutting various non-metallic substrates, for example: in order to manufacture glass substrates such as thin-film transistor-liquid crystal displays (TFT-LCD), plasma displays (PDP), organic light-emitting displays (OLEDs) and other flat displays, the present invention can By adjusting the focus position of the short-wavelength laser beam, the specific cutting depth can be precisely controlled. In particular, the present invention can simultaneously cut the upper and lower substrates of the adhesive sheet (P), or selectively cut the upper substrate or the lower substrate during the manufacturing process of the display module.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory, and are intended to provide further explanation of the claimed invention.

Description of drawings

The accompanying drawings are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification. The drawings illustrate the embodiments of the invention and together with the description serve to explain the principles of the invention.

1 is a perspective view of a non-metallic substrate cutting device according to one embodiment of the present invention;

2A and 2B are respectively a schematic diagram of a laser beam focus controller in a non-metallic substrate cutting device and a flow chart of its method according to a first embodiment of the present invention;

3A and 3B are respectively a schematic diagram of a laser beam focus controller in a non-metallic substrate cutting device and a flow chart of its method according to a second embodiment of the present invention;

4A and 4B are respectively a schematic diagram of a laser beam focus controller in a non-metallic substrate cutting device and a flow chart of its method according to a third embodiment of the present invention; and

5A and 5B are schematic diagrams for explaining the practical application of the non-metallic substrate cutting device according to the present invention, wherein Fig. 5A shows an example of simultaneously cutting the upper and lower substrates of the bonding board, and Fig. 5B shows cutting bonding Asynchronous cutting of the upper or lower substrate of the board.

Detailed ways

Reference will now be made in detail to the preferred embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Like reference numerals refer to like elements throughout the drawings of the specification. .

FIG. 1 is a perspective view of a non-metallic substrate cutting apparatus for manufacturing a flat panel display according to one embodiment of the present invention.

Referring to FIG. 1, a non-metallic substrate cutting device for manufacturing a flat panel display according to an embodiment of the present invention includes: a workbench 2, which is arranged on a central portion of a base 1 to support a glass substrate (not shown in the drawings) ; The front and rear guide columns 4 are respectively arranged on both sides of the workbench 2 ;

Left and right guide columns 3 are arranged on each pusher 5 to guide a laser head 6 to move in left and right directions. Moreover, the left and right guide columns 3 are provided with linear motors and propellers, which are different from the aforementioned linear motors and propellers 5 arranged on the front and rear guide columns 4 .

Laser head fixing block 7 is installed on the propeller of left and right guide column 3, therefore, laser head 6 can be installed on the propeller. Moreover, the laser head 6 is installed on the laser head fixing block 7, wherein the laser head 6 can gather ultraviolet short-wavelength laser beams and irradiate them to a designated area of the glass substrate.

Moreover, the substrate cutting equipment according to the present invention includes: an optical system 11, which guides the laser beam to the laser head 6; and a laser beam generator 10, to generate an ultraviolet short-wavelength laser beam.

Furthermore, the substrate cutting apparatus according to the embodiment of the present invention includes: a measuring device 9 to measure the relative distance between the substrate and the focal point of the laser beam, and to measure the distance between the laser head 6 and the main substrate surface such as the upper surface of the substrate.

The measuring device 9 includes a non-contact displacement sensor, in particular, a laser displacement sensor (not shown in the figure), which is arranged at the front end of the cutting laser beam to emit the laser beam.

In addition, light emitting diode (LED) sensors (such as light sensors), ultrasonic sensors or other types of sensors can be used as the non-contact displacement sensor.

In the focus adjustment process for positioning the cutting depth of the substrate before cutting, the non-metallic substrate cutting equipment according to the present invention is provided with a focus moving device 8, which is used to change the focus position of the laser beam along the depth direction of the substrate, thereby making the focus The position coincides with the depth of cut.

Here, in the substrate cutting process, in order to maintain the consistency of the cutting depth, the focus moving device 8 can also be used to change the height from the substrate to the laser head 6, so that it is the relative distance measured between the laser beam focus and the main substrate surface Corresponding.

And, the laser beam focus moving device 8 can include: a stepping motor (not shown in the figure), as a drive source; Ball screw (not shown in the figure), assembled on the stepping motor; not shown in ), connected to the ball screw to attach the laser head 6 to it.

Alternatively, the laser beam focus moving device 8 may include a linear motor and a propeller, and the propeller is assembled on the linear motor for moving up and down to connect the laser head 6 thereto.

Alternatively, the laser beam focus moving device 8 includes: a piezoelectric element mounted on the laser head 6 . When a predetermined voltage is applied to the piezoelectric element, the piezoelectric element can produce mechanical changes to move the position of the laser head 6 .

At the same time, the focus of the laser beam can be moved by optical adjustment instead of mechanical position adjustment. Therefore, a zoom lens 8a is provided in the laser head 6, which serves as a laser beam focus shifting means.

Therefore, it is different from controlling the focus position by changing the distance between the laser head and the substrate without changing the focal length. Without changing the distance between the laser head 6 and the substrate, the focal length can be changed by adjusting the distance between the lenses constituting the zoom lens 8a, thereby realizing the control of the cutting depth.

At the same time, preferably at least two laser heads 6 are provided to increase the cutting speed. Therefore, there is a method of using two laser oscillating devices to make laser beams respectively incident on laser heads. Also, another method is to use two laser heads with path turning devices (mirrors). At this time, the path turning means allows a laser beam from a laser oscillation means to be selectively incident on each laser head.

Alternatively, another cutting method is applicable in which laser light from a laser oscillation device is split by a beam splitter and applied to each of two laser heads. In this case, the energy of the separated laser light can be reduced. However, this method is still applicable if it can be guaranteed that the obtained energy is sufficient for cutting.

In the above-mentioned structure, through the relative movement of the laser head 6 and the application of ultraviolet (UV) short-wave laser beams, the substrate placed on the workbench 2 is cut, wherein the relative movement of the laser head 6 is controlled by motors, ball wires, etc. Drive devices such as bars and guide devices are completed. However, the configuration of the relative object moving device to cut the substrate by allowing relative movement of the substrate and the laser beam is not limited to the above-mentioned examples.

Alternatively, unlike the above structure, when the driving motor guides the worktable 2 to move in front, back and left and right directions, an ultraviolet (UV) short-wave laser beam is applied through the laser head to perform cutting work of the glass substrate. Optionally, both the substrate and the laser head 6 are moved, so that the cutting work can also be completed.

Simultaneously, laser beam generator 10 comprises the laser oscillator of Nd-YAG medium; Laser diode, in order to provide excitation light source to laser oscillator; And wavelength converter, in order to the wavelength conversion of the laser beam that laser oscillator produces wavelength.

The crystal used for wavelength conversion converts the long-wavelength laser beam emitted by the Nd-YAG medium into a short-wave ultraviolet (UV) with a wavelength of 200-400nm.

Meanwhile, the frequency of the laser beam is between 1 and 100KHz.

In particular, the frequency of the laser beam is at least 10 KHz, and preferably between 10 and 30 KHz. Of course, according to different situations, the frequency of the laser beam can be at least 30KHz, or higher.

For reference, YAG is equivalent to the synthesis of yttrium (Yttrium), aluminum (Aluminum) and garnet (Garnet), which are used to manufacture oscillators that generate laser beams. Neodymium (Nd: atomic number 60, atomic weight 144.2) may be doped into YAG to form Nd-YAG.

A cutting process of a glass substrate in a flat panel display using the substrate cutting apparatus of the above-described structure according to the present invention will be described below.

First of all, in the manufacture of flat-panel displays, such as: thin film transistor-liquid crystal display (TFT-LCD), plasma display (PDP), organic light-emitting display (OLED), etc., after the substrates are combined, the substrates are bonded (hereinafter referred to as bonding). plywood) cutting process.

The substrate includes a plurality of substrate units on a disk-shaped glass substrate, and it is necessary to cut the substrate into a plurality of substrate units.

Moreover, in order to control the display information of the substrate, a tape automatic bonding circuit board (Tape Automatic Bonding; TAB) is attached to a specific surface of the substrate. At this time, only one substrate of the bonded sheet (P) including a pair of substrates bonded together needs to be cut.

For this purpose, the glass substrate may be loaded onto the fixed table 2 from the outside by a carrier robot or the like.

The substrate placed on the workbench 2 is horizontally fixed on the workbench by support pins (not shown in the drawings) provided in the workbench 2 or a plurality of vacuum holes formed on the workbench 2, so as to It is firmly supported on the workbench.

Subsequently, the relative position between the substrate and the laser beam applied thereto is corrected so that the substrate fixed on the table 2 can be cut into a specific shape.

In the process of correcting the relative position, an image recognizer (such as a visual camera) is used to recognize the calibration mark formed on the substrate and confirm its position, and the laser head 6 that irradiates the laser beam is made relative to the worktable 2 to correct this relative position.

In the position confirmation process of the laser beam, a test laser beam is applied to the virtual glass to form a laser beam track on the virtual glass, and then the laser beam track is captured using an image recognizer, such as a visual camera, or using An image recognizer disposed below the laser head 6 recognizes the position of the laser head 6 emitting the laser beam.

At the same time, after the relative position correction between the substrate and the laser beam is completed, the substrate and the laser beam will move relatively to cut the substrate into a specific shape.

That is, a laser beam generated from a laser oscillator using Nd-YAG as a medium is supplied to the laser head 6 as a condensing member of the laser beam via the optical system 11 so that the laser beam is irradiated to a predetermined area on the substrate. location. Furthermore, the table 2 with the substrate thereon is fixed and cannot be moved, while the laser head 6 is movable. Therefore, the substrate can be cut by the movement of the laser beam.

In this case, the laser beam generated by the laser oscillator uses a laser diode as a light source. The generated laser beam can change its light path through the optical system 11, wherein the optical system includes a plurality of mirrors and similar devices, which are provided to the laser head 6 as laser beam condensing components. Since the laser head 6 and the mirror of the optical system 11 that transmits the laser beam to the laser head 6 are simultaneously moved horizontally, the UV short-wavelength laser beam can be applied to the substrate regardless of whether the position of the laser head 6 is changed. Therefore, the substrate can be cut into a designed shape.

In this case, the wavelength of light generated in a diode as a light source is supplied to the Nd-YAG medium to be excited through a gain medium, and thus, laser light with a wavelength of 1000 nm can be oscillated. The oscillated laser is oscillated into a short wave with a wavelength between 200 and 400nm by a wavelength conversion crystal.

Therefore, laser light is converted to short wavelength for use. When applying laser beams to cut non-metallic substances such as glass substrates, by using UV short-wavelength laser beams, the amount of product damage caused by heat changes caused by long-wavelength beams can be minimized.

In addition, in order to increase the energy of the laser beam, Q-switching (Q-switching) is optically performed using an optical resonator to generate an ultrashort pulse of 1 to 100 ns (nanosecond).

To increase cutting speed, frequencies in excess of several kilohertz (KHz) are generated to be applied to the laser beam. In this way, precise cutting can be achieved even if the laser head 6 or table 2 moves at a high speed.

At the same time, in the process of cutting the glass substrate, it basically cuts the substrate into substrate units along the front-to-back direction. The head 6 applies a laser beam so that the substrate can be cut in the front-rear direction.

Moreover, in the process of cutting the glass substrate, the substrate will be fully cut into substrate units along the left and right directions. When the guide of the column 3 moves in the left and right directions, a laser beam can be applied by the laser head 6 so that the substrate can be cut in the left and right directions.

Therefore, since the ultraviolet short-wavelength laser beam can alternately and repeatedly move forward and backward and left and right, each substrate unit on the glass substrate can be individually and completely separated from each other (in an individual form).

At the same time, in the process of cutting a glass substrate using an ultraviolet (UV) short-wavelength laser beam, the cutting depth of the substrate can be accurately set before the actual cutting work.

To this end, the focus position of the laser beam is controlled to coincide with the cutting depth of the substrate to be cut, as detailed below.

First, referring to FIGS. 2B and 3B , the focus position of the laser beam in the depth direction of the substrate is set to a certain value. Next, the distance between the laser head 6 emitting the laser beam and the main substrate surface is measured.

Therefore, based on the distance of the main substrate surface and the set focus position data, the actual focus position of the laser beam is moved so as to coincide with the set focus position.

Furthermore, the laser head 6 is raised or lowered to control the focus position of the laser beam, as shown in FIG. 2A and FIG. 2B . Alternatively, as shown in FIGS. 3A and 3B , the control of the focus position of the laser beam is performed by lifting or lowering the substrate.

That is, the cutting depth is determined by the control of the focus position of the laser beam, therefore, when the distance between the laser beam laser head 6 and the main substrate surface changes with the focal length (B1, B2, B3, where B1=B2=B3) When changing, the cutting depth (D1, D2, D3, wherein D1<D2<D3) is also changed.

Referring to FIG. 4A and FIG. 4B , by changing the focal length, the cutting depth can be controlled without adjusting the distance between the laser head 6 and the substrate.

In this case, the focus position of the laser beam is set along the depth direction of the substrate, and then the distance between the laser beam head 6 and the main substrate surface is measured.

Then, the focus position of the laser beam is moved to the set position according to the distance of the main substrate surface and the set focus position data. In this way, by adjusting the zoom lens 8a in the laser head 6, the focal length of the laser beam can be changed (such as B1, B2, B3 in FIG. 4A, where B1<B2<B3).

That is, by extending or shortening the focal length of the laser beam, the focus position can be controlled without changing the distance between the laser head 6 and the substrate.

At this time, the measurement of the distance between the laser head 6 and the main substrate surface of the laser beam can be realized by using the non-contact method of irradiation of the distance measuring laser beam, wherein the above-mentioned distance measuring laser beam and the ultraviolet short-wavelength laser beam used for cutting Or the ultrasound is different.

As described above, the non-metallic substrate cutting apparatus according to the present invention can perform precise non-metallic substrate cutting, thus selectively enabling asynchronous cutting (cutting only the upper substrate or lower substrate), or selectively cut the upper and lower substrates of the bonded sheet (P) simultaneously.

That is, in order to divide the bonded sheet (P) into substrate units by simultaneously cutting the upper and lower substrates of the bonded sheet (P), as shown in FIG. The bottoms of the substrates are aligned to correspond to the total thickness of the bonded sheet (P), and then the cutting of the substrates is performed.

In the asynchronous cutting of cutting the upper substrate or the lower substrate (such as the upper substrate) of the adhesive sheet (P), the focus of the laser beam is first coincident with the bottom of the upper substrate of the adhesive sheet (P) to correspond to the thickness of the upper substrate, Then, cutting of the substrate is performed, as shown in FIG. 5B .

The following description is performed optically to enhance Q-conversion of laser beam energy, and an optical resonator applied to Q-conversion.

First, in the standard oscillation mode, the gain of the laser medium corresponds to a value slightly exceeding the loss including the output emission component. Thus, by increasing the amount of reverse distribution beyond the threshold, a higher energy laser beam is obtained.

In particular, the loss of the optical resonator can be increased to increase the value of the reverse distribution beyond the oscillation limit. That is, the Q value is lowered.

Therefore, after the Q value is artificially lowered, if the reverse distribution value has a predetermined high value, the Q value is increased, and the gain coefficient becomes higher than the oscillation limit to generate oscillation of the high-energy laser beam. The above technique is called Q conversion.

Meanwhile, in optical resonators, parallel mirrors capable of activating beam resonance are used because high-efficiency laser beams with enhanced beams cannot be generated by inductive discharge.

If an induced discharge occurs while the reverse distribution continues, and if the beam is fed back into the laser medium part via a mirror, the beam is intensified. If the time for the light beam to reflect back and forth between a pair of mirrors is an integer multiple, a standing wave will be generated to suddenly increase the induced discharge. Also, this optical resonator has a structure capable of generating laser beams.

In industrial applications, when manufacturing display device modules such as thin film transistor-liquid crystal display (TFT-LCD), plasma display (PDP), organic light-emitting display (OLED), etc., in the glass cutting process, the present invention controls the short-wavelength laser beam The way of the focus position to precisely adjust the cutting depth.

Also, the present invention is applicable to any type of non-metallic substrate as well as glass substrates for flat panel displays. Therefore, the present invention has high industrial applicability.

Although the present invention has been described above with the foregoing preferred embodiments, since the present invention can be implemented in different forms without departing from the spirit or essential characteristics of the present invention, it should be understood that the above embodiments are not limited by any of the foregoing embodiments. limited to the details, unless expressly stated otherwise, but should be construed broadly within the spirit and scope of the appended claims, so changes and modifications made within the metes and bounds of the claims or such metes and bounds All equivalent replacements should be included within the scope of the claims of the present invention.

Explanation of main component symbols

1 Base 2 Workbench

3 left and right guide columns 4 front and rear guide columns

5 Linear Motor and Thruster 6 Laser Head

7 Laser head fixed block 8 Focus moving device

8a Zoom lens 9 Measuring device

10 Laser beam generator 11 Optical system

P Adhesive board

B1, B2, B3 laser beam focal length

D1, D2, D3 Cutting Depth

Claims (29)

1. device for cutting glass substrate includes:

Laser beam generator is in order to produce ultraviolet ray (UV) laser beam;

Laser head is in order to apply the specific location of laser beam to the non-metal base plate that will be cut;

The focus mobile device is in order to change the focal position of laser beam along the depth direction of substrate;

Object moving apparatus relatively moves in order to allow substrate and laser beam to produce, with cutting substrate relatively; And

Measurement mechanism is in order to measure the distance between described laser head and the described substrate.

2. device for cutting glass substrate according to claim 1, wherein said laser beam generator comprises:

Laser oscillator has the Nd-YAG medium;

Laser diode provides excitation source to described laser oscillator; And

Wavelength shifter converts the short wavelength in order to the wavelength of laser beam that described laser oscillator is produced.

3. device for cutting glass substrate according to claim 2, wherein, described wavelength shifter is a crystal.

4. device for cutting glass substrate according to claim 1, wherein, the wavelength of the laser beam that applies via described laser head is between 200～400nm.

5. according to claim 1 or 4 described device for cutting glass substrate, wherein, the frequency of described laser beam is between 1～100KHz.

6. device for cutting glass substrate according to claim 1 also comprises optical resonator, to change described laser beam into the ultrashort wave pulse by carry out the Q conversion on described laser beam, so that described laser beam has high energy.

7. device for cutting glass substrate according to claim 1, wherein, described laser beam foucing mobile device comprises:

Stepper motor is as drive source;

Ball-screw is connected on the described stepper motor; And

The ball-screw parts are connected on the described ball-screw, so that described laser head is connected on the described ball-screw.

8. device for cutting glass substrate according to claim 1, wherein, described laser beam foucing mobile device comprises:

Linear electric machine; And

Propeller is connected on the linear electric machine, and to rise, wherein said laser head is connected on the described propeller.

9. device for cutting glass substrate according to claim 1, wherein, described laser beam foucing mobile device comprises piezoelectric element, described piezoelectric element is connected on the described laser head, with compression according to predetermined voltage, and the position of passing through the described piezoelectric element of mechanical switch and then moving described laser head.

10. device for cutting glass substrate according to claim 1, wherein, described laser beam foucing mobile device comprises zoom lens, is positioned at described laser head.

11. device for cutting glass substrate according to claim 1, wherein, measurement mechanism comprises laser displacement sensor, is arranged at the front portion of described laser beam laser head, measures laser beam in order to transmitting range.

12. device for cutting glass substrate according to claim 1, wherein, described laser head comprises at least two laser heads that described laser beam focal length differs from one another.

13. a device for cutting glass substrate comprises:

Laser beam generator is in order to produce ultraviolet ray (UV) laser beam;

Laser head is to apply the specific location of laser beam to the non-metal base plate that will be cut;

Laser displacement sensor, in order to the distance between measurement laser head and the substrate, and the relative distance between substrate and the laser beam;

The focus mobile device, in order to changing the focal position of the laser beam on the substrate depth direction, and in order to change substrate to the height of laser head with corresponding, to keep the even of depth of cut in the cutting process with the relative distance of measuring; And

Object moving apparatus relatively moves in order to allow substrate and laser beam to produce, with cutting substrate relatively.

14. a non-metal base plate cutting method comprises the following steps:

Ultraviolet ray (UV) laser beam is provided;

Be set in the focal position of the laser beam on the substrate depth direction;

Measure the distance between laser beam laser head and the main real estate; And

Arrive the distance of main real estate and the focal position data of setting, the focal position of mobile laser beam according to laser beam.

15. non-metal base plate cutting method according to claim 14 wherein, is controlled the described focal position of described laser beam by moving described laser head.

16. non-metal base plate cutting method according to claim 14 wherein, is controlled the described focal position of described laser beam by moving described substrate.

17. non-metal base plate cutting method according to claim 14, wherein, the distance of measuring between described laser beam laser head and the described main real estate is to carry out by non-contact measurement.

18. a non-metal base plate cutting method comprises the following steps:

Ultraviolet ray (UV) laser beam is provided;

Provide zoom lens, to change the focal length of laser beam;

Be set in the focal position of the laser beam on the depth direction of substrate;

Measure the distance between laser beam laser head and the main real estate; And

To the distance of main real estate and the focal position data of setting, the focal position of mobile laser beam is to the focal position of setting according to laser beam.

19. non-metal base plate cutting method according to claim 18, wherein, the distance of measuring between described laser beam laser head and the described main real estate is to carry out by non-contact measurement.

20. non-metal base plate cutting method according to claim 19, wherein, the distance of measuring between laser beam laser head and the main real estate is carried out by irradiation distance measurement laser beam.

21. a non-metal base plate cutting method comprises the following steps:

Non-metal base plate is installed on workbench, and is fixed on the described workbench;

Ultraviolet ray (UV) short wavelength laser beam is provided;

To be set at particular value along the focal position of the laser beam on the substrate depth direction;

Measure the distance between laser beam laser head and the main real estate;

, move to the focal position of setting by actual focal position and to overlap to the distance of main real estate and the focal position data of setting according to laser beam, come the relative position of correction substrate and laser beam laser beam;

Apply the precalculated position of ultraviolet ray (UV) laser beam to the substrate via laser head; And

Relatively move substrate and laser beam are to become given shape with substrate cut.

22. non-metal base plate cutting method according to claim 21, wherein, the control to the focal position of laser beam is carried out in lifting by laser head or substrate or landing.

23. non-metal base plate cutting method according to claim 22 also is included in the cutting process of whole base plate, keeps the control of the focal position of laser beam.

24. non-metal base plate cutting method according to claim 21, wherein, laser beam is to be produced by the laser oscillator that utilizes ND-YAG as medium, to offer the laser head as the optically focused parts of laser beam via optical system.

25. non-metal base plate cutting method according to claim 24, wherein, check that in the following way laser beam applies the position, described mode is to apply the testing laser bundle to virtual glass and by utilizing the trajectory of the laser beam on the image recognition device identification virtual glass to obtain described position.

26. non-metal base plate cutting method according to claim 24, wherein, check that in the following way laser beam applies the position, described mode is to apply the testing laser bundle to a virtual glass and use the image recognition device identification be arranged on the laser head below to have the position of the laser head that puts on the laser beam on the virtual glass.

27. non-metal base plate cutting method according to claim 19, wherein, non-metal base plate is an adhesive plate, and described adhesive plate comprises upper plate and lower plate.

28. non-metal base plate cutting method according to claim 27, wherein, the depth of cut of control non-metal base plate is with the upper plate of execution cutting adhesive plate or one deck cutting of lower plate.

29. non-metal base plate cutting method according to claim 27, wherein, the depth of cut of control non-metal base plate is cut the upper plate of adhesive plate and the two-layer cutting of lower plate simultaneously to carry out.

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