KR0166977B1 - 섬유 강화 플라스틱용 에폭시 수지 조성물 - Google Patents
섬유 강화 플라스틱용 에폭시 수지 조성물 Download PDFInfo
- Publication number
- KR0166977B1 KR0166977B1 KR1019910000167A KR910000167A KR0166977B1 KR 0166977 B1 KR0166977 B1 KR 0166977B1 KR 1019910000167 A KR1019910000167 A KR 1019910000167A KR 910000167 A KR910000167 A KR 910000167A KR 0166977 B1 KR0166977 B1 KR 0166977B1
- Authority
- KR
- South Korea
- Prior art keywords
- component
- resin composition
- weight
- parts
- epoxy
- Prior art date
Links
- YRKRNZMULKLCJF-UHFFFAOYSA-N C(C1CC1)Oc1ccccc1 Chemical compound C(C1CC1)Oc1ccccc1 YRKRNZMULKLCJF-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N C(C1OC1)Oc1ccccc1 Chemical compound C(C1OC1)Oc1ccccc1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 0 C*C(CCC=C1)(CC1OCC1CC1)N Chemical compound C*C(CCC=C1)(CC1OCC1CC1)N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
- C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
- C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Reinforced Plastic Materials (AREA)
Abstract
Description
Claims (7)
- 필수 성분으로서 하기 성분들: A: 250 이하의 에폭시 당량을 갖고 실온에서 액체인 비스페놀 A형 에폭시 화합물, B: 1,000 이하의 에폭시 당량 및 100℃ 이하의 연화점을 갖고 실온에서 고체인 비스페놀 A형 에폭시 화합물, C: 1,100 이상의 에폭시 당량 및 110℃ 이상의 연화점을 갖고 실온에서 고체인 비스페놀 A형 에폭시 화합물, D: 페놀 노볼락 형 에폭시 화합물, E: 니트릴 고무, 및 F: 경화제를 성분 A 100 중량부에 대해 성분 B는 5~40 중량부, 성분 C는 5~40 중량부, 성분 D는 50~140 중량부, 성분 E는 1~8 중량부로, 또한 전체 수지 조성물 100 중량부에 대해 F는 0.5~10 중량부인 양으로 함유하고, 40℃에서 10,000 포이즈 이상의 점도 및 80℃에서 200 포이즈 이하의 점도를 갖는 섬유 강화 플라스틱용 에폭시 수지 조성물.
- 제1항에 있어서, 성분 A의 에폭시 당량이 180~200임을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, 성분 B의 에폭시 당량이 400~1,000임을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, 성분 B의 연화점이 60~100℃임을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, 성분 C의 에폭시 당량이 1,100~5,000임을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, 성분 C의 연화점이 110~200℃임을 특징으로 하는 에폭시 수지 조성물.
- 제1항에 있어서, 성분 E의 평균 분자량이 10,000 이상임을 특징으로 하는 에폭시 수지 조성물.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1174/90 | 1990-01-08 | ||
JP2001174A JPH03205420A (ja) | 1990-01-08 | 1990-01-08 | 繊維強化プラスチック用エポキシ樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR910021444A KR910021444A (ko) | 1991-12-20 |
KR0166977B1 true KR0166977B1 (ko) | 1999-03-20 |
Family
ID=11494075
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019910000167A KR0166977B1 (ko) | 1990-01-08 | 1991-01-08 | 섬유 강화 플라스틱용 에폭시 수지 조성물 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5302666A (ko) |
EP (1) | EP0436944B1 (ko) |
JP (1) | JPH03205420A (ko) |
KR (1) | KR0166977B1 (ko) |
DE (1) | DE69022966T2 (ko) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0545640A1 (en) * | 1991-11-29 | 1993-06-09 | Tonen Corporation | Epoxy resin composition, prepreg containing same and process for the producing of prepreg using same |
GB9411367D0 (en) | 1994-06-07 | 1994-07-27 | Ici Composites Inc | Curable Composites |
US5976699A (en) * | 1995-11-09 | 1999-11-02 | Sumitomo Bakelite Company Limited | Insulating adhesive for multilayer printed circuit board |
KR100576767B1 (ko) * | 1998-05-20 | 2006-05-09 | 사이텍 테크놀러지 코포레이션 | 무공극 라미네이트의 제조방법 및 이의 용도 |
KR100648906B1 (ko) * | 1999-02-22 | 2006-11-24 | 도레이 가부시끼가이샤 | 섬유강화 고무재료 |
US6322848B1 (en) * | 1999-10-26 | 2001-11-27 | Lord Corporation | Flexible epoxy encapsulating material |
US20050026069A1 (en) * | 2003-07-31 | 2005-02-03 | Todd Yeh | Solventless thermosetting photosensitive via-filling material |
JP4553595B2 (ja) * | 2004-01-29 | 2010-09-29 | 株式会社有沢製作所 | プリプレグ用樹脂組成物およびこれを用いたプリプレグ |
DE102005026191A1 (de) * | 2005-06-06 | 2006-12-07 | Tesa Ag | Hitze-aktivierbare Folien zur Fixierung von Metallteilen auf Kunststoffen |
CN101501132A (zh) * | 2006-06-30 | 2009-08-05 | 东丽株式会社 | 环氧树脂组合物、预浸料及纤维增强复合材料 |
JP5150381B2 (ja) * | 2008-06-20 | 2013-02-20 | 太陽ホールディングス株式会社 | 熱硬化性樹脂組成物 |
DE102013201958A1 (de) * | 2013-02-06 | 2014-08-07 | Vacuumschmelze Gmbh & Co. Kg | Zusammensetzung für eine Klebstoffmasse |
GB2515323A (en) * | 2013-06-19 | 2014-12-24 | Hexcel Composites Ltd | Improvements in or relating to epoxy resin formulations |
US9453129B2 (en) | 2014-06-23 | 2016-09-27 | Ut-Battelle, Llc | Polymer blend compositions and methods of preparation |
US9815985B2 (en) | 2015-07-14 | 2017-11-14 | Ut-Battelle, Llc | High performance lignin-acrylonitrile polymer blend materials |
KR101714191B1 (ko) * | 2015-08-12 | 2017-03-08 | 현대자동차주식회사 | 고강성 및 고충격 폴리페닐렌 에테르 난연 수지 조성물 |
US11124652B2 (en) | 2017-06-21 | 2021-09-21 | Ut-Battelle, Llc | Shape memory polymer blend materials |
CN109762302A (zh) * | 2019-02-15 | 2019-05-17 | 无锡市立帆绝缘材料科技有限公司 | 用于玻璃网格布的预浸料及其制备方法 |
CN111944274A (zh) * | 2020-08-05 | 2020-11-17 | 华烁科技股份有限公司 | 线路板用可弯曲半固化片浸胶液、半固化片及其制备方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3894113A (en) * | 1966-09-15 | 1975-07-08 | Minnesota Mining & Mfg | Bonding film |
US3707583A (en) * | 1971-06-04 | 1972-12-26 | Minnesota Mining & Mfg | Adhesive |
US3948849A (en) * | 1974-11-01 | 1976-04-06 | Gulf Research & Development Company | Adhesive compositions |
US4040993A (en) * | 1976-02-25 | 1977-08-09 | Westinghouse Electric Corporation | Low dissipation factor electrostatic epoxy wire coating powder |
EP0032062B2 (en) * | 1979-12-27 | 1991-10-16 | Mitsui Petrochemical Industries, Ltd. | High-molecular-weight novolak substituted phenolic resins and their preparation |
JPS58183723A (ja) * | 1982-04-21 | 1983-10-27 | Toho Rayon Co Ltd | エポキシ樹脂組成物 |
JPS6143615A (ja) * | 1984-08-07 | 1986-03-03 | Mitsui Petrochem Ind Ltd | エポキシ樹脂組成物 |
JPS6340517A (ja) * | 1986-08-07 | 1988-02-20 | 松下電器産業株式会社 | 電気調理器 |
JPS63170228A (ja) * | 1987-01-08 | 1988-07-14 | Toshiba Mach Co Ltd | ガラスレンズのプレス成形装置 |
US5143950A (en) * | 1987-02-07 | 1992-09-01 | Somar Corporation | Power coating of epoxy resin mixture and polyvinyl butyral or formal resin |
JPS63308026A (ja) * | 1987-06-09 | 1988-12-15 | Mitsubishi Kasei Corp | 繊維強化プラスチック用樹脂組成物 |
US4798761A (en) * | 1987-11-03 | 1989-01-17 | The Dow Chemical Company | Epoxy resin compositions for use in low temperature curing applications |
JPH01185351A (ja) * | 1988-01-18 | 1989-07-24 | Nissan Motor Co Ltd | 炭素繊維強化材用エポキシ樹脂組成物 |
JP2650302B2 (ja) * | 1988-02-23 | 1997-09-03 | 三菱化学株式会社 | 繊維強化プラスチック用樹脂組成物 |
JPH0717734B2 (ja) * | 1988-07-08 | 1995-03-01 | 三菱化学株式会社 | 繊維強化プラスチック用樹脂組成物 |
-
1990
- 1990-01-08 JP JP2001174A patent/JPH03205420A/ja active Pending
- 1990-12-28 EP EP90125692A patent/EP0436944B1/en not_active Expired - Lifetime
- 1990-12-28 DE DE69022966T patent/DE69022966T2/de not_active Expired - Fee Related
-
1991
- 1991-01-04 US US07/637,624 patent/US5302666A/en not_active Expired - Fee Related
- 1991-01-08 KR KR1019910000167A patent/KR0166977B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP0436944A2 (en) | 1991-07-17 |
EP0436944B1 (en) | 1995-10-11 |
KR910021444A (ko) | 1991-12-20 |
DE69022966D1 (de) | 1995-11-16 |
DE69022966T2 (de) | 1996-06-20 |
JPH03205420A (ja) | 1991-09-06 |
EP0436944A3 (en) | 1992-04-22 |
US5302666A (en) | 1994-04-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR0166977B1 (ko) | 섬유 강화 플라스틱용 에폭시 수지 조성물 | |
KR100623457B1 (ko) | 섬유강화 복합재료용 수지 조성물, 프리프레그 및 섬유강화 복합재료 | |
JPH0639519B2 (ja) | エポキシ樹脂組成物及びプリプレグ | |
JP4986627B2 (ja) | 耐熱複合材料 | |
JPH0365812B2 (ko) | ||
JPS621717A (ja) | エポキシ樹脂組成物 | |
JP2604778B2 (ja) | マトリックス樹脂組成物 | |
JPS5817535B2 (ja) | 炭素繊維強化用エポキシ樹脂組成物 | |
JPH11279261A (ja) | 繊維強化複合材料用耐熱性エポキシ樹脂組成物 | |
US5128425A (en) | Epoxy resin composition for use in carbon fiber reinforced plastics, containing amine or amide based fortifiers | |
JPS6236421A (ja) | プリプレグ用エポキシ樹脂組成物 | |
JP2003055534A (ja) | 複合材料用樹脂組成物、複合材料用中間材および複合材料 | |
JP5017794B2 (ja) | 繊維強化複合材料用エポキシ樹脂組成物 | |
JPH0643508B2 (ja) | プリプレグ及びその製造方法 | |
JPS621720A (ja) | エポキシ樹脂組成物 | |
JPH0717734B2 (ja) | 繊維強化プラスチック用樹脂組成物 | |
JPH0776616A (ja) | プリプレグ用エポキシ樹脂組成物およびプリプレグ | |
JPS6360056B2 (ko) | ||
JPS6338049B2 (ko) | ||
JP2006291094A (ja) | 繊維強化複合材料用エポキシ樹脂組成物 | |
JPS621721A (ja) | エポキシ樹脂組成物 | |
JP2650302B2 (ja) | 繊維強化プラスチック用樹脂組成物 | |
JPH07278265A (ja) | トウプリプレグ用エポキシ樹脂組成物 | |
JPH0820654A (ja) | エポキシ樹脂組成物及びそれを用いたプリプレグ | |
JPS63221139A (ja) | プリプレグ及びその製造法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 19910108 |
|
PG1501 | Laying open of application | ||
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 19950912 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 19910108 Comment text: Patent Application |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 19980427 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 19980822 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 19980925 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 19980925 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
G170 | Re-publication after modification of scope of protection [patent] | ||
PG1701 | Publication of correction |
Patent event code: PG17011E01I Patent event date: 19990528 Comment text: Request for Publication of Correction Publication date: 19990701 |
|
LAPS | Lapse due to unpaid annual fee | ||
PC1903 | Unpaid annual fee |
Termination category: Default of registration fee Termination date: 20020611 |