KR100429839B1 - 일괄 공정에 의한 마이크로 소자의 제조 방법 - Google Patents
일괄 공정에 의한 마이크로 소자의 제조 방법 Download PDFInfo
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- KR100429839B1 KR100429839B1 KR10-2001-0034688A KR20010034688A KR100429839B1 KR 100429839 B1 KR100429839 B1 KR 100429839B1 KR 20010034688 A KR20010034688 A KR 20010034688A KR 100429839 B1 KR100429839 B1 KR 100429839B1
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- layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
- H01L21/32137—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas of silicon-containing layers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
- F04B43/00—Machines, pumps, or pumping installations having flexible working members
- F04B43/02—Machines, pumps, or pumping installations having flexible working members having plate-like flexible members, e.g. diaphragms
- F04B43/04—Pumps having electric drive
- F04B43/043—Micropumps
- F04B43/046—Micropumps with piezoelectric drive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02587—Structure
- H01L21/0259—Microstructure
- H01L21/02595—Microstructure polycrystalline
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Chemical & Material Sciences (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Micromachines (AREA)
Abstract
Description
Claims (8)
- (가) 실리콘층 및 산화물층 또는 질화물층을 포함하여 다층으로 형성된 기판 상에 유로층을 형성시키는 단계;(나) 상기 유로층 상에 덮개층 및 에너지 공급부를 순차적으로 형성시키는 단계;(다) 상기 덮개층 또는 기판 하부에 상기 유로층의 일부가 노출되도록 상기 덮개층 또는 상기 기판 하부를 선택적으로 제거하여 유체 입력구 및 출력구를 형성시키는 단계; 및(라) 상기 유체 입력구 또는 출력구를 통하여 불소를 포함하는 기상의 등방성 식각 물질을 이용하여, 상기 유로층을 선택적으로 제거하여 유체 이동부를 형성시키는 단계;를 포함하는 것을 특징으로 하는 일괄 공정에 의한 마이크로 소자의 제조 방법.
- 삭제
- 제 1항에 있어서,상기 (가) 단계;는 상기 유로층 주변의 상기 기판 상부 영역을 제거하거나, 상기 유로층의 근접 영역에 홈을 형성시킴으로써 이루어지는 것을 특징으로 하는 마이크로 소자의 제조 방법.
- 제 1항에 있어서,상기 유체 이동부는 유체 입력 밸브, 챔버부 및 유체 출력 밸브를 포함하며, 상기 (나) 단계;의 에너지 공급부는 상기 챔버부에 대응되는 상기 덮개층 상에 형성시키는 것을 특징으로 하는 마이크로 소자의 제조 방법.
- 제 4항에 있어서,상기 (나) 단계;의 상기 에너지 공급부는 금속 화합물 또는 폴리 실리콘을 포함하여 형성시키는 것을 특징으로 하는 마이크로 소자의 제조 방법.
- 제 1항에 있어서,상기 (나) 단계;의 상기 덮개층은 산화물, 질화물 또는 금속막을 포함하여 형성시키는 것을 특징으로 하는 마이크로 소자의 제조 방법.
- 제 1항에 있어서,상기 (나) 단계;의 상기 덮개층은 압전체를 포함하여 형성시킨 것을 특징으로 하는 마이크로 소자의 제조 방법.
- 제 1항에 있어서,상기 (라) 단계의 상기 불소를 포함하는 기상의 등방성 식각 물질은 XeF2인 것을 특징으로 하는 마이크로 소자의 제조 방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0034688A KR100429839B1 (ko) | 2001-06-19 | 2001-06-19 | 일괄 공정에 의한 마이크로 소자의 제조 방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0034688A KR100429839B1 (ko) | 2001-06-19 | 2001-06-19 | 일괄 공정에 의한 마이크로 소자의 제조 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020096298A KR20020096298A (ko) | 2002-12-31 |
KR100429839B1 true KR100429839B1 (ko) | 2004-05-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR10-2001-0034688A Expired - Fee Related KR100429839B1 (ko) | 2001-06-19 | 2001-06-19 | 일괄 공정에 의한 마이크로 소자의 제조 방법 |
Country Status (1)
Country | Link |
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KR (1) | KR100429839B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111980889B (zh) * | 2020-09-29 | 2022-11-18 | 长春工业大学 | 一种半柔性一体式主动阀压电泵 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR910012538A (ko) * | 1989-12-27 | 1991-08-08 | 야마무라 가쯔미 | 마이크로 펌프 및 그 제조 방법 |
JPH0463973A (ja) * | 1990-07-02 | 1992-02-28 | Seiko Epson Corp | マイクロポンプの製造方法 |
JP2000274375A (ja) * | 1999-03-25 | 2000-10-03 | Seiko Epson Corp | マイクロ液体流動デバイス |
KR20020051290A (ko) * | 2000-12-22 | 2002-06-28 | 오길록 | 열구동형 마이크로 펌프 및 그 제조 방법 |
-
2001
- 2001-06-19 KR KR10-2001-0034688A patent/KR100429839B1/ko not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR910012538A (ko) * | 1989-12-27 | 1991-08-08 | 야마무라 가쯔미 | 마이크로 펌프 및 그 제조 방법 |
JPH0463973A (ja) * | 1990-07-02 | 1992-02-28 | Seiko Epson Corp | マイクロポンプの製造方法 |
JP2000274375A (ja) * | 1999-03-25 | 2000-10-03 | Seiko Epson Corp | マイクロ液体流動デバイス |
KR20020051290A (ko) * | 2000-12-22 | 2002-06-28 | 오길록 | 열구동형 마이크로 펌프 및 그 제조 방법 |
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Publication number | Publication date |
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KR20020096298A (ko) | 2002-12-31 |
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