KR0139325B1 - Stamping foil - Google Patents
Stamping foilInfo
- Publication number
- KR0139325B1 KR0139325B1 KR1019950051989A KR19950051989A KR0139325B1 KR 0139325 B1 KR0139325 B1 KR 0139325B1 KR 1019950051989 A KR1019950051989 A KR 1019950051989A KR 19950051989 A KR19950051989 A KR 19950051989A KR 0139325 B1 KR0139325 B1 KR 0139325B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- protective layer
- weight
- points
- stamping foil
- Prior art date
Links
- 239000011888 foil Substances 0.000 title claims abstract description 22
- 239000011241 protective layer Substances 0.000 claims abstract description 46
- 239000010410 layer Substances 0.000 claims abstract description 32
- 239000003960 organic solvent Substances 0.000 claims abstract description 8
- 239000012790 adhesive layer Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 239000002985 plastic film Substances 0.000 claims abstract description 4
- 229920006255 plastic film Polymers 0.000 claims abstract description 4
- 239000000975 dye Substances 0.000 claims description 15
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 12
- 238000006116 polymerization reaction Methods 0.000 claims description 12
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- 239000011342 resin composition Substances 0.000 claims description 3
- 239000000020 Nitrocellulose Substances 0.000 claims description 2
- 229920001220 nitrocellulos Polymers 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 2
- 235000019441 ethanol Nutrition 0.000 claims 1
- 230000035515 penetration Effects 0.000 abstract description 13
- 239000000853 adhesive Substances 0.000 abstract description 9
- 230000001070 adhesive effect Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 8
- 239000000203 mixture Substances 0.000 abstract description 8
- 230000000052 comparative effect Effects 0.000 description 20
- 239000002904 solvent Substances 0.000 description 15
- 241000220259 Raphanus Species 0.000 description 10
- 235000006140 Raphanus sativus var sativus Nutrition 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 8
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- 201000003373 familial cold autoinflammatory syndrome 3 Diseases 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 206010058314 Dysplasia Diseases 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 239000012948 isocyanate Substances 0.000 description 2
- 150000002513 isocyanates Chemical class 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- -1 polypropylene Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 230000007017 scission Effects 0.000 description 2
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- WZFUQSJFWNHZHM-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)CC(=O)N1CC2=C(CC1)NN=N2 WZFUQSJFWNHZHM-UHFFFAOYSA-N 0.000 description 1
- CONKBQPVFMXDOV-QHCPKHFHSA-N 6-[(5S)-5-[[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]methyl]-2-oxo-1,3-oxazolidin-3-yl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C[C@H]1CN(C(O1)=O)C1=CC2=C(NC(O2)=O)C=C1 CONKBQPVFMXDOV-QHCPKHFHSA-N 0.000 description 1
- DEXFNLNNUZKHNO-UHFFFAOYSA-N 6-[3-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperidin-1-yl]-3-oxopropyl]-3H-1,3-benzoxazol-2-one Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C1CCN(CC1)C(CCC1=CC2=C(NC(O2)=O)C=C1)=O DEXFNLNNUZKHNO-UHFFFAOYSA-N 0.000 description 1
- MPVDXIMFBOLMNW-ISLYRVAYSA-N 7-hydroxy-8-[(E)-phenyldiazenyl]naphthalene-1,3-disulfonic acid Chemical compound OC1=CC=C2C=C(S(O)(=O)=O)C=C(S(O)(=O)=O)C2=C1\N=N\C1=CC=CC=C1 MPVDXIMFBOLMNW-ISLYRVAYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229940117958 vinyl acetate Drugs 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/04—Printing plates or foils; Materials therefor metallic
- B41N1/08—Printing plates or foils; Materials therefor metallic for lithographic printing
- B41N1/086—Printing plates or foils; Materials therefor metallic for lithographic printing laminated on a paper or plastic base
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/04—Printing plates or foils; Materials therefor metallic
- B41N1/08—Printing plates or foils; Materials therefor metallic for lithographic printing
- B41N1/10—Printing plates or foils; Materials therefor metallic for lithographic printing multiple
Landscapes
- Laminated Bodies (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
본 발명은 플라스틱 필름 지지체의 편면에 이형층, 보호층, 금속중착층, 접착층이 순차적으로 형성된 공지의 스탬핑 호일에서, 상기 이형층을 생략하고 보호층의 조성을 질화면(Nitrodellulose) 80~99 중량%, 유기용제에 용해되는 용해성 염료 1~20 중량%로 설정하므로써, 이형층을 생략하면서도 이형성 및 절단성이 우수하며 동시에 접착용액 용제에 의한 보호층의 침투라는 공정상의 문제점도 해결한 스탬핑 호일에 관한 것이다.According to the present invention, in a known stamping foil in which a release layer, a protective layer, a metal adhesion layer, and an adhesive layer are sequentially formed on one side of a plastic film support, the release layer is omitted and the composition of the protective layer is 80 to 99% by weight. By setting the soluble dye dissolved in an organic solvent at 1 to 20% by weight, the mold release layer is omitted, and the mold release foil is excellent in mold release and cutting property, and at the same time, the stamping foil which solves the process problem such as penetration of the protective layer by the adhesive solution is solved. will be.
Description
본 발명은 스탬핑 호일(Stamping Foil)에 관한 것으로, 상세하게는 이형층이 없으면서도 특성이 우수하고 제조공정상의 문제점이 없는 스탬핑 호일에 관한 것이다.The present invention relates to a stamping foil, and more particularly, to a stamping foil having excellent properties without a release layer and no problem in the manufacturing process.
스탬핑 호일은 열전사의 일종으로 플라스틱 필름 지지체에 코팅한 것을 피전사체로 전사시키는 인쇄방식에 이용된다. 이와 같은 스탬핑 공정은 건식 인쇄방식이기 때문에 여타의 인쇄와 비교할 때 건조공정이 필요하지 않고, 냄새가 나지 않으며, 금속 광택이 우수하다는 장점이 있어 서적 표지, 앨범, 카탈로그, 연하장, 엽서, 카드, 상자, 용기, 수첩 등 무수한 종류의 피전사체에 사용하며 앞으로도 적용용도가 점차 확대될 것으로 예상된다.Stamping foil is a kind of thermal transfer is used in the printing method for transferring the coating on the plastic film support to the transfer target. Since the stamping process is a dry printing method, it does not require a drying process, does not smell, and has excellent metallic luster as compared to other printings, so it is excellent in book covers, albums, catalogs, greeting cards, postcards, cards, and boxes. It is used in myriad kinds of transfer objects such as, containers and notebooks, and its application is expected to be gradually expanded in the future.
일반적으로 스탬핑 호일의 구조는 도면에 도시한 바와 같이 폴리에스테르, 폴리프로필렌 등의 지지체 필름위에 왁스, 셀룰로오스, 아크릴 수지 등을 코팅한 이형층을 형성하고, 이형층위에 내열성과 내약품성이 우수한 수지를 코팅하여 보호층을 형성하고, 알루미늄 또는 크롬, 동, 은, 금 등을 고진공 속에서 증착하여 금속층을 형성하고 이 금속층위에 피전사체에 적합한 접착층을 코팅하여 접착층을 형성한 것으로 이루어진다.In general, the stamping foil has a structure in which a release layer coated with wax, cellulose, an acrylic resin, or the like is formed on a support film such as polyester or polypropylene, and a resin having excellent heat resistance and chemical resistance is formed on the release layer. The coating layer forms a protective layer, and aluminum or chromium, copper, silver, and gold are deposited in a high vacuum to form a metal layer, and an adhesive layer is formed on the metal layer by coating an adhesive layer suitable for a transfer object.
이러한 스탬핑 호일에 있어서 제품의 코팅층의 두께가 고르지 못하게 되는 것은 대부분이 두께가 극히 얇은 이형층에서 발생하는 경우가 많다.In such stamping foils, the uneven thickness of the coating layer of the product is often caused by an extremely thin release layer.
본 발명은 이러한 이형층에 기인한 제품의 불균일 문제를 해결하기 위해서 이형층을 생략하였으며 동시에 이형층이 없으므로 발생되는 제조공정상의 문제점을 해결하기 위한 보호층의 조성을 설계하였다.The present invention omits the release layer in order to solve the problem of non-uniformity of the product due to this release layer, and at the same time designed the composition of the protective layer to solve the problem in the manufacturing process caused by the absence of the release layer.
따라서, 본 발명은 이형층이 없으면서도 이형성 및 절단성이 우수하고 동시에 공정상의 문제점도 없는 스탬핑 호일을 제공하는 데에 그 목적이 있다.Accordingly, an object of the present invention is to provide a stamping foil which is excellent in mold release property and cutting property without a release layer, and at the same time, there is no process problem.
이하, 본 발명을 상세히 설명하면 다음과 같다. 본 발명은 플라스틱 필름 지지체의 표면에 이형층은 생략되고 보호층, 금속중착층, 접착층이 순차적으로 형성되며, 상기 보호층은 질화면(Nitrocellulose) 80~99 중량%와 유기용제에 용해되는 용해성 염료 1~20 중량%로 이루어진 수지조성물임을 특징으로 하는 스탬핑 호일에 관한 것이다.Hereinafter, the present invention will be described in detail. In the present invention, the release layer is omitted on the surface of the plastic film support, and a protective layer, a metal adhesion layer, and an adhesive layer are sequentially formed. The protective layer is a soluble dye dissolved in 80 to 99% by weight of nitrocellulose and an organic solvent. It relates to a stamping foil, characterized in that the resin composition consisting of 1 to 20% by weight.
이와 같은 본 발명을 더욱 상세히 설명하면 다음과 같다.Referring to the present invention in more detail as follows.
일반적으로 특수 스탬핑 호일의 일종의 안료박(Pigment Stamping Foil)의 경우에는 이형층을 설계하지 않는 경우가 있다.Generally, in the case of a pigment stamping foil of a special stamping foil, a release layer may not be designed.
안료박의 경우에는 보호층 중에 무기물 입자가 다량 함유되어 있어 보호층과 지지체간의 밀착력이 크지 않기 때문에 이형층을 설계하지 않아도 스탬핑 호일을 피전사체에 열전사시 이형성이 양호한 경우가 많다.In the case of the pigment foil, since a large amount of inorganic particles are contained in the protective layer and the adhesion between the protective layer and the support is not large, the release property is often good during thermal transfer of the stamped foil onto the transfer object without designing a release layer.
본 발명은 이형층이 없고 보호층 중에 무기물 입자가 전혀 포함되지 않고 유기용매에 용해되는 염료만이 함유되었을 경우에 있어서도 이형성, 절단성이 우수하면서 동시에 제조공정상의 문제점이 없는 스탬핑 호일의 구조 및 보호층이 조성에 관한 것이다.In the present invention, even when there is no release layer and the protective layer contains no inorganic particles and only dyes dissolved in an organic solvent, the structure and protection of the stamping foil are excellent in releasability and cutting property and there are no problems in manufacturing process. The layer relates to the composition.
상기의 목적을 달성하기 위해서 지지체와의 접착력이 작은 수지인 질화면 80~99 중량%와 유기용매에 용해되는 용해성 염료 1~20 중량%로 이루어진 수지조성물을 보호층으로 사용한다.In order to achieve the above object, a resin composition composed of 80 to 99% by weight of a vaginal surface, which is a resin having a small adhesion to a support, and 1 to 20% by weight of a soluble dye dissolved in an organic solvent, is used as a protective layer.
용해성 염료의 함량이 보호층 전체의 20 중량%를 초과할 경우에는 이형성 및 절단성은 더욱 양호해지나 접착용액중의 용제에 의한 보호층의 침투가 급격히 증가하여 제조과정중에 문제가 발생한다. 이는 용해성 염료의 경우 톨루엔, 에스테르, 케톤계통의 접착용제에 대한 용해도가 매우 높기 때문이다.When the content of the soluble dye exceeds 20% by weight of the entire protective layer, the releasability and cleavability becomes better, but the penetration of the protective layer by the solvent in the adhesive solution increases rapidly, causing problems in the manufacturing process. This is because in the case of soluble dyes, the solubility in toluene, ester, ketone-based adhesive solvent is very high.
본 발명의 용해성 염료는 메틸에틸케톤, 이소프로필알코올, 에틸아세테이트, 톨루엔 등 유기용제에 2 중량% 이상 용해되는 염료이면 사용 가능하며, 구체적인 상품명으로는 독일 시바-가이기사의 Orasol 및 Neozapon 계통의 염료, 스위스 산도즈사의 Savinyl계통의 염료, 대만 Kelly Chemical Corp.사의 Orgalon 염료 등이 있다.The soluble dye of the present invention can be used as long as it is a dye which is dissolved in an organic solvent such as methyl ethyl ketone, isopropyl alcohol, ethyl acetate, toluene or more by 2% by weight or more. , Savinyl dyes from Sandoz, Switzerland and Orgalon dyes from Kelly Chemical Corp., Taiwan.
또한 상기 고분자 질화면은 공정상의 문제점을 해결하기 위하여 내구성이 우수하고 평균 중합도 250~380(RS 20초~RS 60초)인 것을 사용한다.In addition, in order to solve the process problems, the polymer screen has excellent durability and uses an average polymerization degree of 250 to 380 (RS 20 seconds to RS 60 seconds).
평균 중합도와 질화면의 초수와의 관계를 하기 표1에 나타내었다.The relationship between the average degree of polymerization and the number of seconds of the vaginal phase is shown in Table 1 below.
* 1. 질화면의 초수 및 분자량 관계는 KSM 3814에 근거하어 구분한 것이며, H(RS)는 질화면중의 질소함량이 11.5 내지 12.2 중량%의 범위인 것을 말한다.* 1. The number and molecular weight relationship of vaginal screen is classified based on KSM 3814, and H (RS) refers to the nitrogen content in vaginal screen ranging from 11.5 to 12.2 wt%.
여기서 공정상의 문제점이란 접착용액을 중착층위에 도포할 때 보호층의 내구성(특히, 내용제성)이 약한 경우에는 접착용액중의 유기용매가 보호층으로 일부 침투하여 보호층을 용해시켜 보호층 파괴를 일으키는 것을 의미한다. 이러한 보호층 파괴를 방지하기 위해서는 질화면의 분자량이 클수록 유리하다.The problem here is that when the adhesive solution is applied on the intermediate layer, when the durability of the protective layer is weak (especially solvent resistance), the organic solvent in the adhesive solution partially penetrates into the protective layer and dissolves the protective layer to prevent the protective layer from being destroyed. It means to cause. In order to prevent such a protective layer breakage, the higher the molecular weight of the vaginal surface, the more advantageous.
그러나 질화면의 평균 중합도가 380을 초과할 경우에는 내구성은 더욱 우수하나 절단성이 급격히 불량해지므로 사용하기 어렵다.However, when the average degree of polymerization of the vaginal surface exceeds 380 it is more difficult to use because the durability is more excellent but the cutting property is sharply poor.
상술한 바와 같이 본 발명에 의하면 이형층이 없음에도 불구하고 이형성 및 절단성이 우수하며 동시에 접착용액 용제에 의한 보호층의 침투라는 공정상의 문제점도 없는 스탬핑 호일을 얻을 수 있다.According to the present invention as described above, even though there is no release layer, it is possible to obtain a stamping foil having excellent releasability and cutting property and at the same time without a process problem of penetration of a protective layer by an adhesive solution solvent.
이하, 실시예를 통하여 본 발명을 더욱 구체적으로 설명하겠는 바, 본 발명이 실시예로 인하여 한정되는 것은 아니다.Hereinafter, the present invention will be described in more detail with reference to Examples, but the present invention is not limited to the Examples.
[실시예1]Example 1
12㎛ 폴리에스테르 필름에 평균 중합도가 300인 질화면이 보호층 전체 무게의 90 중량%, 용해성 염료(독일 Ciba-Geigy사의 Orasol Orange G)가 보호층 전체 무게의 10 중량%인 고형분을 메틸 에틸케톤 및 에틸아세테이트의 혼합용매(혼합 중량비 1:1)에 용해시켜 건조후의 두게가 1.0㎛ 가 되도록 그라비아 코터로 코팅하였다.Methyl ethyl ketone was obtained in a 12 µm polyester film with an average degree of polymerization of 300 mg of 90% by weight of the total weight of the protective layer and a soluble dye (Orsol Orange G from Ciba-Geigy, Germany) of 10% by weight of the total weight of the protective layer. And it was dissolved in a mixed solvent of ethyl acetate (mixing weight ratio 1: 1) and coated with a gravure coater so that the thickness after drying to 1.0㎛.
그리고 이 위에 진공 중착기로 알루미늄을 400Å의 두께로 중착하여 금속층을 형성하였다. 이 금속층 위에 케톤 수지, 비닐클로라이드-비닐아세테이트 공중합체, 염소화 폴리프로필렌 수지 및 비닐아세테이트 수지를 실리카 입자와 혼합시켜 톨루엔 및 에스테르의 혼합용매(혼합 중량비 3:1)에 12% 농도의 용액으로 제조하여 그라비아 코터로 분당 20m의 속도로 코팅하여 접착층을 형성하였다.Then, aluminum was deposited to a thickness of 400 kPa using a vacuum decanter to form a metal layer. Ketone resin, vinyl chloride-vinylacetate copolymer, chlorinated polypropylene resin, and vinyl acetate resin were mixed with silica particles on the metal layer to prepare a solution of 12% concentration in a mixed solvent of toluene and ester (mixed weight ratio 3: 1). An adhesive layer was formed by coating with a gravure coater at a speed of 20 m per minute.
[실시예 2]Example 2
실시예1에서 질화면의 평균 중합도가 260인 것을 제외하고는 실시예1과 동일하게 실시하였다.Example 1 was carried out in the same manner as in Example 1, except that the average degree of polymerization of the vaginal screen is 260.
[실시예3]Example 3
실시예1에서 질화면의 평균 중합도가 370인 것을 제외하고는 실시예1과 동일하게 실시하였다.Example 1 was carried out in the same manner as in Example 1, except that the average degree of polymerization of the vaginal screen is 370.
[실시예 4]Example 4
실시예1에서 질화면의 함량이 보호층 전체 고형분의 82 중량%이고 용해성 염료의 함량이 보호층 전체 고형분의 18 중량%인 것을 제외하고는 실시예1과 동일하게 실시하였다.Example 1 was carried out in the same manner as in Example 1 except that the content of the vaginal surface was 82% by weight of the total solids of the protective layer and the content of the soluble dye was 18% by weight of the total solids of the protective layer.
[실시예 5]Example 5
실시예1에서 질화면의 함량이 보호층 전체 고형분의 97 중량%이고 용해성 염료의 함량이 보호층 전체 고형분의 3 중량%인 것을 제외하고는 실시예1과 동일하게 실시하였다.Example 1 was carried out in the same manner as in Example 1 except that the content of the vaginal phase was 97% by weight of the total solids of the protective layer and the content of the soluble dye was 3% by weight of the total solids of the protective layer.
[비교예1]Comparative Example 1
실시예1에서 보호층의 조성에 이소시아네이트 경화제(애경화학 TR-50)를 질화면 100 중량부에 대하여 300 중량부 첨가하여 경화시키는 것을 제외하고는 실시예1과 동일하게 실시하였다.Except for curing by adding 300 parts by weight of isocyanate curing agent (Aekyung Chemical TR-50) to the composition of the protective layer in Example 1 to 100 parts by weight of the vaginal screen.
[비교예2]Comparative Example 2
실시예1에서 RS 1/16초(평균중합도 40)의 질화면을 사용하고 이소시아네이트 경화제(애경화학 TR-50)를 질화면 100 중량부에 대하여 300 중량부 첨가하여 경화시키는 것을 제외하고는 실시예1과 동일하게 실시하였다.Except that in Example 1 using RS 1/16 seconds (average degree of polymerization 40) of the vaginal screen and curing by adding 300 parts by weight of isocyanate curing agent (Aekyung Chemical TR-50) to 100 parts by weight of the vaginal screen. It carried out similarly to 1.
[비교예 3]Comparative Example 3
실시예1에서 보호층의 조성을 수평균 분자량 25,000의 아크릴 수지를 사용하는 것을 제외하고는 실시예1과 동일하게 실시하였다.In Example 1, the composition of the protective layer was carried out in the same manner as in Example 1, except that an acrylic resin having a number average molecular weight of 25,000 was used.
[비교예 4][Comparative Example 4]
실시예1에서 보호층의 조성을 수평균 분자량 15,000의 에폭시수지를 사용하는 것을 제외하고는 실시예1과 동일하게 실시하였다.In Example 1, the composition of the protective layer was carried out in the same manner as in Example 1, except that an epoxy resin having a number average molecular weight of 15,000 was used.
[비교예 5][Comparative Example 5]
실시예1에서 보호층의 조성을 수평균 분자량 25,000의 폴리비닐클로라이드 수지를 사용하는 것을 제외하고는 실시예1과 동일하게 실시하였다.The composition of the protective layer in Example 1 was carried out in the same manner as in Example 1, except that the polyvinyl chloride resin having a number average molecular weight of 25,000.
[비교예 6]Comparative Example 6
실시예1에서 보호층의 조성을 수평균 분자량 25,000의 폴리우레탄 수지를 사용하는 것을 제외하고는 실시예1과 동일하게 실시하였다.The composition of the protective layer in Example 1 was carried out in the same manner as in Example 1, except that a polyurethane resin having a number average molecular weight of 25,000.
[비교예 7]Comparative Example 7
실시예1에서 RS 1/2초(평균중합도 88)의 질화면을 사용하는 것을 제외하고는 실시예1과 동일하게 실시하였다.Except for using the vaginal screen of RS 1/2 second (average degree of polymerization 88) in Example 1 and was carried out in the same manner as in Example 1.
[비교예 8]Comparative Example 8
실시예1에서 RS 120초(평균중합도 440)의 질화면을 사용하는 것을 제외하고는 실시예1과 동일하게 실시하였다.Except for using the vaginal screen of RS 120 seconds (average degree of polymerization 440) in Example 1 was carried out in the same manner as in Example 1.
[비교예 9]Comparative Example 9
실시예1에서 염료의 함량이 보호층 전체 수지의 30 중량%이고 질화면이 70 중량%인 것을 제외하고는 실시예1과 동일하게 실시하였다.Except that the dye content in Example 1 is 30% by weight of the total protective layer resin and the quality screen is 70% by weight was carried out in the same manner as in Example 1.
상기의 실시예 및 비교예에 대한 이형성, 절단성, 용제 침투정도를 [표1]에 나타내었다.Table 1 shows the releasability, cleavability, and solvent penetration of the above Examples and Comparative Examples.
[평가방법][Assessment Methods]
1. 이형성 평가1. Evaluation of dysplasia
보호층을 제외한 중착층, 접착층을 동일하게 설계하고 보호층만을 변경하여 제조한 스탬핑 호일을 Up-Down 전사 기계에서 압력 3kg·f/㎠로 스탬핑하였을 때 전사기계 다이면적(다이의 면적은 가로의 길이가 5cm내지 15cm, 세로의 길이가 5cm 내지 15cm의 크기)의 95%이상이 접착되는 경우에는 매우 양호로 5점, 90% 내지 95% 접착되는 경우는 양호로 4점, 85% 내지 90% 접착되는 경우는 보통으로 3점, 80% 내지 85% 접착되는 경우는 불량으로 2점, 접착되는 면적이 80%이하인 경우에는 매우 불량으로 1점으로 구분하여 평가하였으며 이형이 불가능하여 일반 Up-Down 수동기계 및 하이델베르그 자동기계의 온도 및 압력의 범위내에서 제품으로서 사용이 불가능한 경우에는 이형성을 불능으로 구분하여 0점으로 평가하였다.The die area of the transfer machine (when the stamping foil manufactured by changing only the protective layer and the same layer except for the protective layer and the protective layer was stamped at a pressure of 3kg · f / ㎠ in the Up-Down transfer machine (the die area is horizontal) 5% to 5% to 15cm in length, and 5% to 15cm in length) are adhered to 5 points, and 5 points to 85% to 90% are good when 90% to 95% are bonded. In case of bonding, it is usually 3 points, 80% to 85% in case of adhesion, 2 points as bad, and in case of less than 80% of the bonded area, it is classified as 1 point as bad. When it was not possible to use the product within the range of temperature and pressure of the manual and Heidelberg automatic machines, the dysplasia was classified as impossible and evaluated as 0.
2. 절단성 평가2. Cutting property evaluation
자동 전사 기계는 하이델베르그 자동 실린더 기계를 사용하였으며 절단성의 평가는 정사각형의 격자가 조각된 스탬핑 호일로 평가하였으며 가로, 세로의 길이가 각각 0.5㎜, 0.7㎜, 1.0㎜이며, 높이가 0.5㎜인 정사각형 격자가 조각되어 있는 스탬핑 다이로 3kg·f/㎠의 압력으로 스탬핑하였을 때 인쇄된 정사각형 무늬의 해상도로 평가하였으며 0.5㎜ 격자 무늬의 해상도가 양호한 경우에 매우 양호로 5점, 0.5㎜ 격자 무늬의 해상도가 부분적으로 양호한 경우는 양호로 4점, 0.5㎜ 격자 무늬의 해상도는 불량하나 0.7㎜ 격자 무늬의 해상도가 양호한 경우에는 보통으로 3점, 0.7㎜ 격자 무늬의 해상도가 부분적으로 양호한 경우에는 불량으로 2점, 0.7㎜ 격자 무늬의 해상도가 불량한 경우는 매우 불량으로 1점으로 구분하여 평가하였다.The automatic transfer machine used Heidelberg automatic cylinder machine. The cutting performance was evaluated by stamping foil with a square lattice engraved. The lattice of 0.5 mm, 0.7 mm and 1.0 mm in length and width, respectively, was 0.5 mm in height. When stamped at a pressure of 3kg · f / ㎠ with a stamping die with engraving, it was evaluated as the resolution of the printed square pattern. When the resolution of 0.5mm plaid was good, the resolution of 5 points and 0.5mm plaid was very good. If the resolution is partially good, 4 points, the 0.5 mm plaid resolution is poor, but if the resolution of the 0.7 mm plaid is good, 3 points are normal. , The case where the resolution of the 0.7 mm lattice pattern was poor was evaluated as being very poor and divided into one point.
3. 보호층의 용제 침투 정도 평가3. Evaluation of Solvent Penetration Degree of Protective Layer
지지체위에 보호층 및 중착층을 설계한 후 접착층을 5m/분 속도 이상으로 도포시 접착용액중의 유기용제가 보호층을 침투하는 경우 30배율 내지 50배율 정도의 현미경으로 관찰하면 보호층에 가느다란 균열이 보이므로 이러한 균열의 발생 유무로써 침투정도를 평가하였으며, 침투는 유와 무로 판단하였다. 즉, 접착 용제가 침투하여 보호층을 파괴시키는 것이 확실한 경우에는 유로 전혀 침투하지 않는 경우에는 무로 평가하였으며 현미경으로 관찰하는 경우에는 침투현상이 확실히 관찰되나 육안으로 분별이 불가능한 경우에는 중으로 평가하였다.When the protective layer and the intermediate layer are designed on the support, and the adhesive layer is applied at a speed of 5 m / min or more, when the organic solvent in the adhesive solution penetrates the protective layer, it is thin in the protective layer when observed with a microscope of 30 to 50 magnification. As the cracks were seen, the degree of penetration was evaluated by the presence or absence of such cracks. In other words, when it is certain that the adhesive solvent penetrates and destroys the protective layer, it is evaluated as nothing when the channel does not penetrate at all.
4. 종합평가4. Comprehensive Evaluation
보호층의 용제 침투 현상이 없이 이형성 평가 점수 및 절단성 평가 점수의 합이 9점 이상이면 매우 양호, 7점 내지 8점이면 양호, 5점 내지 6점이면 보통, 3점 내지 4점이면 불량, 3점이하이면 매우 불량으로 구분하여 평가하였으며 이형성의 점수가 0점이거나 절단성의 점수가 1점이거나 보호층의 용제 침투 현상이 발생하는 경우에는 이형성과 절단성의 평가점수의 합에 관계없이 불량으로 구분하여 평가하였다.Without the solvent penetration phenomenon of the protective layer, the sum of the releasability evaluation score and the cleavage evaluation score is 9 or more, very good, 7 to 8 is good, 5 to 6 is normal, 3 to 4 is poor, If the score is less than 3, it is classified as very poor. If the score of release property is 0, the score of cutability is 1, or if a solvent penetration phenomenon occurs in the protective layer, it is classified as bad regardless of the sum of scores of release property and cutability. Evaluated.
실시예 및 비교예의 평가결과를 보면 이형층을 설계하지 않은 겨우 보호층의 수지로 아크릴, 에폭시, 폴리비닐클로라이드, 폴리우레탄 수지를 사용한 경우는 이형성이 극히 불량하여 이형이 되지 않는 경우가 발생하여 보호층의 막이 취약하여 용제 침투 현상도 발생한다.According to the evaluation results of the Examples and Comparative Examples, when the release layer was not designed, acrylic, epoxy, polyvinyl chloride, and polyurethane resins were used as the resin of the protective layer. The membrane of the layer is fragile and solvent penetration also occurs.
또한 이형층을 설계하지 않고 보호층에 경화제를 첨가하여 경화시키는 경우에는 지지체와의 접착력이 발생하여 이형이 되지 않으므로 이형성이 극히 불량해진다.Moreover, when hardening | curing by adding a hardening | curing agent to a protective layer without designing a mold release layer, since adhesive force with a support body generate | occur | produces and mold release does not become, mold release property is extremely bad.
또한 이형층을 설계하지 않고 질화면을 보호층의 수지로 사용하는 경우에 있어서는 질화면의 초수가 20초 미만인 질화면을 사용하는 경우에는 질화면의 내용제성이 취약하여 용제 침투 현상이 발생하며 질화면의 초수가 60초 초과의 질화면을 사용하는 경우에는 용제 침투현상은 없으나 절단성이 불량해진다.In addition, when the vaginal screen is used as a resin for the protective layer without designing a release layer, when the vaginal screen having a number of seconds less than 20 seconds is used, the solvent penetration phenomenon occurs due to the poor solvent resistance of the vaginal screen. In case of using a vaginal screen having a number of seconds longer than 60 seconds, there is no solvent penetration but the cutting property is poor.
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|---|---|
| KR (1) | KR0139325B1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140188619A1 (en) * | 2012-12-28 | 2014-07-03 | Binuraj K. Ravindran | System and methods for rebroadcasting of radio ads over other mediums |
-
1995
- 1995-12-19 KR KR1019950051989A patent/KR0139325B1/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20140188619A1 (en) * | 2012-12-28 | 2014-07-03 | Binuraj K. Ravindran | System and methods for rebroadcasting of radio ads over other mediums |
| US9633374B2 (en) * | 2012-12-28 | 2017-04-25 | Intel Corporation | System and methods for rebroadcasting of radio ads over other mediums |
Also Published As
| Publication number | Publication date |
|---|---|
| KR970033903A (en) | 1997-07-22 |
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