KR100451698B1 - 다층 수동전자부품의 제작방법 - Google Patents
다층 수동전자부품의 제작방법 Download PDFInfo
- Publication number
- KR100451698B1 KR100451698B1 KR10-2000-7001155A KR20007001155A KR100451698B1 KR 100451698 B1 KR100451698 B1 KR 100451698B1 KR 20007001155 A KR20007001155 A KR 20007001155A KR 100451698 B1 KR100451698 B1 KR 100451698B1
- Authority
- KR
- South Korea
- Prior art keywords
- foil
- thin
- support block
- support
- centering
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1067—Continuous longitudinal slitting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/108—Flash, trim or excess removal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1084—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing of continuous or running length bonded web
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/12—Surface bonding means and/or assembly means with cutting, punching, piercing, severing or tearing
- Y10T156/1348—Work traversing type
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Details Of Cutting Devices (AREA)
- Laminated Bodies (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Nonmetal Cutting Devices (AREA)
- Ceramic Capacitors (AREA)
- Packages (AREA)
Abstract
Description
Claims (7)
- 적층체를 형성하기 위해 두루말이형 얇은 포일을 하나의 롤(roll)로부터 지지블럭위에 간단히 정렬할 수 있게 해주는, 다층 수동전자부품을 정렬하고 얇은 포일을 커팅하는 방법에 있어서,얇은 포일(63)이 입혀진 유연성 지지 포일을 풀림장치(unrolling mechanism)(67)에서 푼 후, 크로스 나이프(66)와 2개의 측면 나이프(68)를 거쳐서 압착장치(pressing tool)(65)를 통과시키고 분리 크로스바(cross bar)(610)와 당김장치(pulling mechanism)(612)를 거쳐 권회장치(rolling mechanism)에 의해 얇은 포일을 분리시킨 상태로 상기 지지포일을 권회하고, 압착 장치(65) 밑에 지지블록(57)을 두는 단계와;층들(layers)을 정밀하게 배치하기 위해 지지블록들을 센터링하는(centering) 단계와;상기 얇은 포일을 길이방향으로 절단하는 단계와;상기 얇은 포일을 가로방향으로 절단하는 단계를 포함하여 구성되는,다층 수동전자부품을 정렬하고 얇은 포일을 커팅하는 방법.
- 제1항에 있어서, 상기 지지블록들을 센터링하는 단계가, 지지블럭(57)이 각 제조장치위의 고정판체(56)위에 놓여지고; 하나의 제지구(limitation element)(55)에 의해 이동거리의 제한을 받으며, 해당 센터링 홈(b)안에 자리잡을 때까지 지지블럭(57)쪽으로 이동하는 위치지정볼트(51)의 이동이 완료된 때, 위치지정볼트(52)가 지지블럭(57)쪽으로 움직이기 시작하고, 두 위치지정볼트(51, 52)가 모두 해당 센터링 홈(b)에 자리잡을 때 중앙이 맞춰져서 위치지정되도록 각각 해당 안내구(53, 54)내에 안내되어 2개의 센터링볼트(51,52)에 의해 위치지정되고 고정되며; 진공에 의해 고정판체(56)에 지지블럭(57)을 고정할 수 있도록 고정판체(56)를 관통하여 형성된 적어도 하나의 수직흡입홀(58)에 의한 흡입법(suction)에 의해 지지블럭(57)이 고정판체(56)에 고정되는 방식으로 실행되는 것을 특징으로 하는, 다층 수동전자부품을 정렬하고 얇은 포일을 커팅하는 방법.
- 제2항에 있어서, 상기 지지블럭들을 센터링하는 단계가, 지지블럭(57)보다 큰 칫수를 갖는 경우 수직흡입홀(58)의 수가 지지블럭(57)의 칫수에 따라 하나이상 고정판(56)을 통해 형성되는 방식으로 실행되는 것을 특징으로 하는, 다층 수동전자부품을 정렬하고 얇은 포일을 커팅하는 방법.
- 제1항에 있어서, 상기 얇은 포일을 길이방향으로 절단하는 단계가,얇은 포일(92)이 입혀진 유연성 지지포일(91)이 롤러(99)에 감겨져서, 긴장추(straining weight)(98)밑을 통과하여 회전 측면 나이프(68)위를 거쳐 당김장치(112)로 이동되며, 상기 당김장치(612)가 지지포일과 그에 붙어 있는 얇은 포일을 모두 화살표(Y)방향으로 당기며, 회전 절단 나이프(68)가 그 날카로운 날로 얇은 포일과 접촉하며, 하우징(7)내에 위치한 푸시 바아(94)에 의해 만들어진 힘에 의해 얇은 포일(92)을 길이방향으로 절단하는 방식으로 실행되는 것을 특징으로 하는, 다층 수동전자부품을 정렬하고 얇은 포일을 커팅하는 방법.
- 제1항에 있어서, 상기 얇은 포일을 가로방향으로 절단하는 단계가, 밑면에 얇은 포일(92)이 입혀진 유연성 지지포일(91)이, 하우징에 고정된 크로스 나이프(66)위에 신장되고, 얇은 포일(92)과 크로스 나이프(66)사이에 거리(X)가 유지되어 포일이 방해를 받지 않고 이동할 수 있게 하며, 포일이 움직이지 않을 때는, 크로스-푸시 바아(105)가 하강하여, 포일을 굽혀줌으로써 크로스 나이프(66)의 절단날쪽으로 압착시키며, 크로스 나이프(66)가 얇은 포일(92)을 파고 들면서 절단하며, 이 때 지지포일(91)은 절단되지 않은 상태로 남는 방식으로 실행되는 것을 특징으로 하는, 다층 수동전자부품을 정렬하고 얇은 포일을 커팅하는 방법.
- 4각형상의 금속판체이고, 적층체의 칫수와 같거나 더 큰 칫수를 가지며, 서로 반대편에 위치하며 그 바닥부분(top)은 둥글게 할 수도 있는 2개의 쐐기형 센터링 홈(centering grooves)을 가지는데, 상기 홈의 각도(c)는 15°와 120°사이로서, 센터링 볼트가 대응 센터링 홈(b)에 신뢰성있게 조절되도록 해주며, 상기 2개의 홈(b)은 상기 2개의 센터링 볼트에 의해 지지블럭(a)이 센터링할 수 있게 하는 것을 특징으로 하는, 제2항 또는 제3항의 방법에서 사용되는 지지블럭(a).
- 제6항에 있어서, 상기 지지블럭(a)의 두께(d)가 얇으면 센터링 홈이 지지블럭(a)의 전체 두께(d)에 걸쳐 만들어지며, 상기 지지블럭(a)의 두께가 두꺼운 경우에는, 센터링 홈(b)이 지지블럭(a)의 한쪽 면에만 형성되는 것을 특징으로 하는, 제2항 또는 제3항의 방법에서 사용되는 지지블럭(a).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SIP-9800165 | 1998-06-05 | ||
SI9800165A SI20041B (sl) | 1998-06-05 | 1998-06-05 | Postopek zlaganja vecslojnih pasivnih elektronskih komponent |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010022564A KR20010022564A (ko) | 2001-03-26 |
KR100451698B1 true KR100451698B1 (ko) | 2004-10-08 |
Family
ID=20432281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2000-7001155A KR100451698B1 (ko) | 1998-06-05 | 1999-06-04 | 다층 수동전자부품의 제작방법 |
Country Status (10)
Country | Link |
---|---|
US (2) | US6432250B1 (ko) |
EP (1) | EP1023160B1 (ko) |
JP (1) | JP2002517106A (ko) |
KR (1) | KR100451698B1 (ko) |
CN (2) | CN1214919C (ko) |
AT (1) | ATE261813T1 (ko) |
DE (1) | DE69915580T2 (ko) |
SI (1) | SI20041B (ko) |
TW (1) | TW439068B (ko) |
WO (1) | WO1999062703A2 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
SI20041B (sl) * | 1998-06-05 | 2006-10-31 | Keko Oprema D.O.O. | Postopek zlaganja vecslojnih pasivnih elektronskih komponent |
TWI233651B (en) * | 2001-02-01 | 2005-06-01 | Shibaura Mechatronics Corp | Electric component compression bonding machine and method |
DE10340733A1 (de) * | 2003-09-04 | 2005-03-31 | Zf Friedrichshafen Ag | Mehrstufengetriebe |
CN109366587B (zh) * | 2018-12-06 | 2024-03-12 | 闳诚科技有限公司 | 一种用于裁切机的进料预压缩装置 |
CN113351753B (zh) * | 2021-06-02 | 2022-02-25 | 广东嘉元科技股份有限公司 | 一种铜箔软连接自动加工装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1173784B (de) | 1961-04-28 | 1964-07-09 | Werner Helmert | Mit Schneidwalzen arbeitende Vorrichtung zur kontinuierlichen Herstellung von Haftetiketten |
GB1596777A (en) | 1977-04-12 | 1981-08-26 | Lucas Industries Ltd | Method of locating a board on a support |
DE3345877A1 (de) | 1983-12-19 | 1985-06-27 | Friedrich Kessler & Co, 8032 Gräfelfing | Vorrichtung zum exakten positionieren eines werkstuecks |
FR2578484A1 (fr) | 1985-03-06 | 1986-09-12 | Leyval Jean Pierre | Machine pour la fabrication d'etiquettes adhesives |
FR2633549B1 (fr) | 1988-06-30 | 1992-12-31 | Centre Tech Ind Papier | Outil pour la decoupe de feuilles de papier ou de carton |
DE3838271A1 (de) * | 1988-11-11 | 1990-05-17 | Krupp Maschinentechnik | Verfahren zur herstellung von mattenstreifen aus breiteren klebrigen, mit deckfolien belegten werkstoffbahnen und vorrichtung zur durchfuehrung des verfahrens |
JPH0670941B2 (ja) * | 1988-12-15 | 1994-09-07 | 株式会社村田製作所 | 積層コンデンサの製造方法 |
JP3064544B2 (ja) * | 1991-08-30 | 2000-07-12 | 株式会社村田製作所 | 積層電子部品の製造方法 |
US5470193A (en) | 1992-06-08 | 1995-11-28 | Canon Kabushiki Kaisha | Pallet supply apparatus and control method thereof |
JP3063577B2 (ja) * | 1995-07-05 | 2000-07-12 | 株式会社村田製作所 | 積層セラミックコンデンサの製造方法とその装置 |
JP3321513B2 (ja) | 1995-11-01 | 2002-09-03 | 太陽誘電株式会社 | 積層型電子部品の製造方法及びその装置 |
US5879500A (en) * | 1996-06-21 | 1999-03-09 | Herrin; Robert M. | Disposable undergarment forming apparatus and method of forming same |
JPH10284346A (ja) | 1997-04-02 | 1998-10-23 | New Create Kk | セラミック生シートの積層装置 |
SI20041B (sl) * | 1998-06-05 | 2006-10-31 | Keko Oprema D.O.O. | Postopek zlaganja vecslojnih pasivnih elektronskih komponent |
-
1998
- 1998-06-05 SI SI9800165A patent/SI20041B/sl not_active IP Right Cessation
-
1999
- 1999-06-04 CN CNB998008915A patent/CN1214919C/zh not_active Expired - Fee Related
- 1999-06-04 DE DE69915580T patent/DE69915580T2/de not_active Expired - Fee Related
- 1999-06-04 US US09/485,078 patent/US6432250B1/en not_active Expired - Fee Related
- 1999-06-04 JP JP2000551944A patent/JP2002517106A/ja active Pending
- 1999-06-04 CN CNA2004100594330A patent/CN1550327A/zh active Pending
- 1999-06-04 EP EP99924093A patent/EP1023160B1/en not_active Expired - Lifetime
- 1999-06-04 KR KR10-2000-7001155A patent/KR100451698B1/ko not_active IP Right Cessation
- 1999-06-04 AT AT99924093T patent/ATE261813T1/de not_active IP Right Cessation
- 1999-06-04 WO PCT/SI1999/000016 patent/WO1999062703A2/en active IP Right Grant
- 1999-07-08 TW TW088109372A patent/TW439068B/zh not_active IP Right Cessation
-
2002
- 2002-06-14 US US10/172,409 patent/US6613176B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2002517106A (ja) | 2002-06-11 |
TW439068B (en) | 2001-06-07 |
SI20041A (sl) | 2000-02-29 |
CN1302256A (zh) | 2001-07-04 |
US20020162625A1 (en) | 2002-11-07 |
ATE261813T1 (de) | 2004-04-15 |
CN1214919C (zh) | 2005-08-17 |
US6432250B1 (en) | 2002-08-13 |
WO1999062703A2 (en) | 1999-12-09 |
WO1999062703A3 (en) | 2000-06-08 |
KR20010022564A (ko) | 2001-03-26 |
DE69915580D1 (de) | 2004-04-22 |
US6613176B2 (en) | 2003-09-02 |
EP1023160A2 (en) | 2000-08-02 |
EP1023160B1 (en) | 2004-03-17 |
CN1550327A (zh) | 2004-12-01 |
SI20041B (sl) | 2006-10-31 |
DE69915580T2 (de) | 2005-02-03 |
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