KR100576194B1 - 대출력 펄스 rf 플라즈마를 이용한 매몰 절연막제조장치 및 제조방법 - Google Patents
대출력 펄스 rf 플라즈마를 이용한 매몰 절연막제조장치 및 제조방법 Download PDFInfo
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- KR100576194B1 KR100576194B1 KR1020040102291A KR20040102291A KR100576194B1 KR 100576194 B1 KR100576194 B1 KR 100576194B1 KR 1020040102291 A KR1020040102291 A KR 1020040102291A KR 20040102291 A KR20040102291 A KR 20040102291A KR 100576194 B1 KR100576194 B1 KR 100576194B1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/515—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using pulsed discharges
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
- C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76243—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology using silicon implanted buried insulating layers, e.g. oxide layers, i.e. SIMOX techniques
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- Computer Hardware Design (AREA)
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- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
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- Formation Of Insulating Films (AREA)
Abstract
Description
Claims (9)
- 진공조;상기 진공조 내에 시료를 지지하기 위한 지지대;음(-)의 고전압 펄스를 발생하여 상기 시료를 인가하기 위한 고전압 펄스 발생장치;상기 진공조 내에 주입된 가스로부터 펄스 플라즈마를 형성하기 위한 안테나;상기 안테나와 연결되어 RF(Radio Frequency) 펄스를 공급하기 위한 펄스 RF 전력장치; 그리고상기 고전압 펄스 발생장치와 상기 펄스 RF 전력장치의 사이에 연결설치되는 트리거 펄스 발생기로 이루어지는 것을 특징으로 하는 대출력 펄스 RF 플라즈마를 이용한 매몰 절연막 제조장치.
- 대출력 펄스 RF 플라즈마를 이용한 매몰 절연막 제조방법에 있어서,시료를 진공조 내에 위치시키는 단계;상기 진공조 내에 사용가스를 주입하는 단계;상기 진공조 내에 RF 펄스를 공급하여 상기 사용가스로부터 고밀도 플라즈마를 발생시키는 단계;발생된 플라즈마 이온이 시료에 충돌하여 시료표면에 이온을 주입시키기에 충분한 이온 에너지를 가지고 시료를 향해 가속되도록 시료에 음(-)의 고전압 펄스를 가하여 이온을 주입하는 단계;RF 펄스발생과 음(-)의 고전압 펄스발생을 동기화시키는 단계; 그리고절연막이 형성되도록 시료를 어닐링하는 단계를 포함하는 것을 특징으로 하는 대출력 펄스 RF 플라즈마를 이용한 매몰 절연막 제조방법.
- 제 2항에 있어서, 상기 RF 펄스는 펄스폭 10㎲~1000㎲, 펄스주파수 10㎐~10㎑, 최대 펄스전력 1㎾~100㎾인 것을 특징으로 하는 대출력 펄스 RF 플라즈마를 이용한 매몰 절연막 제조방법.
- 제 2항에 있어서, 음(-)의 고전압 펄스는 10㎸~100㎸, 펄스폭 10㎲~500㎲, 펄스주파수 10㎐~10㎑를 갖는 것을 특징으로 하는 대출력 펄스 RF 플라즈마를 이용한 매몰 절연막 제조방법.
- 제 2항에 있어서, 상기 이온을 주입하는 단계에서 시료의 온도를 550℃~650℃으로 유지하면서 1×1016/㎠~1×1018/㎠의 도즈로 이온주입하는 것을 특징으로 하는 대출력 펄스 RF 플라즈마를 이용한 매몰 절연막 제조방법.
- 제 2항에 있어서, 상기 어닐링하는 단계는 0.1%~5.0%의 산소가 첨가된 아르 곤 분위기에서 1200℃~1400℃의 온도에서 수행되는 것을 특징으로 하는 대출력 펄스 RF 플라즈마를 이용한 매몰 절연막 제조방법.
- 제 2항에 있어서, 상기 어닐링하는 단계 이전에 시료의 표면에 보호막을 형성하는 단계를 더 포함하는 것을 특징으로 대출력 펄스 RF 플라즈마를 이용한 매몰 절연막 제조방법.
- 제 7항에 있어서, 상기 보호막은 실리콘 산화막인 것을 특징으로 하는 대출력 펄스 RF 플라즈마를 이용한 매몰 절연막 제조방법.
- 제 7항에 있어서, 상기 보호막은 실리콘 질화막인 것을 특징으로 하는 대출력 펄스 RF 플라즈마를 이용한 매몰 절연막 제조방법.
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN113293357A (zh) * | 2021-05-25 | 2021-08-24 | 哈尔滨工业大学 | 一种脉冲复合射频增强空心阴极长管内壁沉积类金刚石涂层方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001044132A (ja) | 2000-01-01 | 2001-02-16 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
KR100351489B1 (ko) | 1994-07-25 | 2002-12-26 | 애질런트 테크놀로지스, 인크. | 반도체기판내에회로및매립절연층을형성하는방법 |
US6806171B1 (en) | 2001-08-24 | 2004-10-19 | Silicon Wafer Technologies, Inc. | Method of producing a thin layer of crystalline material |
JP2005072584A (ja) | 2003-08-20 | 2005-03-17 | Asm Japan Kk | 低誘電率及び低膜応力を有するシリコン系絶縁膜を形成する方法 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100351489B1 (ko) | 1994-07-25 | 2002-12-26 | 애질런트 테크놀로지스, 인크. | 반도체기판내에회로및매립절연층을형성하는방법 |
JP2001044132A (ja) | 2000-01-01 | 2001-02-16 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
US6806171B1 (en) | 2001-08-24 | 2004-10-19 | Silicon Wafer Technologies, Inc. | Method of producing a thin layer of crystalline material |
JP2005072584A (ja) | 2003-08-20 | 2005-03-17 | Asm Japan Kk | 低誘電率及び低膜応力を有するシリコン系絶縁膜を形成する方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113293357A (zh) * | 2021-05-25 | 2021-08-24 | 哈尔滨工业大学 | 一种脉冲复合射频增强空心阴极长管内壁沉积类金刚石涂层方法 |
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