KR0175408B1 - 액정표시장치용 박막 트랜지스터 기판의 제조방법 - Google Patents
액정표시장치용 박막 트랜지스터 기판의 제조방법 Download PDFInfo
- Publication number
- KR0175408B1 KR0175408B1 KR1019950035800A KR19950035800A KR0175408B1 KR 0175408 B1 KR0175408 B1 KR 0175408B1 KR 1019950035800 A KR1019950035800 A KR 1019950035800A KR 19950035800 A KR19950035800 A KR 19950035800A KR 0175408 B1 KR0175408 B1 KR 0175408B1
- Authority
- KR
- South Korea
- Prior art keywords
- oxide film
- thermal oxide
- film
- ion implantation
- liquid crystal
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000010408 film Substances 0.000 claims abstract description 67
- 238000005468 ion implantation Methods 0.000 claims abstract description 29
- 239000010409 thin film Substances 0.000 claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 24
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 23
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims description 11
- 150000002500 ions Chemical class 0.000 claims description 8
- 238000000151 deposition Methods 0.000 claims description 7
- 238000000059 patterning Methods 0.000 claims description 7
- 125000006850 spacer group Chemical group 0.000 claims description 7
- 238000001312 dry etching Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 230000001590 oxidative effect Effects 0.000 claims 1
- 239000012535 impurity Substances 0.000 abstract description 7
- 229920005591 polysilicon Polymers 0.000 description 5
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
- H10D30/6713—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes
- H10D30/6715—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device characterised by the properties of the source or drain regions, e.g. compositions or sectional shapes characterised by the doping profiles, e.g. having lightly-doped source or drain extensions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/031—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT]
- H10D30/0312—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes
- H10D30/0314—Manufacture or treatment of FETs having insulated gates [IGFET] of thin-film transistors [TFT] characterised by the gate electrodes of lateral top-gate TFTs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
- H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
- H10D30/6739—Conductor-insulator-semiconductor electrodes
Landscapes
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
Abstract
Description
Claims (5)
- 기판 위에 액티브층인 다결정 실리콘막을 증착하는 단계, 상기 다결정 산화막 위에 CVD 산화막을 증착하는 단계, 열산화하여 하층 열산화막을 형성하는 단계, 상기 CVD 산화막 위에 절연막을 증착하는 단계, 상기 절연막 위에 열산화막을 형성하는 단계, 상기 상층 열산화막 위에 다결정 실리콘막을 적층한 다음 패터닝하여 게이트 전극을 형성하는 단계, 상기 게이트 전극 둘레에 열산화막을 형성하는 단계, 상기 열산화막을 마스크로하여 상기 CVD막의 일부가 드러나도록 상기 상층 열산화막과 상기 절연막을 패터닝하는 단계, 상기 액티브층에 이온 주입하여 저농도 이온 주입 영역을 형성하는 단계, 스페이서를 적층한 후 상기 CVD막의 일부가 드러나도록 패터닝하는 단계, 이온 주입하여 고농도 이온 주입 영역을 형성하는 단계, 상기 스페이서를 제거하는 단계를 포함하는 액정 표시 장치용 박막 트랜지스터 기판의 제조방법.
- 제1항에서, 상기 절연막 위에 상층 열산화막을 형성할 때 습식 분위기에서 형성하는 액정 표시 장치용 박막 트랜지스터 기판의 제조방법.
- 제1항에서, 상기 상층 열산화막 위에 다결정 실리콘막을 적층할 때 그 두께를 2000Å 내지 4000Å으로 하는 액정 표시 장치용 박막 트랜지스터 기판의 제조방법.
- 제1항에서, 상기 게이트 전극 둘레에 열산화막을 형성할 때 그 두께를 500Å 내지 700Å으로 형성하는 액정 표시 장치용 박막 트랜지스터 기판의 제조방법.
- 제1항에서, 상기 열산화막을 마스크로하여 상기 CVD 산화막의 일부가 드러나도록 패터닝 할 때 건식 식각으로 하는 액정 표시 장치용 박막 트랜지스터 기판의 제조방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950035800A KR0175408B1 (ko) | 1995-10-17 | 1995-10-17 | 액정표시장치용 박막 트랜지스터 기판의 제조방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950035800A KR0175408B1 (ko) | 1995-10-17 | 1995-10-17 | 액정표시장치용 박막 트랜지스터 기판의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970024305A KR970024305A (ko) | 1997-05-30 |
KR0175408B1 true KR0175408B1 (ko) | 1999-02-18 |
Family
ID=19430410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950035800A KR0175408B1 (ko) | 1995-10-17 | 1995-10-17 | 액정표시장치용 박막 트랜지스터 기판의 제조방법 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0175408B1 (ko) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7256060B2 (en) | 2004-11-12 | 2007-08-14 | Lg.Philips Lcd Co., Ltd. | Liquid crystal display device and method of fabricating the same |
US7396765B2 (en) | 2004-11-12 | 2008-07-08 | Lg Display Co., Ltd. | Method of fabricating a liquid crystal display device |
US7407842B2 (en) | 2004-11-12 | 2008-08-05 | Lg Display Co., Ltd. | Liquid crystal display device and method of fabricating the same |
US7414691B2 (en) | 2004-08-12 | 2008-08-19 | Lg Display Co., Ltd. | Liquid crystal display device with prevention of defective disconnection of drain/pixel electrodes by forming two conductive layers on top of entire pixel electrode and then removing a portion of both therefrom |
US7474362B2 (en) | 2004-12-22 | 2009-01-06 | Lg Display Co., Ltd. | Liquid crystal display device and method of fabricating the same |
US7492432B2 (en) | 2004-12-31 | 2009-02-17 | Lg Display Co., Ltd. | Liquid crystal display device and method of fabricating the same |
US7595859B2 (en) | 2004-12-31 | 2009-09-29 | Lg Display Co., Ltd. | Liquid crystal display device and method of fabricating the same |
US7632722B2 (en) | 2004-12-24 | 2009-12-15 | Lg Display Co., Ltd. | Liquid crystal display device and method of fabricating the same |
US7638801B2 (en) | 2004-08-13 | 2009-12-29 | Lg Display Co., Ltd. | Liquid crystal display device and fabrication method thereof |
US7830476B2 (en) | 2004-12-31 | 2010-11-09 | Lg Display Co., Ltd. | Electroluminescence display device comprising a drain electrode being directly contacted with the upper surface of the first transparent conductive layer and the side surface of the second conductive layer and fabricating methods thereof |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101048903B1 (ko) | 2004-08-26 | 2011-07-12 | 엘지디스플레이 주식회사 | 액정표시소자 및 그 제조방법 |
KR101073403B1 (ko) | 2004-09-09 | 2011-10-17 | 엘지디스플레이 주식회사 | 액정표시소자 및 그 제조방법 |
-
1995
- 1995-10-17 KR KR1019950035800A patent/KR0175408B1/ko not_active IP Right Cessation
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7414691B2 (en) | 2004-08-12 | 2008-08-19 | Lg Display Co., Ltd. | Liquid crystal display device with prevention of defective disconnection of drain/pixel electrodes by forming two conductive layers on top of entire pixel electrode and then removing a portion of both therefrom |
US7638801B2 (en) | 2004-08-13 | 2009-12-29 | Lg Display Co., Ltd. | Liquid crystal display device and fabrication method thereof |
US7927930B2 (en) | 2004-08-13 | 2011-04-19 | Lg Display Co., Ltd. | Method for fabricating a liquid crystal display device |
US7407842B2 (en) | 2004-11-12 | 2008-08-05 | Lg Display Co., Ltd. | Liquid crystal display device and method of fabricating the same |
US7396765B2 (en) | 2004-11-12 | 2008-07-08 | Lg Display Co., Ltd. | Method of fabricating a liquid crystal display device |
US7619286B2 (en) | 2004-11-12 | 2009-11-17 | Lg Display Co., Ltd. | Liquid crystal display device and method of fabricating the same |
US7256060B2 (en) | 2004-11-12 | 2007-08-14 | Lg.Philips Lcd Co., Ltd. | Liquid crystal display device and method of fabricating the same |
US7474362B2 (en) | 2004-12-22 | 2009-01-06 | Lg Display Co., Ltd. | Liquid crystal display device and method of fabricating the same |
US7632722B2 (en) | 2004-12-24 | 2009-12-15 | Lg Display Co., Ltd. | Liquid crystal display device and method of fabricating the same |
US7999267B2 (en) | 2004-12-24 | 2011-08-16 | Lg Display Co., Ltd. | Liquid crystal display device |
US7492432B2 (en) | 2004-12-31 | 2009-02-17 | Lg Display Co., Ltd. | Liquid crystal display device and method of fabricating the same |
US7595859B2 (en) | 2004-12-31 | 2009-09-29 | Lg Display Co., Ltd. | Liquid crystal display device and method of fabricating the same |
US7830476B2 (en) | 2004-12-31 | 2010-11-09 | Lg Display Co., Ltd. | Electroluminescence display device comprising a drain electrode being directly contacted with the upper surface of the first transparent conductive layer and the side surface of the second conductive layer and fabricating methods thereof |
Also Published As
Publication number | Publication date |
---|---|
KR970024305A (ko) | 1997-05-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5998841A (en) | Semiconductor device including active matrix circuit | |
US5323042A (en) | Active matrix liquid crystal display having a peripheral driving circuit element | |
KR0175408B1 (ko) | 액정표시장치용 박막 트랜지스터 기판의 제조방법 | |
KR0145899B1 (ko) | 완전 자기 정렬형 액정 표시 장치용 박막 트랜지스터 기판의 제조방법 | |
KR100288772B1 (ko) | 액정 표시 장치 및 그 제조 방법 | |
KR0175390B1 (ko) | 다결정 규소 박막 트랜지스터 및 그 제조 방법 | |
JP4038309B2 (ja) | 半導体装置の製造方法、アクティブマトリクス基板の製造方法 | |
US20010028058A1 (en) | Thin film transistor and a method of forming the same | |
KR100268895B1 (ko) | 박막트랜지스터 및 이의 제조방법 | |
JP2798537B2 (ja) | アクティブマトリクス基板の製造方法 | |
KR100306801B1 (ko) | 박막트랜지스터및그의제조방법 | |
JPH0864795A (ja) | 薄膜トランジスタ及びイメージセンサ | |
JP4510396B2 (ja) | 薄膜トランジスタの製造方法 | |
KR19980021815A (ko) | 액정표시장치 및 그 제조방법 | |
KR100308852B1 (ko) | 액정표시장치의트랜지스터제조방법 | |
KR970003742B1 (ko) | 자기정열구조의 박막트랜지스터 제조방법 | |
JP3466165B2 (ja) | Lddを有する薄膜トランジスタの製造方法 | |
KR0142784B1 (ko) | 박막트랜지스터 및 그 제조방법 | |
KR0175412B1 (ko) | 액정 표시 장치용 다결정 실리콘 박막 트랜지스터 기판의 제조 방법 | |
KR100323080B1 (ko) | 박막 트랜지스터 및 그 제조방법 | |
KR0172880B1 (ko) | 액정표시장치의 제조방법 | |
KR960012586B1 (ko) | 박막 트랜지스터의 제조방법 | |
JP2003131590A (ja) | 平面表示装置およびその製造方法 | |
KR20040089295A (ko) | 엘디디구조를 가진 박막 트랜지스터 제조 방법 | |
KR20050077049A (ko) | 박막 트랜지스터의 형성 방법 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19951017 |
|
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19951017 Comment text: Request for Examination of Application |
|
PG1501 | Laying open of application | ||
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 19980928 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 19981110 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 19981110 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
PR1001 | Payment of annual fee |
Payment date: 20011008 Start annual number: 4 End annual number: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20021007 Start annual number: 5 End annual number: 5 |
|
PR1001 | Payment of annual fee |
Payment date: 20031008 Start annual number: 6 End annual number: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20041008 Start annual number: 7 End annual number: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20051007 Start annual number: 8 End annual number: 8 |
|
PR1001 | Payment of annual fee |
Payment date: 20061030 Start annual number: 9 End annual number: 9 |
|
FPAY | Annual fee payment |
Payment date: 20071029 Year of fee payment: 10 |
|
PR1001 | Payment of annual fee |
Payment date: 20071029 Start annual number: 10 End annual number: 10 |
|
LAPS | Lapse due to unpaid annual fee | ||
PC1903 | Unpaid annual fee |
Termination category: Default of registration fee Termination date: 20091010 |