KR100365474B1 - 접착 필름 절단 장치 - Google Patents
접착 필름 절단 장치 Download PDFInfo
- Publication number
- KR100365474B1 KR100365474B1 KR1020010002068A KR20010002068A KR100365474B1 KR 100365474 B1 KR100365474 B1 KR 100365474B1 KR 1020010002068 A KR1020010002068 A KR 1020010002068A KR 20010002068 A KR20010002068 A KR 20010002068A KR 100365474 B1 KR100365474 B1 KR 100365474B1
- Authority
- KR
- South Korea
- Prior art keywords
- film
- cutting
- main body
- guide
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000005520 cutting process Methods 0.000 title claims abstract description 75
- 239000002313 adhesive film Substances 0.000 claims abstract description 22
- 238000004804 winding Methods 0.000 claims abstract description 9
- 230000006835 compression Effects 0.000 claims description 5
- 238000007906 compression Methods 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 238000000034 method Methods 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 abstract description 6
- 238000003825 pressing Methods 0.000 abstract description 4
- 239000002699 waste material Substances 0.000 abstract description 3
- 239000002390 adhesive tape Substances 0.000 description 9
- 230000002265 prevention Effects 0.000 description 4
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
Claims (6)
- 웨이퍼 마운터의 접착 필름 절단 장치에 있어서,본체(110)의 일측에 구비되는 필름 권취드럼(120)으로부터 이형지가 분리되어 공급되는 필름공급부(100)와, 본체(110)의 타측에 구비되어 회전시 전후진되며 공급된 필름(F)을 눌러 안치된 패키지(P)와 프레임을 동시에 부착시키는 본딩롤러부(300)와, 회전시 본체(110)의 상측에 밀착되어 노출된 손잡이의 회전에 따라 프레임에 부착된 필름을 컷팅시키는 필름컷팅부(400)를 포함하며;상기 본체(110)의 상측면 개방홀에 제공되며, 그 외측단에 직사각 형상으로 된 적어도 2개 이상의 멀티 패키지(P)를 안착시키도록 다수의 클램프(212)를 갖는 안치판(210)과;상기 본체(110)의 상면에 탈착가능하도록 핀(213) 고정되며, 내측에 상기 안치판(210)에 놓여진 멀티 패키지(P)를 수용하도록 사각형상의 홀(221)을 형성하고, 상기 패키지(P)의 상면과 동일평면을 유지하게 되는 판상의 각프레임(220)과;상기 본체(110)의 일측과 힌지(411) 결합되는 상기 필름컷팅부(400)의 회동체(410)에 구비되며, 회전시 안내수단(430)에 의해 상기 각프레임(220)에 접착된 필름(F)을 사각라인을 따라 컷팅시키는 컷팅기(440);를 더욱 포함하는 것을 특징으로 하는 웨이퍼 마운터의 접착 필름 절단 장치.
- 제 1 항에 있어서, 상기 컷팅기(440)는상면에 전후 한 쌍의 캠플로어(441)(442)를 갖는 고정블럭(443)과;상기 고정블럭(443)의 저면에 근접 제공되는 환봉형상의 이동축(444)과;상기 고정블럭(443)에 고정되어져 상기 이동축(444)을 상하로 슬라이드 안내하도록 안내홀(447)을 갖는 가이드브래킷(448)과;상기 이동축(444)의 하단부에 구비되며 일측면에 회전칼날(445)을 고정하는 연동블럭(446)과;일측단이 상기 가이드브래킷(448)의 저면에 지지되고 타측단이 상기 이동축(444)을 감싼 상태로 연동블럭(446)에 탄지되는 압축스프링(449)으로 이루어지는 것을 특징으로 하는 접착 필름 절단 장치.
- 제 1항 또는 제 2항에 있어서, 상기 안내수단(430)은저면에 상기 각프레임(220)의 상면을 따라 안내될 수 있도록 사각라인 형상의 캠플로어(441)(442) 안내용 안내홈(417)이 형성되고, 중심 위치에 내주면을 따라 안내레일(416)를 갖는 원형홀(415)이 형성되는 회동체(410)와;상면에 상기 원형홀(415)의 안내레일(416)에 결합되어 중심축과 연결된 상기 손잡이(424)의 회전에 따라 원운동하도록 복수개의 레일부재(421)를 가지며, 저면에 직선이동용 가이드(422)와 이에 결합되어 전후방 이송되는 블럭(423)이 구비된 회전판(420);상기 회전판(420)의 저부에서 블럭(423)과 연결된 상기 가이드브래킷(448)을 중심방향으로 당기도록 된 코일스프링(450);으로 이루어지는 것을 특징으로 하는 접착 필름 절단 장치.
- 제 2 항에 있어서,상기 회전칼날(445)의 수직한 컷팅날 중심이, 전후방으로 배치된 한 쌍의 상기 캠플로어(441)(442) 중간라인에 위치하도록 하는 것을 특징으로 하는 접착 필름 절단 장치.
- 제 4 항에 있어서,상기 회전칼날(445)의 날끝이, 필름 밀착상태에서의 회전시 파손이 방지되도록 라운딩 컷팅날로 형성되는 것을 특징으로 하는 접착 필름 절단 장치.
- 제 1항에 있어서,상기 컷팅기(440)가 상기 본체(110)에 제공된 필름컷팅부(400)의 양쪽으로 설치되어 필름(F)을 컷팅시키도록 하는 것을 특징으로 하는 접착 필름 절단 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010002068A KR100365474B1 (ko) | 2001-01-13 | 2001-01-13 | 접착 필름 절단 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020010002068A KR100365474B1 (ko) | 2001-01-13 | 2001-01-13 | 접착 필름 절단 장치 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2020010001255U Division KR200232107Y1 (ko) | 2001-01-17 | 2001-01-17 | 접착 필름 절단 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020060912A KR20020060912A (ko) | 2002-07-19 |
KR100365474B1 true KR100365474B1 (ko) | 2002-12-26 |
Family
ID=27691655
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020010002068A Expired - Lifetime KR100365474B1 (ko) | 2001-01-13 | 2001-01-13 | 접착 필름 절단 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100365474B1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101431206B1 (ko) * | 2014-05-19 | 2014-08-19 | 제너셈(주) | 필름 커팅장치 |
WO2022097882A1 (ko) * | 2020-11-06 | 2022-05-12 | ㈜토니텍 | 반도체 패키지용 마운터 커팅장치 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2006101379A2 (en) * | 2005-03-25 | 2006-09-28 | Bong Ryeol Cha | A tapying machine of head unit |
KR100888774B1 (ko) * | 2008-12-22 | 2009-03-16 | 이준구 | 앨범의 삼면 동시 절단장치 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63137449A (ja) * | 1986-11-28 | 1988-06-09 | Fujitsu Ltd | 半導体ウエハマウンタ装置の製造方法 |
JPH01143211A (ja) * | 1987-11-27 | 1989-06-05 | Takatori Haitetsuku:Kk | ウエハーに対する保護テープの貼付け切り抜き方法および装置 |
KR19980039723A (ko) * | 1996-11-28 | 1998-08-17 | 황인길 | 반도체패키지용 웨이퍼 마운팅 시스템의 스테이션 |
KR19990054213A (ko) * | 1997-12-26 | 1999-07-15 | 윤종용 | 웨이퍼 테이프 마운팅 장치 |
KR20000007629U (ko) * | 1998-10-02 | 2000-05-06 | 김영환 | 테이프 마운터 |
-
2001
- 2001-01-13 KR KR1020010002068A patent/KR100365474B1/ko not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63137449A (ja) * | 1986-11-28 | 1988-06-09 | Fujitsu Ltd | 半導体ウエハマウンタ装置の製造方法 |
JPH01143211A (ja) * | 1987-11-27 | 1989-06-05 | Takatori Haitetsuku:Kk | ウエハーに対する保護テープの貼付け切り抜き方法および装置 |
KR19980039723A (ko) * | 1996-11-28 | 1998-08-17 | 황인길 | 반도체패키지용 웨이퍼 마운팅 시스템의 스테이션 |
KR19990054213A (ko) * | 1997-12-26 | 1999-07-15 | 윤종용 | 웨이퍼 테이프 마운팅 장치 |
KR20000007629U (ko) * | 1998-10-02 | 2000-05-06 | 김영환 | 테이프 마운터 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101431206B1 (ko) * | 2014-05-19 | 2014-08-19 | 제너셈(주) | 필름 커팅장치 |
WO2022097882A1 (ko) * | 2020-11-06 | 2022-05-12 | ㈜토니텍 | 반도체 패키지용 마운터 커팅장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20020060912A (ko) | 2002-07-19 |
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