KR100554698B1 - 마스크와 워크의 간격설정수단을 구비한 콘택트 노광장치 - Google Patents
마스크와 워크의 간격설정수단을 구비한 콘택트 노광장치 Download PDFInfo
- Publication number
- KR100554698B1 KR100554698B1 KR1020000063251A KR20000063251A KR100554698B1 KR 100554698 B1 KR100554698 B1 KR 100554698B1 KR 1020000063251 A KR1020000063251 A KR 1020000063251A KR 20000063251 A KR20000063251 A KR 20000063251A KR 100554698 B1 KR100554698 B1 KR 100554698B1
- Authority
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- South Korea
- Prior art keywords
- work
- mask
- stage
- workpiece
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 229920002120 photoresistant polymer Polymers 0.000 claims 1
- 230000007246 mechanism Effects 0.000 description 18
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 6
- 238000007789 sealing Methods 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 230000006837 decompression Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000881 depressing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0082—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the exposure method of radiation-sensitive masks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/085—Using vacuum or low pressure
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (1)
- 워크 스테이지상에 놓인, 표면에 감광막이 피착된 워크와, 마스크 스테이지에 놓인, 마스크 패턴이 형성된 마스크를 밀착시켜, 노광광을 포함하는 광을 마스크를 통해 워크상에 조사하여, 워크상에 마스크 패턴을 노광하는 콘택트 노광장치에서,상기 콘택트 노광장치는, 마스크와 워크 사이의 공간을 원하는 콘택트력을 얻을 수 있는 압력으로 감압했을 때, 마스크와 워크를 접촉하지 않는 미리 설정된 간격이 되도록 양자를 격리 대면시키는, 워크 스테이지의 주위에 설치된 링 모양의 백업 링을 구비하고,상기 백업 링은, 마스크 스테이지와 워크 스테이지의 사이에 설치되며, 워크 스테이지 또는 마스크 스테이지에 부착된 제1 부재와, 제1 부재에 대하여 나사에 의해 나사 결합하여 회전함으로써 높이 방향으로 이동가능한 제2 부재로 구성된 것을 특징으로 하는 마스크와 워크 간격설정수단을 구비한 것을 특징으로 하는 콘택트 노광장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP99-303600 | 1999-10-26 | ||
JP30360099A JP3678079B2 (ja) | 1999-10-26 | 1999-10-26 | マスクとワークの間隔設定手段を備えたコンタクト露光装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010040185A KR20010040185A (ko) | 2001-05-15 |
KR100554698B1 true KR100554698B1 (ko) | 2006-02-22 |
Family
ID=17922961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020000063251A Expired - Fee Related KR100554698B1 (ko) | 1999-10-26 | 2000-10-26 | 마스크와 워크의 간격설정수단을 구비한 콘택트 노광장치 |
Country Status (6)
Country | Link |
---|---|
US (1) | US6459474B1 (ko) |
EP (1) | EP1096320B1 (ko) |
JP (1) | JP3678079B2 (ko) |
KR (1) | KR100554698B1 (ko) |
DE (1) | DE60027665T2 (ko) |
TW (1) | TW477005B (ko) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003029414A (ja) * | 2001-07-19 | 2003-01-29 | Adtec Engineeng Co Ltd | 露光装置 |
DE20208285U1 (de) | 2002-05-27 | 2002-08-29 | Geburek, Frank, Dipl.-Ing. (TH), 31162 Bad Salzdetfurth | Belichtungsvorrichtung |
JP2004029063A (ja) * | 2002-06-21 | 2004-01-29 | Adtec Engineeng Co Ltd | 密着型露光装置 |
USD511366S1 (en) * | 2002-10-15 | 2005-11-08 | Brown James C | Blast/shrapnel containment disrupter cylinder for explosive ordinance disposal |
JP4158514B2 (ja) | 2002-12-24 | 2008-10-01 | ウシオ電機株式会社 | 両面投影露光装置 |
US20040145751A1 (en) * | 2003-01-28 | 2004-07-29 | Binnard Michael B. | Square wafer chuck with mirror |
JP2006200562A (ja) * | 2005-01-18 | 2006-08-03 | Nikon Corp | シール部材及びシール方法、テーブル及びステージ装置、並びに露光装置 |
US7239376B2 (en) * | 2005-07-27 | 2007-07-03 | International Business Machines Corporation | Method and apparatus for correcting gravitational sag in photomasks used in the production of electronic devices |
US20070035717A1 (en) * | 2005-08-12 | 2007-02-15 | Wei Wu | Contact lithography apparatus, system and method |
CN1955842B (zh) * | 2005-10-27 | 2010-06-16 | 中华映管股份有限公司 | 光刻设备 |
KR100793260B1 (ko) * | 2006-04-12 | 2008-01-10 | 오에프티 주식회사 | 노광 장치 및 이를 이용하여 마스크와 기판 사이의 간극을설정하는 방법 |
US7830498B2 (en) * | 2006-10-10 | 2010-11-09 | Hewlett-Packard Development Company, L.P. | Hydraulic-facilitated contact lithography apparatus, system and method |
US7768628B2 (en) * | 2006-10-12 | 2010-08-03 | Hewlett-Packard Development Company, L.P. | Contact lithography apparatus and method |
US20100103402A1 (en) * | 2007-02-26 | 2010-04-29 | Dai Nippon Printing Co., Ltd | Work stage of exposing apparatus, exposing method and method of manufacturing a structure |
CN101464620B (zh) * | 2008-12-17 | 2012-01-18 | 顾金昌 | 立体投影成像光栅压紧装置 |
DE102009025309B4 (de) * | 2009-06-15 | 2016-12-22 | Toptica Photonics Ag | Kinematischer Halter |
US8913230B2 (en) * | 2009-07-02 | 2014-12-16 | Canon Nanotechnologies, Inc. | Chucking system with recessed support feature |
JP5190034B2 (ja) * | 2009-07-03 | 2013-04-24 | 株式会社日立ハイテクノロジーズ | 露光装置 |
TW201133703A (en) * | 2010-03-19 | 2011-10-01 | Els System Technology Co Ltd | Carrying apparatus and exposure machine having the same |
JP2013538447A (ja) | 2010-08-05 | 2013-10-10 | エーエスエムエル ネザーランズ ビー.ブイ. | インプリントリソグラフィ |
DE102010053332A1 (de) * | 2010-12-03 | 2012-06-06 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung und Verfahren zum Handhaben von Werkstücken |
JP6142450B2 (ja) * | 2011-09-09 | 2017-06-07 | 株式会社ブイ・テクノロジー | 密着露光装置及び密着露光方法 |
DE102017105374A1 (de) * | 2017-03-14 | 2018-09-20 | Aixtron Se | Vorrichtung zum Abscheiden einer strukturierten Schicht auf einem Substrat sowie Verfahren zum Einrichten der Vorrichtung |
DE102017105379A1 (de) | 2017-03-14 | 2018-09-20 | Aixtron Se | Substrathalteranordnung mit Maskenträger |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3192844A (en) * | 1963-03-05 | 1965-07-06 | Kulicke And Soffa Mfg Company | Mask alignment fixture |
GB1406406A (en) | 1973-01-17 | 1975-09-17 | Elektromat Veb | Apparatus for adjusting the distance between two planes |
US4431304A (en) * | 1981-11-25 | 1984-02-14 | Mayer Herbert E | Apparatus for the projection copying of mask patterns on a workpiece |
JPS58173727A (ja) * | 1982-04-05 | 1983-10-12 | Canon Inc | 密着焼付けにおける密着方法 |
JP2601834B2 (ja) | 1987-08-26 | 1997-04-16 | 株式会社東芝 | テーブル装置 |
JP2705312B2 (ja) | 1990-12-06 | 1998-01-28 | ソニー株式会社 | 投影露光方法 |
KR100208739B1 (ko) | 1993-07-08 | 1999-07-15 | 다나카 아키히로 | 작업편과 마스크의 간극설정방법 및 간극설정기구 |
DE69500707T2 (de) * | 1994-02-07 | 1998-02-12 | Ushiodenki K.K., Tokio/Tokyo | Haltevorrichtung |
JPH11312635A (ja) * | 1998-04-28 | 1999-11-09 | Ushio Inc | コンタクト露光方法 |
-
1999
- 1999-10-26 JP JP30360099A patent/JP3678079B2/ja not_active Expired - Lifetime
-
2000
- 2000-09-05 TW TW089118171A patent/TW477005B/zh not_active IP Right Cessation
- 2000-10-23 EP EP00123013A patent/EP1096320B1/en not_active Expired - Lifetime
- 2000-10-23 US US09/694,030 patent/US6459474B1/en not_active Expired - Lifetime
- 2000-10-23 DE DE60027665T patent/DE60027665T2/de not_active Expired - Lifetime
- 2000-10-26 KR KR1020000063251A patent/KR100554698B1/ko not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1096320B1 (en) | 2006-05-03 |
TW477005B (en) | 2002-02-21 |
US6459474B1 (en) | 2002-10-01 |
DE60027665T2 (de) | 2007-04-05 |
JP3678079B2 (ja) | 2005-08-03 |
KR20010040185A (ko) | 2001-05-15 |
EP1096320A3 (en) | 2002-06-12 |
EP1096320A2 (en) | 2001-05-02 |
DE60027665D1 (de) | 2006-06-08 |
JP2001125275A (ja) | 2001-05-11 |
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