KR100373175B1 - Stamping foil adhesive composition comprising ketone resin, polypropylene resin, vinyl acetate resin, polyester-based resin, phthalate-based plasticizer and silica particle, and stamping foil using the composition - Google Patents
Stamping foil adhesive composition comprising ketone resin, polypropylene resin, vinyl acetate resin, polyester-based resin, phthalate-based plasticizer and silica particle, and stamping foil using the composition Download PDFInfo
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- KR100373175B1 KR100373175B1 KR1019960057677A KR19960057677A KR100373175B1 KR 100373175 B1 KR100373175 B1 KR 100373175B1 KR 1019960057677 A KR1019960057677 A KR 1019960057677A KR 19960057677 A KR19960057677 A KR 19960057677A KR 100373175 B1 KR100373175 B1 KR 100373175B1
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- stamping foil
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- 239000011888 foil Substances 0.000 title claims abstract description 31
- 239000000203 mixture Substances 0.000 title claims abstract description 27
- 239000000853 adhesive Substances 0.000 title claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 23
- 229920005989 resin Polymers 0.000 title claims abstract description 18
- 239000011347 resin Substances 0.000 title claims abstract description 18
- 229920001225 polyester resin Polymers 0.000 title claims abstract description 12
- -1 polypropylene Polymers 0.000 title claims abstract description 9
- 239000004743 Polypropylene Substances 0.000 title claims abstract description 8
- 150000002576 ketones Chemical class 0.000 title claims abstract description 8
- 229920001155 polypropylene Polymers 0.000 title claims abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 7
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 title claims abstract description 5
- 239000004014 plasticizer Substances 0.000 title claims abstract description 4
- 239000002245 particle Substances 0.000 title abstract description 4
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 title 1
- 239000000377 silicon dioxide Substances 0.000 title 1
- 239000004645 polyester resin Substances 0.000 claims abstract description 11
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000012790 adhesive layer Substances 0.000 claims abstract description 6
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 6
- 239000000460 chlorine Substances 0.000 claims abstract description 6
- 230000009477 glass transition Effects 0.000 claims description 4
- 239000011164 primary particle Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 5
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 239000000020 Nitrocellulose Substances 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 150000002148 esters Chemical class 0.000 abstract description 2
- 239000012948 isocyanate Substances 0.000 abstract description 2
- 150000002513 isocyanates Chemical class 0.000 abstract description 2
- 229920001220 nitrocellulos Polymers 0.000 abstract description 2
- 229920006267 polyester film Polymers 0.000 abstract description 2
- 239000011241 protective layer Substances 0.000 abstract description 2
- 238000000151 deposition Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- JQCXWCOOWVGKMT-UHFFFAOYSA-N diheptyl phthalate Chemical compound CCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCC JQCXWCOOWVGKMT-UHFFFAOYSA-N 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000010023 transfer printing Methods 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J129/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal, or ketal radical; Adhesives based on hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Adhesives based on derivatives of such polymers
- C09J129/12—Homopolymers or copolymers of unsaturated ketones
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
- C09J123/26—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment
- C09J123/28—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers modified by chemical after-treatment by reaction with halogens or compounds containing halogen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J131/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an acyloxy radical of a saturated carboxylic acid, of carbonic acid, or of a haloformic acid; Adhesives based on derivatives of such polymers
- C09J131/02—Homopolymers or copolymers of esters of monocarboxylic acids
- C09J131/04—Homopolymers or copolymers of vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
본 발명은 저온 및 표면의 요철이 심한 종이에 접착성이 우수한 스탬핑 호일(Stamping Foil)의 접착 조성물 및 이를 사용한 스탬핑 호일에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive composition of a stamping foil having excellent adhesion to low temperature and highly uneven paper on the surface, and a stamping foil using the same.
본 발명에 따른 스탬핑 호일의 접착 조성물은, 피전사체 표면에 접착되도록 스탬핑 호일에 적층형성되는 스탬핑 호일의 접착층에 있어서, 상기 접착층이 케톤수지 30∼50중량부, 염소함량이 10 내지 40중량%인 폴리프로필렌수지 5∼20중량부, 비닐아세테이트수지 5∼25중량부, 폴리에스테르계 수지 5∼20중량부, 프탈산 에스테르계 가소제 5∼15중량부 및 입자경(Primary Particle Size)이 0.1∼2㎛인 실리카 입자 5∼20중량부가 함유된 데에 그 특징이 있으며, 폴리에스테르 필름에 왁스를 코팅하여 이형층을 형성하고 그 위에 니트로셀룰로오스와 이소시아네이트로 보호층을 형성한 다음 진공증착기를 사용하여 알루미늄을 증착하여 금속층을 형성한 위에, 상기 접착 조성물을 그라비아 코터 등을 사용하여 코팅하여 접착층을 형성함으로서 스탬핑 호일이 제조된다.In the adhesive composition of the stamping foil according to the present invention, in the adhesive layer of the stamping foil laminated on the stamping foil to be adhered to the surface of the transfer object, the adhesive layer is 30 to 50 parts by weight of ketone resin, 10 to 40% by weight of chlorine 5 to 20 parts by weight of polypropylene resin, 5 to 25 parts by weight of vinyl acetate resin, 5 to 20 parts by weight of polyester resin, 5 to 15 parts by weight of phthalic ester plasticizer, and a particle size of 0.1 to 2 μm. It contains 5 to 20 parts by weight of silica particles, which is characterized by coating a wax on a polyester film to form a release layer, forming a protective layer thereon with nitrocellulose and isocyanate, and then depositing aluminum using a vacuum evaporator. By forming a metal layer, a stamping foil is prepared by coating the adhesive composition using a gravure coater or the like to form an adhesive layer.
이렇게 제조된 스탬핑 호일은 광범위한 온도범위에서 수동 스탬핑 기계는 물론 고속 자동스탬핑기에서도 피전사체에 대한 접착력이 우수하며, 특히 저온에서 그 특성이 매우 우수한 효과를 갖는다.The stamping foil manufactured in this way has excellent adhesion to the transfer object in a high speed automatic stamping machine as well as a manual stamping machine in a wide range of temperatures, and particularly at low temperatures, its properties are very excellent.
Description
본 발명은 스탬핑 호일(Stamping Foil)용 접착 조성물에 관한 것으로서, 보다 구체적으로는 낮은 온도 및 표면의 요철이 심한 종이에 접착성이 우수한 스탬핑 호일의 접착 조성물 및 이를 사용한 스탬핑 호일에 관한 것이다.The present invention relates to an adhesive composition for stamping foil, and more particularly, to an adhesive composition of a stamping foil having excellent adhesion to paper having a high temperature and uneven surface of the surface, and a stamping foil using the same.
일반적으로 스탬핑 호일이라 함은 기본적으로 전사인쇄의 일종으로서 잉크대신에 열전사막을 이용하는 인쇄방식인데, 다른 인쇄방식과 비교해 볼 때 설비 및 제조공정이 간단하고, 인쇄 및 습식도금 방식에 비하여 공해를 유발하지 않으며, 특히 금속광택이 우수하다는 장점이 있어 서적표지, 앨범, 카탈로그, 연하장, 엽서, 카드, 상자, 용기 수첩 등 무수한 종류의 피전사체에 사용하여 앞으로도 적용범위가 점차 확대될 것으로 예상되어 이에 대한 관심이 점차 고조되는 추세에 있다.In general, stamping foil is basically a kind of transfer printing, which uses a thermal transfer film instead of ink, which is simpler in manufacturing and manufacturing processes than other printing methods, and causes pollution compared to printing and wet plating methods. In particular, it has the advantage of excellent metallic gloss, so it is expected to be applied to countless kinds of transfer objects such as book covers, albums, catalogues, greeting cards, postcards, cards, boxes, and container handbooks. Interest is on the rise.
스탬핑 호일에 있어서 기본적인 제품으로서의 요건은 피전사체에 대한 접착성과 인쇄다이(Stamping Die)의 무늬를 선명하게 구분하여 주는 절단성이다.The basic product requirements for stamping foils are the cutting property which clearly distinguishes the adhesion of the transfer object and the pattern of the printing die.
이러한 스탬핑 호일의 전사에 있어서 최근의 동향은 수동기계에서 자동기계로 바뀌어 가고 있는 추세이며, 자동기계는 전사속도가 고속이므로 스탬핑 호일의 제품균일성이 요구되며, 둘째로는 전사시에 가해지는 열이 수동기계에 비하여 상대적으로 작으므로 낮은 온도에서도 접착성 또는 작업성이 우수한 스탬핑 호일이 필요해지고 있는 실정이다. 셋째로는 자동기계의 다이는 여러개가 동시에 한판에 부착되어 있으므로 다이조절이 어려우며, 따라서 부분적인 압력불균일에 의한 작업성 저하가 일어날 수가 있다.The recent trend in the transfer of such stamping foil is a trend that is changing from manual to automatic machines, the automatic machine is a high speed of transfer, the product uniformity of the stamping foil is required, and secondly the heat applied during transfer Since it is relatively small compared to this manual machine, there is a need for a stamping foil having excellent adhesion or workability even at a low temperature. Thirdly, the die of the automatic machine is difficult to adjust the die because several dies are attached to one plate at the same time, and thus the workability may be reduced due to partial pressure unevenness.
자동기계에서 요구되는 조건중의 하나는 제품 균일성으로, 이는 두께 균일성 및 특성 균일성을 의미하며, 이러한 요구조건에 부응하기 위해서는 제품의 두께 균일성과 아울러 두께가 일정수준 이상이 되어야 한다.One of the conditions required for automatic machines is product uniformity, which means thickness uniformity and property uniformity. To meet these requirements, the thickness uniformity and thickness of the product must be at least a certain level.
자동기계에서 요구되는 다른 조건은 낮은 온도에서의 우수한 접착성 및 압력이 일정하지 않을 때에도 우수한 접착성을 유지해야 한다는 것이다. 이러한 필요를 만족시키기 위해서는 저온에서 유동성이 확보되면서 우수한 접착성을 가진 접착조성이 요구된다.Another condition required for automatic machines is that good adhesion at low temperatures and good adhesion should be maintained even when the pressure is not constant. In order to satisfy this need, an adhesive composition having excellent adhesiveness is required while ensuring fluidity at low temperatures.
따라서, 본 발명의 목적은 상기의 요구조건중 후자의 요구조건을 만족시키기 위하여 광범위한 온도범위에서 수동 스탬핑 기계는 물론 고속 자동스탬핑기에서도 피전사체에 대한 접착력이 우수한 조성물과 이를 사용한 스탬핑 호일을 제공하는 데에 있다.Accordingly, an object of the present invention is to provide a composition having excellent adhesion to a transfer object and a stamping foil using the same in a high speed automatic stamping machine as well as a manual stamping machine in a wide temperature range in order to satisfy the latter requirement among the above requirements. There is.
상기 본 발명의 목적을 달성하기 위한 스탬핑 호일의 접착 조성물은, 케톤수지 30∼50 중량부, 염소함량이 10 내지 40 중량%인 폴리프로필렌수지 5∼20 중량부, 비닐아세테이트 수지 5∼25 중량부, 폴리에스테르계수지 5∼20 중량부, 프탈산 에스테르계 가소제 5∼15 중량부 및 입자경(Primary Particle Size)이 0.1∼2㎛인 실리카 입자 5∼20 중량부가 함유된 데에 그 특징이 있다.The adhesive composition of the stamping foil for achieving the object of the present invention, 30 to 50 parts by weight of ketone resin, 5 to 20 parts by weight of polypropylene resin having a chlorine content of 10 to 40% by weight, 5 to 25 parts by weight of vinyl acetate resin , 5 to 20 parts by weight of polyester resin, 5 to 15 parts by weight of phthalic ester plasticizer and 5 to 20 parts by weight of silica particles having a particle size of 0.1 to 2 μm.
본 발명에 있어서, 특히 중요한 특징은 스탬핑 호일의 접착력의 증가와 저온시 유동성의 확보를 위하여 유리전이온도가 낮고 접착력이 우수한 폴리에스테르 수지를 사용한 것이다.In the present invention, a particularly important feature is to use a polyester resin having a low glass transition temperature and excellent adhesion in order to increase the adhesive strength of the stamping foil and to secure fluidity at low temperatures.
본 발명에 사용한 폴리에스테르 수지는 수평균 분자량이 18,000∼25,000 이며, 유리전이온도가 0∼65℃의 물성을 갖는 것을 특징으로 하는 것이다.The polyester resin used in the present invention has a number average molecular weight of 18,000 to 25,000 and a glass transition temperature having a physical property of 0 to 65 ° C.
각 접착층 조성 성분이 상기한 범위를 벗어나는 경우에 있어서는 다음과 같은 문제가 발생한다.When each adhesive layer composition component is out of the above-mentioned range, the following problem arises.
케톤수지의 함량이 전체 고형분의 30 중량부 미만인 경우에는 절단성이, 50 중량부를 초과하는 경우에는 접착성이 불량해질 수 있다.When the content of the ketone resin is less than 30 parts by weight of the total solids, the cutting property may be poor, and when the content of the ketone resin exceeds 50 parts by weight, the adhesion may be poor.
염소함유 폴리프로필렌의 함량이 전체 고형분의 5 중량부 미만인 경우에는 접착성이, 20 중량부를 초과하는 경우에는 절단성이 불량해질 수 있다.If the content of the chlorine-containing polypropylene is less than 5 parts by weight of the total solids, the adhesiveness may be poor, and if the content of the chlorine-containing polypropylene exceeds 20 parts by weight, the cutting property may be poor.
폴리에스테르 수지의 함량이 5 중량부 미만인 경우에는 저온에서의 접착성이 저하되며, 20 중량부 이상인 경우에는 저온에서의 접착성 및 접착력은 현저하게 좋아지나 절단성이 저하되는 문제점이 있다.When the content of the polyester resin is less than 5 parts by weight, the adhesiveness at low temperature is lowered, and when the content of the polyester resin is 20 parts by weight or more, the adhesiveness and adhesion at low temperature are remarkably improved, but there is a problem that the cutability is lowered.
스탬핑 호일의 절단성을 증가시키기 위해서 첨가하는 실리카 입자는 그 함량이 전체 고형분의 5 중량부 미만인 경우에는 절단성이 불량해지고 20 중량부를 초과할 때에는 접착성이 불량해 진다.Silica particles added to increase the cutting property of the stamping foil have poor cutting properties when the content is less than 5 parts by weight of the total solids, and poor adhesiveness when they exceed 20 parts by weight.
이하 실시예를 참조하여 본 발명을 보다 상세히 설명한다. 이들 실시예는 본 발명의 바람직한 실시양태를 보인 것으로 본 발명이 이들 실시예에 한정되는 것은 아니다.The present invention will be described in more detail with reference to the following examples. These examples illustrate preferred embodiments of the invention and the invention is not limited to these examples.
[실시예]EXAMPLE
12㎛ 폴리에스테르 필름에 왁스를 0.1㎛정도 코팅하여 이형층을 형성하고, 그 위에 니트로셀룰로오스와 이소시아네이트를 사용하여 0.8㎛두께로 코팅하여 보호층을 형성하였다. 그리고 이 위에 진공증착기를 사용하여 알루미늄을 300Å의 두께로 증착하여 금속층을 형성하였다. 이 금속층 위에 고형분으로서 케톤수지 40중량부, 염소치환기의 함량이 28중량%인 폴리프로필렌 10중량부, 비닐아세테이트수지 15중량부, 수평균 분자량이 25,000이고, 유리 전이온도가 10℃인 폴리에스테르계수지 15중량부, 평균입자경이 0.5㎛인 실리카 입자 10중량부 및 디 헵틸프탈레이트 (DHP) 10중량부를 톨루엔과 아세테이트의 혼합용매에 15중량% 농도의 용액으로 제조하여 그라비아 코터로 2.0㎛의 두께로 코팅하여 접착층을 형성하였다.Wax was coated on a 12 μm polyester film at about 0.1 μm to form a release layer, and then coated with a nitrocellulose and isocyanate to a thickness of 0.8 μm to form a protective layer. Then, aluminum was deposited to a thickness of 300 kPa using a vacuum evaporator to form a metal layer. 40 parts by weight of ketone resin, 10 parts by weight of polypropylene having 28% by weight of chlorine substituent, 15 parts by weight of vinyl acetate resin, polyester coefficient having a number average molecular weight of 25,000 and a glass transition temperature of 10 ° C. on the metal layer. 15 parts by weight, 10 parts by weight of silica particles having an average particle diameter of 0.5 μm, and 10 parts by weight of diheptyl phthalate (DHP) were prepared as a solution of 15% by weight in a mixed solvent of toluene and acetate to a thickness of 2.0 μm with a gravure coater. The coating formed an adhesive layer.
[비교예 1]Comparative Example 1
실시예와 동일한 절차를 밟으며 접착조성중 폴리에스테르수지가 3중량%인 것을 제외하고는 접착조성비가 동일한 접착조성물을 갖는 스탬핑 호일을 제조하였다.Following the same procedure as in Example, except that the polyester resin in the adhesive composition of 3% by weight, a stamping foil having an adhesive composition having the same adhesive composition ratio was prepared.
[비교예 2]Comparative Example 2
실시예와 동일한 절차를 밟으며 접착조성중 폴리에스테르 수지가 25중량%인 것을 제외하고는 접착조성비가 동일한 접착조성물을 갖는 스탬핑 호일을 제조하였다.Following the same procedure as in Example, except that 25% by weight of the polyester resin in the adhesive composition, a stamping foil having an adhesive composition having the same adhesive composition ratio was prepared.
[비교예 3]Comparative Example 3
실시예와 동일한 절차를 밟으며 접착조성중 폴리에스테르수지를 제외한 것을 빼고는 접착조성비가 동일한 접착조성물을 갖는 스탬핑 호일을 제조하였다.Following the same procedure as in Example, except that except for the polyester resin in the adhesive composition, a stamping foil having an adhesive composition having the same adhesive composition ratio was prepared.
[비교예 4][Comparative Example 4]
실시예와 동일한 절차를 밟으며 접착조성중 염소함유 폴리프로필렌수지를 첨가하지 않은 것을 제외하고는 접착조성비가 동일한 접착조성물을 갖는 스탬핑 호일을 제조하였다.Following the same procedure as in Example, except that no chlorine-containing polypropylene resin was added in the bonding composition, a stamping foil having the same bonding composition was prepared.
[비교예 5][Comparative Example 5]
실시예와 동일한 절차를 밟으며 접착조성중 케톤수지를 25중량%로 한외의 다른 접착수지비는 동일한 접착조성물을 갖는 스탬핑 호일을 제조하였다.The same procedure as in Example was carried out to 25% by weight of the ketone resin in the adhesive composition, other than the adhesive resin ratio to prepare a stamping foil having the same adhesive composition.
상기 실시예 및 비교예에서 제조한 스탬핑 호일을 사용하여 물성을 시험하였으며, 그 결과는 표1과 같다.Physical properties were tested using the stamping foils prepared in Examples and Comparative Examples, and the results are shown in Table 1.
물성은 다음과 같은 방법에 의해 평가하였다.Physical properties were evaluated by the following method.
접착성: 자동전사기계는 하이텔베르그 자동실린더 기계를 사용하였으며, 접착성의 평가는 아트지, 오피피-라미(OPP-lami)지, 중공용 레드(red)지에 3Kgf/㎠의 압력으로 전사 후 다이면적을 차지하는 인쇄면적을 모눈을 사용하여 300등분하여 인쇄면적을 측정하여 접착율을 퍼센트로 계산하였다. 또한 평가온도는 실제 다이온도 기준으로 120, 100, 80℃의 세 온도조건에서 행하였다.Adhesiveness: The automatic transfer machine used a Hitelberg automatic cylinder machine, and the evaluation of adhesiveness was carried out at 3Kgf / ㎠ pressure on art paper, OPP-lami paper and hollow red paper, and then transferred to die area. The printing area occupied was divided into 300 equal parts using the grid, and the printing area was measured to calculate the adhesion ratio in percent. Moreover, evaluation temperature was performed on three temperature conditions of 120, 100, and 80 degreeC on the basis of actual die temperature.
절단성: 자동전사기계는 하이델베르그 자동실린더 기계를 사용하였으며, 절단성의 평가는 정사각형의 격자가 조각된(264개) 인쇄다이로 평가하였으며, 이때의 인쇄된 격자가 막히지 않은 부분을 전체 격자수로 나누어 퍼센트로 나타내었다. 또한 평가온도는 실제 다이온도 기준으로 100℃의 온도조건에서 행하였다.Cutability: The automatic transfer machine used the Heidelberg automatic cylinder machine. The cutability was evaluated by a printing die in which a square lattice was carved (264 pieces), and the unprinted portion of the printed lattice was divided by the total number of grids. It is expressed as a percentage. In addition, evaluation temperature was performed on 100 degreeC temperature conditions on the basis of actual die temperature.
표1에서 확인되듯이, 본 발명에 의한 스탬핑 호일이 기존의 것에 비해 물성이 뛰어나며, 100℃ 이하의 저온에서 접착성이 매우 우수함을 알 수 있다.As confirmed in Table 1, it can be seen that the stamping foil according to the present invention has excellent physical properties compared to the conventional one, and has excellent adhesion at low temperatures of 100 ° C. or lower.
이상에서 상세히 설명한 바와 같이, 본 발명에 따른 스탬핑 호일은 광범위한 온도범위에서 수동 스탬핑 기계는 물론 고속 자동스탬핑기에서도 피전사체에 대한 접착력이 우수하며, 특히 저온에서 그 특성이 매우 우수한 효과를 갖는다.As described in detail above, the stamping foil according to the present invention has excellent adhesion to the transfer object in a high speed automatic stamping machine as well as a manual stamping machine in a wide range of temperatures, and particularly at low temperatures, its properties are very excellent.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960057677A KR100373175B1 (en) | 1996-11-26 | 1996-11-26 | Stamping foil adhesive composition comprising ketone resin, polypropylene resin, vinyl acetate resin, polyester-based resin, phthalate-based plasticizer and silica particle, and stamping foil using the composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019960057677A KR100373175B1 (en) | 1996-11-26 | 1996-11-26 | Stamping foil adhesive composition comprising ketone resin, polypropylene resin, vinyl acetate resin, polyester-based resin, phthalate-based plasticizer and silica particle, and stamping foil using the composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR19980038753A KR19980038753A (en) | 1998-08-05 |
| KR100373175B1 true KR100373175B1 (en) | 2005-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019960057677A Expired - Lifetime KR100373175B1 (en) | 1996-11-26 | 1996-11-26 | Stamping foil adhesive composition comprising ketone resin, polypropylene resin, vinyl acetate resin, polyester-based resin, phthalate-based plasticizer and silica particle, and stamping foil using the composition |
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| KR (1) | KR100373175B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100978379B1 (en) | 2008-02-28 | 2010-08-26 | (주)대영해외상사 | How to print foil on fabric |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100364120B1 (en) * | 2000-07-10 | 2002-12-12 | 김대웅 | Manufacturing Method for Transfer Metalling Paper |
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1996
- 1996-11-26 KR KR1019960057677A patent/KR100373175B1/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100978379B1 (en) | 2008-02-28 | 2010-08-26 | (주)대영해외상사 | How to print foil on fabric |
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| KR19980038753A (en) | 1998-08-05 |
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