KR100563172B1 - 감소된 수분 흡수성을 가지는 개선된 연마 패드 - Google Patents
감소된 수분 흡수성을 가지는 개선된 연마 패드 Download PDFInfo
- Publication number
- KR100563172B1 KR100563172B1 KR1020007013658A KR20007013658A KR100563172B1 KR 100563172 B1 KR100563172 B1 KR 100563172B1 KR 1020007013658 A KR1020007013658 A KR 1020007013658A KR 20007013658 A KR20007013658 A KR 20007013658A KR 100563172 B1 KR100563172 B1 KR 100563172B1
- Authority
- KR
- South Korea
- Prior art keywords
- pad
- polishing pad
- moisture resistant
- additive
- relatively
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/22—Rubbers synthetic or natural
- B24D3/26—Rubbers synthetic or natural for porous or cellular structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims (14)
- 소수성 중합체 매트릭스 물질 및 친수성 또는 비교적 극성인 중합체 첨가제를 포함하는, 양호한 슬러리 분포를 위해 패드 표면을 충분하게 습윤시키는 비교적 내수분성 연마 패드.
- 제1항에 있어서, 패드가 시트, 벨트, 디스크, 롤러 또는 다발 (bob)의 형태 또는 모양인 비교적 내수분성 연마 패드.
- 제1항에 있어서, 소수성 중합체 매트릭스 물질이 24 시간 적신 후에 4% 미만의 수분을 흡수하는 열가소성 또는 가교된 물질인 비교적 내수분성 연마 패드.
- 제1항에 있어서, 패드가 개방 또는 밀폐형 기포를 가지는 다공성인 비교적 내수분성 연마 패드.
- 제1항에 있어서, 텍스쳐된 비교적 내수분성 연마 패드.
- 제1항에 있어서, 친수성 첨가제가 친수성 계면활성제인 비교적 내수분성 연마 패드.
- 제1항에 있어서, 비교적 극성인 중합체 첨가제가 폴리우레탄, 폴리아미드 또는 폴리에스테르인 비교적 내수분성 연마 패드.
- 제1항에 있어서, 첨가제가 액체, 고체, 반고체 또는 고체와 액체의 조합인 비교적 내수분성 연마 패드.
- 제1항에 있어서, 첨가제가 패드 내의 다른 물질과 반응성인 비교적 내수분성 연마 패드.
- 제1항에 있어서, 첨가제가 중합체 매트릭스 내에 위치하는 비교적 내수분성 연마 패드.
- 제4항에 있어서, 첨가제가 패드의 기공 내에 위치하는 비교적 내수분성 연마 패드.
- 제1항에 있어서, 첨가제가 습윤도를 증가시키고 다공성을 형성하는 데 사용되는 친수성 중공 비즈인 비교적 내수분성 연마 패드.
- 삭제
- 제1항에 있어서, 첨가제가 패드 내의 다른 물질과 비반응성인 비교적 내수분성 연마 패드.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8774298P | 1998-06-02 | 1998-06-02 | |
US60/087,742 | 1998-06-02 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010071381A KR20010071381A (ko) | 2001-07-28 |
KR100563172B1 true KR100563172B1 (ko) | 2006-03-27 |
Family
ID=22206976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020007013658A Expired - Lifetime KR100563172B1 (ko) | 1998-06-02 | 1999-06-01 | 감소된 수분 흡수성을 가지는 개선된 연마 패드 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1091831A1 (ko) |
JP (1) | JP2002516764A (ko) |
KR (1) | KR100563172B1 (ko) |
AU (1) | AU4272499A (ko) |
TW (1) | TW449528B (ko) |
WO (1) | WO1999062673A1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101225436B1 (ko) | 2011-01-27 | 2013-01-22 | 삼성전자주식회사 | 연마 패드 및 그 제조방법 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6846225B2 (en) | 2000-11-29 | 2005-01-25 | Psiloquest, Inc. | Selective chemical-mechanical polishing properties of a cross-linked polymer and specific applications therefor |
US6579604B2 (en) | 2000-11-29 | 2003-06-17 | Psiloquest Inc. | Method of altering and preserving the surface properties of a polishing pad and specific applications therefor |
US7059946B1 (en) | 2000-11-29 | 2006-06-13 | Psiloquest Inc. | Compacted polishing pads for improved chemical mechanical polishing longevity |
US6596388B1 (en) | 2000-11-29 | 2003-07-22 | Psiloquest | Method of introducing organic and inorganic grafted compounds throughout a thermoplastic polishing pad using a supercritical fluid and applications therefor |
US6688956B1 (en) | 2000-11-29 | 2004-02-10 | Psiloquest Inc. | Substrate polishing device and method |
WO2002043922A1 (en) * | 2000-11-29 | 2002-06-06 | Psiloquest, Inc. | Crosslinked polyethylene polishing pad for chemical-mechnical polishing, polishing apparatus and polishing method |
US6575823B1 (en) | 2001-03-06 | 2003-06-10 | Psiloquest Inc. | Polishing pad and method for in situ delivery of chemical mechanical polishing slurry modifiers and applications thereof |
US6764574B1 (en) | 2001-03-06 | 2004-07-20 | Psiloquest | Polishing pad composition and method of use |
US6838169B2 (en) | 2002-09-11 | 2005-01-04 | Psiloquest, Inc. | Polishing pad resistant to delamination |
JP2008221367A (ja) * | 2007-03-09 | 2008-09-25 | Toyo Tire & Rubber Co Ltd | 研磨パッド |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR1158000A (fr) * | 1956-10-05 | 1958-06-05 | Impregnated Diamond Prod Ltd | Composition pour outils de coupe ou d'abrasion |
DE2556448A1 (de) * | 1975-12-15 | 1977-06-23 | Bosch Gmbh Robert | Polierkoerper zum polieren von gegenstaenden mit kristallinem gefuege |
GB1575867A (en) * | 1978-02-23 | 1980-10-01 | Brueckner Trockentechnik Kg | Article for preparation of critical surfaces |
US4728552A (en) * | 1984-07-06 | 1988-03-01 | Rodel, Inc. | Substrate containing fibers of predetermined orientation and process of making the same |
US4613345A (en) * | 1985-08-12 | 1986-09-23 | International Business Machines Corporation | Fixed abrasive polishing media |
JPS62156365A (ja) * | 1985-12-27 | 1987-07-11 | Kanebo Ltd | スエード様シート材からなる研磨布の製造方法 |
JPH0288229A (ja) * | 1988-09-26 | 1990-03-28 | Rodeele Nitta Kk | 積層体、並びに該積層体を用いた被研磨部材の保持材及び研磨布 |
JPH074769B2 (ja) * | 1991-10-11 | 1995-01-25 | ロデール・ニッタ株式会社 | 研磨用クロス |
MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
JP3354744B2 (ja) * | 1995-04-25 | 2002-12-09 | ニッタ株式会社 | 研磨布及びその研磨布の研磨機定盤への脱着方法 |
JPH09248756A (ja) * | 1996-03-08 | 1997-09-22 | Chiyoda Kk | 研磨布 |
JPH10550A (ja) * | 1996-06-11 | 1998-01-06 | Toshiba Mach Co Ltd | 研磨布ドレッシング方法およびその装置 |
JPH10146754A (ja) * | 1996-11-14 | 1998-06-02 | Hitachi Chem Co Ltd | 研磨用テンプレート材料 |
ES2187960T3 (es) * | 1997-04-18 | 2003-06-16 | Cabot Microelectronics Corp | Tampon para pulir para un sustrato semiconductor. |
-
1999
- 1999-06-01 EP EP99955238A patent/EP1091831A1/en not_active Withdrawn
- 1999-06-01 JP JP2000551920A patent/JP2002516764A/ja active Pending
- 1999-06-01 KR KR1020007013658A patent/KR100563172B1/ko not_active Expired - Lifetime
- 1999-06-01 AU AU42724/99A patent/AU4272499A/en not_active Abandoned
- 1999-06-01 WO PCT/GB1999/001515 patent/WO1999062673A1/en not_active Application Discontinuation
- 1999-06-02 TW TW088109099A patent/TW449528B/zh not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101225436B1 (ko) | 2011-01-27 | 2013-01-22 | 삼성전자주식회사 | 연마 패드 및 그 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
TW449528B (en) | 2001-08-11 |
KR20010071381A (ko) | 2001-07-28 |
WO1999062673A1 (en) | 1999-12-09 |
AU4272499A (en) | 1999-12-20 |
EP1091831A1 (en) | 2001-04-18 |
JP2002516764A (ja) | 2002-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6585574B1 (en) | Polishing pad with reduced moisture absorption | |
KR100563172B1 (ko) | 감소된 수분 흡수성을 가지는 개선된 연마 패드 | |
EP1011922B1 (en) | Polishing pad for a semiconductor substrate | |
US6117000A (en) | Polishing pad for a semiconductor substrate | |
US6126532A (en) | Polishing pads for a semiconductor substrate | |
US6688957B2 (en) | Substrate polishing article | |
KR100191227B1 (ko) | 중합체성 미소요소를 포함하는 연마패드,당행 패드와의 접촉에 의해 평면화된 반도체장치 및 연마 패드의 가공 표면의 재생방법 | |
JP3072526B2 (ja) | 研磨パッドおよびその使用方法 | |
EP2123400B1 (en) | Polishing pad and process for production of polishing pad | |
JP5538007B2 (ja) | 洗浄用スポンジ体及び洗浄方法 | |
US6685540B2 (en) | Polishing pad comprising particles with a solid core and polymeric shell | |
JP2008505734A (ja) | メラミン発泡体の層を含む洗浄用具 | |
US20100178853A1 (en) | Polishing pads for chemical mechanical planarization and/or other polishing methods | |
KR100789068B1 (ko) | 연마 패드 및 그의 제조방법 | |
US6607428B2 (en) | Material for use in carrier and polishing pads | |
EP1216118A1 (en) | Polishing pad treatment for surface conditioning | |
EP0010408B1 (en) | Method of preparing abrasive foam material | |
US20020132569A1 (en) | Substrate polishing apparatus | |
US20080057844A1 (en) | Discontinuous Abrasive Surfaces Having Controlled Wear Properties | |
US8303375B2 (en) | Polishing pads for chemical mechanical planarization and/or other polishing methods | |
TWI604001B (zh) | 研磨墊、研磨裝置及製造研磨墊之方法 | |
CN222405200U (zh) | 一种具有粘结结构的海绵砂纸 | |
RU21734U1 (ru) | Губка | |
JP2009241184A (ja) | 研磨パッドおよびそれを用いた研磨方法 | |
CN118123702A (zh) | 微层cmp抛光子垫 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0105 | International application |
Patent event date: 20001202 Patent event code: PA01051R01D Comment text: International Patent Application |
|
PG1501 | Laying open of application | ||
N231 | Notification of change of applicant | ||
PN2301 | Change of applicant |
Patent event date: 20010913 Comment text: Notification of Change of Applicant Patent event code: PN23011R01D |
|
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20040601 Comment text: Request for Examination of Application |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20051107 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20060227 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20060315 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20060316 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20090312 Start annual number: 4 End annual number: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20100308 Start annual number: 5 End annual number: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20110228 Start annual number: 6 End annual number: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20120228 Start annual number: 7 End annual number: 7 |
|
FPAY | Annual fee payment |
Payment date: 20130227 Year of fee payment: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20130227 Start annual number: 8 End annual number: 8 |
|
FPAY | Annual fee payment |
Payment date: 20140220 Year of fee payment: 9 |
|
PR1001 | Payment of annual fee |
Payment date: 20140220 Start annual number: 9 End annual number: 9 |
|
FPAY | Annual fee payment |
Payment date: 20150130 Year of fee payment: 10 |
|
PR1001 | Payment of annual fee |
Payment date: 20150130 Start annual number: 10 End annual number: 10 |
|
FPAY | Annual fee payment |
Payment date: 20160218 Year of fee payment: 11 |
|
PR1001 | Payment of annual fee |
Payment date: 20160218 Start annual number: 11 End annual number: 11 |
|
FPAY | Annual fee payment |
Payment date: 20170220 Year of fee payment: 12 |
|
PR1001 | Payment of annual fee |
Payment date: 20170220 Start annual number: 12 End annual number: 12 |
|
FPAY | Annual fee payment |
Payment date: 20180219 Year of fee payment: 13 |
|
PR1001 | Payment of annual fee |
Payment date: 20180219 Start annual number: 13 End annual number: 13 |
|
EXPY | Expiration of term | ||
PC1801 | Expiration of term |
Termination date: 20191201 Termination category: Expiration of duration |