KR100542869B1 - 포토인터럽터 - Google Patents
포토인터럽터 Download PDFInfo
- Publication number
- KR100542869B1 KR100542869B1 KR1019980704625A KR19980704625A KR100542869B1 KR 100542869 B1 KR100542869 B1 KR 100542869B1 KR 1019980704625 A KR1019980704625 A KR 1019980704625A KR 19980704625 A KR19980704625 A KR 19980704625A KR 100542869 B1 KR100542869 B1 KR 100542869B1
- Authority
- KR
- South Korea
- Prior art keywords
- lead
- substrate
- hole
- photointerrupter
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims abstract description 56
- 238000005452 bending Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 4
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 230000002401 inhibitory effect Effects 0.000 abstract 1
- 238000005476 soldering Methods 0.000 description 12
- 238000000465 moulding Methods 0.000 description 6
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 230000000630 rising effect Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/20—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers
- H10F55/25—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the electric light source controls the radiation-sensitive semiconductor devices, e.g. optocouplers wherein the radiation-sensitive devices and the electric light source are all semiconductor devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
- H10F55/18—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto wherein the radiation-sensitive semiconductor devices and the electric light source share a common body having dual-functionality of light emission and light detection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/93—Interconnections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10757—Bent leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/10878—Means for retention of a lead in a hole
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
Claims (5)
- 리드를 갖는 발광소자와, 리드를 갖는 수광소자와, 상기 발광소자 및 수광소자가 공간부를 거쳐서 광을 수수할 수 있도록 대향시키고 상기 리드를 저면으로부터 뻗어나오게 해서 고정하는 패키지로 이루어지며, 상기 패키지의 저면으로부터 뻗어나오는 상기 리드의 저면으로부터 상기 리드가 관통구멍에 삽입되어 고착되는 기판의 두께보다도 작은 치수의 위치에 제1의 굴곡점을 가지고,상기 패키지의 저면으로부터 상기 기판의 두께보다 큰 치수의 위치에서, 또한, 상기 기판의 관통구멍의 내직경보다 외측의 위치에 제2의 굴곡점을 갖는 축방향의 이동 억제용 굴곡부가 형성되어 이루어지는 포토인터럽터.
- 제 1 항에 있어서,상기 제1의 굴곡점이 상기 발광소자 및 수광소자로부터 뻗어나오는 리드의 중심축의 근방에 형성되고, 상기 제2의 굴곡점이 상기 중심축으로부터 상기 기판의 관통구멍의 반경보다 큰 위치에 형성된 것을 특징으로 하는 포토인터럽터.
- 제 1 항에 있어서,상기 제1의 굴곡점은 상기 리드가 상기 기판의 관통구멍에 삽입될 때에 이 관통구멍의 내벽에 접촉하는 위치에 형성되고, 상기 제2의 굴곡점은 상기 리드가 상기 기판의 관통구멍에 삽입되었을 때에 이 관통구멍의 내벽보다 바깥쪽의 위치에 형성되는 것을 특징으로 하는 포토인터럽터.
- 제 1 항에 있어서,상기 패키지의 저면에 상기 기판에 형성되는 끼워맞추는 구멍과 끼워 맞추어질 수 있는 돌기부가 설치된 것을 특징으로 하는 포토인터럽터.
- 제 4 항에 있어서,상기 돌기부가 상기 패키지의 저면의 중심점에 관해서 비대칭의 위치에 2개 이상 설치된 것을 특징으로 하는 포토인터럽터.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27920096 | 1996-10-22 | ||
JP96-279200 | 1996-10-22 | ||
PCT/JP1997/003834 WO1998018168A1 (en) | 1996-10-22 | 1997-10-22 | Photointerruptor |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990072227A KR19990072227A (ko) | 1999-09-27 |
KR100542869B1 true KR100542869B1 (ko) | 2006-05-23 |
Family
ID=17607836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980704625A Expired - Fee Related KR100542869B1 (ko) | 1996-10-22 | 1997-10-22 | 포토인터럽터 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6097084A (ko) |
JP (1) | JP3367078B2 (ko) |
KR (1) | KR100542869B1 (ko) |
TW (1) | TW353236B (ko) |
WO (1) | WO1998018168A1 (ko) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000012892A (ja) * | 1998-06-17 | 2000-01-14 | Shichizun Denshi:Kk | フォトインタラプタ |
JP4534398B2 (ja) * | 2001-08-08 | 2010-09-01 | パナソニック株式会社 | ヒューズ保持具 |
US7416701B2 (en) * | 2001-09-12 | 2008-08-26 | Ecolab Inc. | Calibrator for fluorosensor |
KR100474389B1 (ko) * | 2001-12-29 | 2005-03-08 | 한국 고덴시 주식회사 | 포토 인터럽트의 제작공법 |
TWD112587S1 (zh) * | 2005-03-22 | 2006-08-21 | 羅姆電子股份有限公司 | 光電開關 |
TWD112589S1 (zh) * | 2005-03-22 | 2006-08-21 | 羅姆電子股份有限公司 | 光電開關 |
TWD112588S1 (zh) * | 2005-03-22 | 2006-08-21 | 羅姆電子股份有限公司 | 光電開關 |
US7550746B2 (en) | 2006-06-01 | 2009-06-23 | Ecolab Inc. | UV fluorometric sensor and method for using the same |
JP2009130022A (ja) | 2007-11-21 | 2009-06-11 | Toshiba Corp | インタラプタ |
US8946875B2 (en) * | 2012-01-20 | 2015-02-03 | Intersil Americas LLC | Packaged semiconductor devices including pre-molded lead-frame structures, and related methods and systems |
JP6094361B2 (ja) * | 2013-04-24 | 2017-03-15 | オムロン株式会社 | フォトセンサ |
JP6380244B2 (ja) * | 2015-06-15 | 2018-08-29 | 三菱電機株式会社 | 半導体装置、電力変換装置 |
JP6488056B1 (ja) * | 2018-07-31 | 2019-03-20 | メトラス株式会社 | 光照射装置及び光照射装置の製造方法 |
JP7271270B2 (ja) * | 2019-04-04 | 2023-05-11 | ローム株式会社 | フォトインタラプタ及び電子部品 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5839087U (ja) * | 1981-09-07 | 1983-03-14 | パイオニア株式会社 | 電子部品 |
JPS6181169U (ko) * | 1984-11-01 | 1986-05-29 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5242256A (en) * | 1975-10-01 | 1977-04-01 | Murata Manufacturing Co | Method of mounting electronic parts to substrate |
JPS5918683A (ja) * | 1982-07-22 | 1984-01-31 | Toshiba Corp | フオトインタラプタ |
JPS61186293U (ko) * | 1985-05-10 | 1986-11-20 | ||
JPS6278887A (ja) * | 1985-10-01 | 1987-04-11 | Sharp Corp | ホトインタラプタ |
JPH0638514B2 (ja) * | 1985-11-21 | 1994-05-18 | 日本電気株式会社 | フオトインタラプタ |
JPS62170872A (ja) * | 1986-01-23 | 1987-07-27 | Nec Corp | ホトインタラプタ |
JPS62251616A (ja) * | 1986-04-24 | 1987-11-02 | Sharp Corp | ホトインタラプタ |
JPH062301Y2 (ja) * | 1986-09-19 | 1994-01-19 | シャープ株式会社 | 部品取付装置 |
JPS6420479A (en) * | 1987-07-14 | 1989-01-24 | Nec Corp | Photosensor |
JP2778054B2 (ja) * | 1988-10-27 | 1998-07-23 | 日本電気株式会社 | 樹脂封止型フォトインタラプタ |
JPH0397947U (ko) * | 1990-01-25 | 1991-10-09 | ||
JPH0749815Y2 (ja) * | 1990-07-23 | 1995-11-13 | シャープ株式会社 | 表面実装型光結合装置 |
JP2693345B2 (ja) * | 1991-11-20 | 1997-12-24 | ローム株式会社 | ホトインタラプタにおけるモールド部の成形方法及びその装置 |
US5391346A (en) * | 1991-11-20 | 1995-02-21 | Rohm Co., Ltd. | Method for making molded photointerrupters |
JP3001750B2 (ja) * | 1992-09-09 | 2000-01-24 | シャープ株式会社 | プラグ・ジャック式光電共用伝送装置 |
JP2834984B2 (ja) * | 1993-09-20 | 1998-12-14 | ローム株式会社 | ホトインタラプタの製造方法 |
JPH07106627A (ja) * | 1993-09-29 | 1995-04-21 | Toshiba Corp | 半導体光結合装置 |
-
1997
- 1997-10-22 KR KR1019980704625A patent/KR100542869B1/ko not_active Expired - Fee Related
- 1997-10-22 JP JP51923198A patent/JP3367078B2/ja not_active Expired - Lifetime
- 1997-10-22 US US09/077,893 patent/US6097084A/en not_active Expired - Lifetime
- 1997-10-22 TW TW086115739A patent/TW353236B/zh not_active IP Right Cessation
- 1997-10-22 WO PCT/JP1997/003834 patent/WO1998018168A1/ja not_active Application Discontinuation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5839087U (ja) * | 1981-09-07 | 1983-03-14 | パイオニア株式会社 | 電子部品 |
JPS6181169U (ko) * | 1984-11-01 | 1986-05-29 |
Also Published As
Publication number | Publication date |
---|---|
JP3367078B2 (ja) | 2003-01-14 |
US6097084A (en) | 2000-08-01 |
KR19990072227A (ko) | 1999-09-27 |
TW353236B (en) | 1999-02-21 |
WO1998018168A1 (en) | 1998-04-30 |
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