KR100297371B1 - 반도체 공정 데이터 통합 관리 방법 - Google Patents
반도체 공정 데이터 통합 관리 방법 Download PDFInfo
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- KR100297371B1 KR100297371B1 KR1019980002895A KR19980002895A KR100297371B1 KR 100297371 B1 KR100297371 B1 KR 100297371B1 KR 1019980002895 A KR1019980002895 A KR 1019980002895A KR 19980002895 A KR19980002895 A KR 19980002895A KR 100297371 B1 KR100297371 B1 KR 100297371B1
- Authority
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- South Korea
- Prior art keywords
- data
- semiconductor
- integrated management
- management system
- production line
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F11/00—Error detection; Error correction; Monitoring
- G06F11/07—Responding to the occurrence of a fault, e.g. fault tolerance
- G06F11/08—Error detection or correction by redundancy in data representation, e.g. by using checking codes
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41845—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by system universality, reconfigurability, modularity
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31427—Production, CAPM computer aided production management
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Quality & Reliability (AREA)
- Theoretical Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Factory Administration (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Description
Claims (3)
- 상호 온라인 연결된 2 개 이상의 반도체 생산라인에 상기 반도체 생산라인의 특성에 따라서, 상기 각각의 반도체 생산라인에서 발생한 데이터를 복합적으로 처리할 수 있는 통합관리모듈이 설치되어 있는 복수의 통합 관리시스템을 구축하는 단계와; 상기 복수의 통합관리시스템들 중 어느 하나에 작업자의 컴퓨터를 로그 온 시키는 단계와; 상기 작업자의 컴퓨터가 로그 온 된 상기 통합관리시스템으로부터 상기 작업자 컴퓨터로 작업 환경 구축 데이터를 다운로드 하는 단계와; 다운로드 된 상기 작업 환경 구축 데이터에 의하여 상기 사용자 컴퓨터의 작업 환경을 상기 로그 온 된 통합관리시스템의 작업 환경과 동일하도록 새로 구축하는 단계와; 상기 새로 구축된 사용자 컴퓨터 환경에 의하여 작업을 수행하는 단계를 포함하는 반도체 공정 데이터 통합 관리 방법.
- 제1항에 있어서, 상기 로그 온 단계는 상기 작업자의 아이디를 확인하고, 상기 작업자의 권한을 확인하고, 작업을 수행할 반도체 생산라인을 선택하는 단계를 포함하는 반도체 공정 데이터 통합 관리 방법.
- 제2항에 있어서, 상기 새로 구축된 사용자 컴퓨터 환경에 의하여 작업을 수행하는 단계는 원하는 작업을 선택하여 진행하는 단계와; 다른 작업이 존재하는가를 판단하여 다른 작업이 존재하면 상기 다른 작업을 선택하여 진행하고, 어떠한 작업도 존재하지 않을 경우 상기 반도체 생산라인들 중 다른 하나의 통합 관리시스템에 로그 온 할 것인가를 판단하는 단계와; 로그 온 할 것으로 판단하면, 로그 온 하여 상기 다른 통합 관리시스템의 작업환경과 상기 사용자 컴퓨터의 작업 환경을 동일하게 구축하는 단계를 포함하는 반도체 공정 데이터 통합 관리 방법.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980002895A KR100297371B1 (ko) | 1998-02-03 | 1998-02-03 | 반도체 공정 데이터 통합 관리 방법 |
TW087110464A TW373147B (en) | 1998-02-03 | 1998-06-29 | Integrated management for semiconductor process data |
US09/135,652 US6240331B1 (en) | 1998-02-03 | 1998-08-18 | Integrated management of semiconductor process data |
CNB981184618A CN1135491C (zh) | 1998-02-03 | 1998-08-19 | 集成管理半导体加工数据的方法 |
JP23696798A JP3370281B2 (ja) | 1998-02-03 | 1998-08-24 | 半導体工程データ統合管理方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019980002895A KR100297371B1 (ko) | 1998-02-03 | 1998-02-03 | 반도체 공정 데이터 통합 관리 방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR19990068948A KR19990068948A (ko) | 1999-09-06 |
KR100297371B1 true KR100297371B1 (ko) | 2001-10-25 |
Family
ID=19532382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019980002895A KR100297371B1 (ko) | 1998-02-03 | 1998-02-03 | 반도체 공정 데이터 통합 관리 방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US6240331B1 (ko) |
JP (1) | JP3370281B2 (ko) |
KR (1) | KR100297371B1 (ko) |
CN (1) | CN1135491C (ko) |
TW (1) | TW373147B (ko) |
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US6349341B1 (en) * | 1998-07-30 | 2002-02-19 | Advanced Micro Devices, Inc. | Method and system for providing inter-tier application control in a multi-tiered computing environment |
JP2000176799A (ja) * | 1998-12-08 | 2000-06-27 | Toshiba Corp | 生産製造計画システム |
US7069101B1 (en) | 1999-07-29 | 2006-06-27 | Applied Materials, Inc. | Computer integrated manufacturing techniques |
US6640151B1 (en) | 1999-12-22 | 2003-10-28 | Applied Materials, Inc. | Multi-tool control system, method and medium |
AU2001259151A1 (en) * | 2000-04-25 | 2001-11-07 | Pri Automation, Inc. | Reticle management system |
US6952656B1 (en) * | 2000-04-28 | 2005-10-04 | Applied Materials, Inc. | Wafer fabrication data acquisition and management systems |
US6708074B1 (en) * | 2000-08-11 | 2004-03-16 | Applied Materials, Inc. | Generic interface builder |
US7188142B2 (en) | 2000-11-30 | 2007-03-06 | Applied Materials, Inc. | Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility |
US20020152046A1 (en) * | 2001-04-13 | 2002-10-17 | Velichko Sergey A. | Concurrent control of semiconductor parametric testing |
US7337088B2 (en) * | 2001-05-23 | 2008-02-26 | Micron Technology, Inc. | Intelligent measurement modular semiconductor parametric test system |
US7698012B2 (en) | 2001-06-19 | 2010-04-13 | Applied Materials, Inc. | Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing |
US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
US7201936B2 (en) | 2001-06-19 | 2007-04-10 | Applied Materials, Inc. | Method of feedback control of sub-atmospheric chemical vapor deposition processes |
US7082345B2 (en) * | 2001-06-19 | 2006-07-25 | Applied Materials, Inc. | Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities |
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US6721618B2 (en) * | 2001-06-29 | 2004-04-13 | Miracom, Inc. | System and method for automatically generating semiconductor equipment communication standard (SECS) message source in SECS communication |
US7337019B2 (en) * | 2001-07-16 | 2008-02-26 | Applied Materials, Inc. | Integration of fault detection with run-to-run control |
US6984198B2 (en) | 2001-08-14 | 2006-01-10 | Applied Materials, Inc. | Experiment management system, method and medium |
CN1319115C (zh) * | 2001-10-01 | 2007-05-30 | 株式会社半导体能源研究所 | 组合产品的制造系统和制造方法 |
US7225047B2 (en) | 2002-03-19 | 2007-05-29 | Applied Materials, Inc. | Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements |
US20030199112A1 (en) | 2002-03-22 | 2003-10-23 | Applied Materials, Inc. | Copper wiring module control |
US7162386B2 (en) * | 2002-04-25 | 2007-01-09 | Micron Technology, Inc. | Dynamically adaptable semiconductor parametric testing |
JP2005535130A (ja) | 2002-08-01 | 2005-11-17 | アプライド マテリアルズ インコーポレイテッド | 最新のプロセス制御システム内で誤って表された計測データを取り扱う方法、システム、および媒体 |
US20040063224A1 (en) * | 2002-09-18 | 2004-04-01 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing process for multi-layered films |
US7272459B2 (en) | 2002-11-15 | 2007-09-18 | Applied Materials, Inc. | Method, system and medium for controlling manufacture process having multivariate input parameters |
US7333871B2 (en) | 2003-01-21 | 2008-02-19 | Applied Materials, Inc. | Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools |
US7010451B2 (en) * | 2003-04-17 | 2006-03-07 | Micron Technology, Inc. | Dynamic creation and modification of wafer test maps during wafer testing |
US7205228B2 (en) | 2003-06-03 | 2007-04-17 | Applied Materials, Inc. | Selective metal encapsulation schemes |
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-
1998
- 1998-02-03 KR KR1019980002895A patent/KR100297371B1/ko not_active IP Right Cessation
- 1998-06-29 TW TW087110464A patent/TW373147B/zh not_active IP Right Cessation
- 1998-08-18 US US09/135,652 patent/US6240331B1/en not_active Expired - Lifetime
- 1998-08-19 CN CNB981184618A patent/CN1135491C/zh not_active Expired - Fee Related
- 1998-08-24 JP JP23696798A patent/JP3370281B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH11238658A (ja) | 1999-08-31 |
JP3370281B2 (ja) | 2003-01-27 |
CN1225466A (zh) | 1999-08-11 |
US6240331B1 (en) | 2001-05-29 |
TW373147B (en) | 1999-11-01 |
KR19990068948A (ko) | 1999-09-06 |
CN1135491C (zh) | 2004-01-21 |
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