KR100495210B1 - 내환원성 저온소성 유전체 자기조성물, 이를 이용한적층세라믹 커패시터 및 그 제조방법 - Google Patents
내환원성 저온소성 유전체 자기조성물, 이를 이용한적층세라믹 커패시터 및 그 제조방법 Download PDFInfo
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- KR100495210B1 KR100495210B1 KR10-2002-0072852A KR20020072852A KR100495210B1 KR 100495210 B1 KR100495210 B1 KR 100495210B1 KR 20020072852 A KR20020072852 A KR 20020072852A KR 100495210 B1 KR100495210 B1 KR 100495210B1
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- multilayer ceramic
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- 239000000203 mixture Substances 0.000 title claims abstract description 45
- 239000000919 ceramic Substances 0.000 title claims description 22
- 238000000034 method Methods 0.000 title claims description 13
- 239000003990 capacitor Substances 0.000 title description 11
- 238000010304 firing Methods 0.000 claims abstract description 30
- 239000003985 ceramic capacitor Substances 0.000 claims abstract description 25
- 239000000843 powder Substances 0.000 claims abstract description 13
- 238000001354 calcination Methods 0.000 claims abstract description 10
- 239000003989 dielectric material Substances 0.000 claims abstract description 10
- 230000009467 reduction Effects 0.000 claims abstract description 5
- 238000002156 mixing Methods 0.000 claims abstract description 4
- 238000010030 laminating Methods 0.000 claims abstract description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 5
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 238000005245 sintering Methods 0.000 description 10
- 230000008859 change Effects 0.000 description 7
- 239000002002 slurry Substances 0.000 description 7
- 239000011230 binding agent Substances 0.000 description 6
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 230000032798 delamination Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002003 electrode paste Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- 238000005054 agglomeration Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910020599 Co 3 O 4 Inorganic materials 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052689 Holmium Inorganic materials 0.000 description 1
- 229910021193 La 2 O 3 Inorganic materials 0.000 description 1
- -1 MgO-Y Inorganic materials 0.000 description 1
- 229910017493 Nd 2 O 3 Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 229910020816 Sn Pb Inorganic materials 0.000 description 1
- 229910020922 Sn-Pb Inorganic materials 0.000 description 1
- 229910008783 Sn—Pb Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
- H01G4/1209—Ceramic dielectrics characterised by the ceramic dielectric material
- H01G4/1218—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates
- H01G4/1227—Ceramic dielectrics characterised by the ceramic dielectric material based on titanium oxides or titanates based on alkaline earth titanates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Capacitors (AREA)
Abstract
Description
Claims (13)
- BaTiO3와,상기 BaTiO3 100몰에 대해,MgCO3:0.2∼3.0몰,Y2O3, Ho2O3, Dy2O3, Yb2O3의 그룹에서 선택된 1종 또는 2종이상의 총합:0.05∼1.5몰,Cr2O3:0.1∼1.5몰,BaxCa(1-x)SiO3(단, 0 ≤x≤ 1):0.2∼3.0몰,Mn2V2O7:0.01∼1.5몰을 포함하여 이루어지는 내환원성 저온소성 유전체 자기조성물.
- 제 1항에 있어서, 상기 BaxCa(1-x)SiO3는 0.2∼1.4몰임을 특징으로 하는 내환원성 저온소성 유전체 자기조성물.
- 제 1항에 있어서, 상기 BaxCa(1-x)SiO3에서 X는 0.3∼0.6임을 특징으로 하는 내환원성 저온소성 유전체 자기조성물.
- 제 1항에 있어서, 상기 Mn2V2O7는 0.01~1.0몰임을 특징으로 하는 내환원성 저온소성 유전체 자기조성물.
- 제 1항 내지 제 4항중의 어느 한 항에 있어서, 상기 BaxCa(1-x)SiO3와 상기 Mn2V2O7는 총합이 1~1.6몰임을 특징으로 하는 내환원성 저온소성 유전체 자기조성물.
- 청구항 1의 유전체 자기조성물로 이루어진 유전체와 내부전극이 교대로 적층되어 이루어지는 적층세라믹 커패시터.
- 제 6항에 있어서, 상기 내부전극은 Ni 또는 Ni합금에서 선택된 것임을 특징으로 하는 적층세라믹 커패시터.
- MnO와 V2O5를 650~800℃ 에서 하소하여 Mn2V2O7분말을 얻는 단계와,BaTiO3와상기 BaTiO3 100몰에 대해MgCO3:0.2∼3.0몰,Y2O3, Ho2O3, Dy2O3, Yb2O3의 그룹에서 선택된 1종 또는 2종이상의 총합:0.05∼1.5몰,Cr2O3:0.1∼1.5몰,BaxCa(1-x)SiO3(단, 0≤ x ≤1):0.2∼3.0몰과,상기에서 얻은 Mn2V2O7를 0.01∼1.5몰 혼합한 유전재료를 얻는 단계 및,상기 유전재료와 내부전극을 교대로 적층한 후 소성하는 단계를 포함하여 이루어지는 적층세라믹 커패시터의 제조방법.
- 제 8항에 있어서, 상기 BaxCa(1-x)SiO3는 0.2∼1.4몰임을 특징으로 하는 적층세라믹 커패시터의 제조방법.
- 제 8항에 있어서, 상기 Mn2V2O7는 0.01~1.0몰임을 특징으로 하는 적층세라믹 커패시터의 제조방법.
- 제 8항에 있어서, 상기 BaxCa(1-x)SiO3와 상기 Mn2V2O 7는 총합이 1~1.6몰임을 특징으로 하는 적층세라믹 커패시터의 제조방법.
- 제 8항에 있어서, 상기 하소는 650~680℃ 에서 행하는 것을 특징으로 하는 적층세라믹 커패시터의 제조방법.
- 제 8항에 있어서, 상기 소성은 1200~1250℃ 에서 행하는 것을 특징으로 하는 적층세라믹 커패시터의 제조방법.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/322,634 US6777363B2 (en) | 2002-07-05 | 2002-12-19 | Non-reducable, low temperature dielectric ceramic composition, capacitor and method of preparing |
JP2002369542A JP3746763B2 (ja) | 2002-07-05 | 2002-12-20 | 耐還元性低温焼成誘電体磁器組成物、これを用いた積層セラミックキャパシター及びその製造方法 |
CN02157839.7A CN1224056C (zh) | 2002-07-05 | 2002-12-20 | 介电陶瓷组合物、使用该组合物的多层陶瓷片状电容器及该电容器的制备方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020020038795 | 2002-07-05 | ||
KR20020038795 | 2002-07-05 |
Publications (2)
Publication Number | Publication Date |
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KR20040004756A KR20040004756A (ko) | 2004-01-14 |
KR100495210B1 true KR100495210B1 (ko) | 2005-06-14 |
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KR10-2002-0072852A Expired - Fee Related KR100495210B1 (ko) | 2002-07-05 | 2002-11-21 | 내환원성 저온소성 유전체 자기조성물, 이를 이용한적층세라믹 커패시터 및 그 제조방법 |
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Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0489353A (ja) * | 1990-07-31 | 1992-03-23 | Kyocera Corp | 誘電体磁器組成物 |
JPH08180733A (ja) * | 1994-12-26 | 1996-07-12 | Kyocera Corp | 誘電体磁器組成物 |
US5571767A (en) * | 1995-08-21 | 1996-11-05 | Ferro Corporation | Low fire X7R dielectric compositions and capacitors made therefrom |
KR19980041667A (ko) * | 1996-01-18 | 1998-08-17 | 가부시끼가이샤무라따세이사꾸쇼 | 유전체 세라믹 조성물 및 이를 이용한 적층형 세라믹 커패시터 |
JP2000103671A (ja) * | 1998-09-30 | 2000-04-11 | Kyocera Corp | 誘電体磁器組成物 |
JP2001345230A (ja) * | 2000-03-31 | 2001-12-14 | Tdk Corp | 積層型セラミックチップコンデンサとその製造方法 |
US6673274B2 (en) * | 2001-04-11 | 2004-01-06 | Cabot Corporation | Dielectric compositions and methods to form the same |
-
2002
- 2002-11-21 KR KR10-2002-0072852A patent/KR100495210B1/ko not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0489353A (ja) * | 1990-07-31 | 1992-03-23 | Kyocera Corp | 誘電体磁器組成物 |
JPH08180733A (ja) * | 1994-12-26 | 1996-07-12 | Kyocera Corp | 誘電体磁器組成物 |
US5571767A (en) * | 1995-08-21 | 1996-11-05 | Ferro Corporation | Low fire X7R dielectric compositions and capacitors made therefrom |
KR19980041667A (ko) * | 1996-01-18 | 1998-08-17 | 가부시끼가이샤무라따세이사꾸쇼 | 유전체 세라믹 조성물 및 이를 이용한 적층형 세라믹 커패시터 |
JP2000103671A (ja) * | 1998-09-30 | 2000-04-11 | Kyocera Corp | 誘電体磁器組成物 |
JP2001345230A (ja) * | 2000-03-31 | 2001-12-14 | Tdk Corp | 積層型セラミックチップコンデンサとその製造方法 |
US6673274B2 (en) * | 2001-04-11 | 2004-01-06 | Cabot Corporation | Dielectric compositions and methods to form the same |
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KR20040004756A (ko) | 2004-01-14 |
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