KR100350724B1 - 필름캐리어및이것을사용한필름캐리어디바이스 - Google Patents
필름캐리어및이것을사용한필름캐리어디바이스 Download PDFInfo
- Publication number
- KR100350724B1 KR100350724B1 KR1019980035086A KR19980035086A KR100350724B1 KR 100350724 B1 KR100350724 B1 KR 100350724B1 KR 1019980035086 A KR1019980035086 A KR 1019980035086A KR 19980035086 A KR19980035086 A KR 19980035086A KR 100350724 B1 KR100350724 B1 KR 100350724B1
- Authority
- KR
- South Korea
- Prior art keywords
- film carrier
- film
- overcoat agent
- polyol
- molecular weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000010408 film Substances 0.000 claims abstract description 86
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 36
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 10
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 5
- 239000010409 thin film Substances 0.000 claims abstract description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 11
- 229920005862 polyol Polymers 0.000 claims description 10
- 150000003077 polyols Chemical class 0.000 claims description 10
- 239000005062 Polybutadiene Substances 0.000 claims description 9
- 229920002857 polybutadiene Polymers 0.000 claims description 9
- 239000012948 isocyanate Substances 0.000 claims description 6
- 150000002513 isocyanates Chemical class 0.000 claims description 6
- 229920005906 polyester polyol Polymers 0.000 claims description 3
- 239000004615 ingredient Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 239000011347 resin Substances 0.000 abstract description 16
- 229920005989 resin Polymers 0.000 abstract description 16
- 238000005452 bending Methods 0.000 abstract description 14
- 238000007789 sealing Methods 0.000 abstract description 10
- 229920001721 polyimide Polymers 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000004593 Epoxy Substances 0.000 description 9
- 239000004642 Polyimide Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 230000007547 defect Effects 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 238000004132 cross linking Methods 0.000 description 6
- 238000007747 plating Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000009719 polyimide resin Substances 0.000 description 4
- 238000011160 research Methods 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Abstract
Description
Claims (5)
- 절연성필름과 그 위에 금속박막에 의해 형성된 패턴을 가지고, 접어굽힘부의 절연성필름의 일부 또는 전부가 제거되어 있는 액정구동용의 필름캐리어에 있어서, 접어굽힘부를 포함하는 접속부이외의 배선패턴쪽에 우레탄수지를 주성분으로 하는 오버코트제를 도포한 것을 특징으로 하는 필름캐리어.
- 제 1항 기재의 필름캐리어를 사용한 것을 특징으로 하는 필름캐리어디바이스.
- 제 1항에 있어서, 상기 오버코트제가,(A) 수평균분자량이 1000∼8000이고, 1분자당 2∼10개의 수산기를 가진 폴리부타디엔폴리올,(B) 수평균분자량이 13000∼30000이고, 1분자당 2∼10개의 수산기를 가진 폴리에스테르폴리올 및(C) 수평균분자량이 1000∼8000이고, 1분자당 2∼10개의 수산기를 가진 폴리부타디엔폴리블록이소시아네이트를 필수성분으로써 함유하는 것을 특징으로 하는 필름캐리어.
- 제 3 항에 있어서, 상기 폴리올의 중량비가 고형분에 있어서 (A):(B)=40:60∼90:10이고, 폴리블록이소시아네이트(C)의 양이 폴리올의 총수산기당량에 대하여 0.8∼3.5당량 함유하는 것을 특징으로 하는 필름캐리어.
- 제 3항 또는 제 4항 기재의 필름캐리어를 사용한 것을 특징으로 하는 필름캐리어디바이스.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP97-249412 | 1997-08-29 | ||
JP24941297A JP3483238B2 (ja) | 1997-08-29 | 1997-08-29 | フィルムキャリアおよびこれを用いたフィルムキャリアデバイス |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990023968A KR19990023968A (ko) | 1999-03-25 |
KR100350724B1 true KR100350724B1 (ko) | 2002-11-18 |
Family
ID=17192597
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980035086A Expired - Fee Related KR100350724B1 (ko) | 1997-08-29 | 1998-08-28 | 필름캐리어및이것을사용한필름캐리어디바이스 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3483238B2 (ko) |
KR (1) | KR100350724B1 (ko) |
TW (1) | TW380291B (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60022874T2 (de) * | 1999-04-22 | 2006-07-13 | Ajinomoto Co., Inc. | Härtbare harzzusammensetzung und flexibles beschichtungsmaterial für stromkreis das diese zusammensetzung beinhaltet |
JP2001059071A (ja) * | 1999-08-23 | 2001-03-06 | Mitsui Mining & Smelting Co Ltd | ソルダーレジスト塗布液 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06177283A (ja) * | 1992-12-03 | 1994-06-24 | Nec Corp | 樹脂封止型半導体装置 |
-
1997
- 1997-08-29 JP JP24941297A patent/JP3483238B2/ja not_active Expired - Fee Related
-
1998
- 1998-07-28 TW TW087112294A patent/TW380291B/zh not_active IP Right Cessation
- 1998-08-28 KR KR1019980035086A patent/KR100350724B1/ko not_active Expired - Fee Related
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06177283A (ja) * | 1992-12-03 | 1994-06-24 | Nec Corp | 樹脂封止型半導体装置 |
Also Published As
Publication number | Publication date |
---|---|
JP3483238B2 (ja) | 2004-01-06 |
KR19990023968A (ko) | 1999-03-25 |
JPH1174317A (ja) | 1999-03-16 |
TW380291B (en) | 2000-01-21 |
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