KR0139039B1 - 노광장치와 이것을 이용한 디바이스 제조방법 - Google Patents
노광장치와 이것을 이용한 디바이스 제조방법Info
- Publication number
- KR0139039B1 KR0139039B1 KR1019940015097A KR19940015097A KR0139039B1 KR 0139039 B1 KR0139039 B1 KR 0139039B1 KR 1019940015097 A KR1019940015097 A KR 1019940015097A KR 19940015097 A KR19940015097 A KR 19940015097A KR 0139039 B1 KR0139039 B1 KR 0139039B1
- Authority
- KR
- South Korea
- Prior art keywords
- stage
- substrate
- wafer
- pattern
- scanning
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title description 9
- 238000005259 measurement Methods 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 238000012546 transfer Methods 0.000 claims abstract description 17
- 238000012937 correction Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 38
- 238000001514 detection method Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 104
- 230000008569 process Effects 0.000 description 20
- 230000008859 change Effects 0.000 description 16
- 230000003287 optical effect Effects 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 230000001133 acceleration Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000012938 design process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000013518 transcription Methods 0.000 description 1
- 230000035897 transcription Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
- G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
Description
Claims (11)
- 원판의 패턴의 일부를 기판상에 투영하고, 이 원판 및 기판을 동기주사시켜서, 원판의 패턴을 기판에 전사하는 노광장치에 있어서,한쪽이 원판을, 다른 쪽이 기판을 주사이동시키기 위한 제 1 및 제 2스테이지와, 상기 주사이동의 방향이외의 소정의 방향에 있어서의 상기 제 1스테이지의 일탈을 계측하기 위한 계측수단과,상기 계측수단에 의한 계측결과에 의거해서 상기 제 1 스테이지의 일탈의 영향을 경감시키기 위한 보정수단을 구비한 것을 특징으로 하는 노광장치.
- 제 1 항에 있어서,상기 보정수단은 상기 계측수단에 의한 계측결과에 의가헤사 상기 제 2스테이지의 이동을 조정하는 것임을 특징으로 하는 노광장치.
- 제 1항에 있어서,상기 계측수단은 레이저간섭계를 구비한 것을 특징으로 하는 노광장치.
- 제 1항에 있어서,상기 소정의 방향은 주사이동의 방향에 대해서 수직인 방향인 것을 특징으로 하는 노광장치.
- 제 1항에 있어서,상기 소정의 방향은 원판 또는 기판에 대해서 수직인 축을 중심으로 하는 회전방향인 것을 특징으로 하는 노광장치.
- 제 1항에 있어서,원판의 패턴을 기판에 축소투영해서, 이들 축소된 패턴을 기판의 상이한 영역에 인쇄하는 수단을 또 구비한 것을 특징으로 하는 노광장치.
- 원판의 패턴의 일부를 기판상에 투영하고, 이 원판 및 기판을 동기주사시켜서, 원판의 패턴을 기판에 전사하는 노광장치에 있어서,원판 및 기판중 한쪽을 주사이동시키기 위한 스테이지와,상기 스테이지에 설치되어 상기 스테이지의 위치계측에 사용되는 기준부재와,상기 기준부재와 협동해서 상기 스테이지의 주사이동방향을 검출하는 검출수단을 구비한 것을 특징으로 하는 노광장치.
- 제 7항에 있어서,상기 검출 수단에 의한 검출결과에 의거해서 상기 주사이동방향을 보정하는 보정수단을 또 구비한 것을 특징으로 하는 노광장치.
- 제 7항에 있어서,상기 스테이지의 위치를 계측하기 위한 레이저간섭계를 또 구비하고,상기 기준부재는 상기 레이저간섭계에 이용되는 기준반사경으로 구성된 것을 특징으로 하는 노광장치
- 제 7항에 있어서,상기 검출수단은 상기 스테이지와는 독립된 위치에 설치된 오토콜리메이터를 구비한 것을 특징으로 하는 노광장치.
- 제 7항에 있어서,원판의 패턴을 기판상에 축소투영해서, 이들 축소된 패턴을 기판의 상이한 영역에 인쇄하는 수단을 또 구비한 것을 특징으로 하는 노광장치.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16225393A JP3244872B2 (ja) | 1993-06-30 | 1993-06-30 | 露光装置とこれを用いたデバイス製造方法 |
JP93-161961 | 1993-06-30 | ||
JP16196193A JP3244871B2 (ja) | 1993-06-30 | 1993-06-30 | 露光装置とこれを用いたデバイス製造方法 |
JP93-162253 | 1993-06-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR950001869A KR950001869A (ko) | 1995-01-04 |
KR0139039B1 true KR0139039B1 (ko) | 1998-06-01 |
Family
ID=26487905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940015097A KR0139039B1 (ko) | 1993-06-30 | 1994-06-29 | 노광장치와 이것을 이용한 디바이스 제조방법 |
Country Status (2)
Country | Link |
---|---|
US (1) | US5796469A (ko) |
KR (1) | KR0139039B1 (ko) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5477304A (en) | 1992-10-22 | 1995-12-19 | Nikon Corporation | Projection exposure apparatus |
USRE38113E1 (en) | 1993-04-02 | 2003-05-06 | Nikon Corporation | Method of driving mask stage and method of mask alignment |
US5854671A (en) | 1993-05-28 | 1998-12-29 | Nikon Corporation | Scanning exposure method and apparatus therefor and a projection exposure apparatus and method which selectively chooses between static exposure and scanning exposure |
JP3381334B2 (ja) * | 1993-10-20 | 2003-02-24 | 株式会社ニコン | 投影露光装置 |
US5874820A (en) * | 1995-04-04 | 1999-02-23 | Nikon Corporation | Window frame-guided stage mechanism |
US6989647B1 (en) * | 1994-04-01 | 2006-01-24 | Nikon Corporation | Positioning device having dynamically isolated frame, and lithographic device provided with such a positioning device |
JP3363662B2 (ja) | 1994-05-19 | 2003-01-08 | キヤノン株式会社 | 走査ステージ装置およびこれを用いた露光装置 |
US5850280A (en) * | 1994-06-16 | 1998-12-15 | Nikon Corporation | Stage unit, drive table, and scanning exposure and apparatus using same |
US6721034B1 (en) | 1994-06-16 | 2004-04-13 | Nikon Corporation | Stage unit, drive table, and scanning exposure apparatus using the same |
US6246204B1 (en) | 1994-06-27 | 2001-06-12 | Nikon Corporation | Electromagnetic alignment and scanning apparatus |
JPH08293459A (ja) * | 1995-04-21 | 1996-11-05 | Nikon Corp | ステージ駆動制御方法及びその装置 |
TW318255B (ko) | 1995-05-30 | 1997-10-21 | Philips Electronics Nv | |
DE69629087T2 (de) * | 1995-05-30 | 2004-04-22 | Asml Netherlands B.V. | Positionierungsgerät mit einem referenzrahmen für ein messsystem |
US5907392A (en) * | 1995-07-20 | 1999-05-25 | Nikon Corporation | Exposure apparatus |
JP3815750B2 (ja) * | 1995-10-09 | 2006-08-30 | キヤノン株式会社 | ステージ装置、ならびに前記ステージ装置を用いた露光装置およびデバイス製造方法 |
JPH09115799A (ja) * | 1995-10-16 | 1997-05-02 | Nikon Corp | 走査型露光装置 |
JP3918200B2 (ja) * | 1995-11-16 | 2007-05-23 | 株式会社ニコン | リソグラフィ装置の製造方法及びリソグラフィ装置 |
KR970067591A (ko) | 1996-03-04 | 1997-10-13 | 오노 시게오 | 투영노광장치 |
JPH09320933A (ja) * | 1996-05-28 | 1997-12-12 | Nikon Corp | 走査型露光装置 |
JP3661291B2 (ja) * | 1996-08-01 | 2005-06-15 | 株式会社ニコン | 露光装置 |
JP3266515B2 (ja) * | 1996-08-02 | 2002-03-18 | キヤノン株式会社 | 露光装置、デバイス製造方法およびステージ装置 |
US6172738B1 (en) * | 1996-09-24 | 2001-01-09 | Canon Kabushiki Kaisha | Scanning exposure apparatus and device manufacturing method using the same |
KR100525521B1 (ko) | 1996-10-21 | 2006-01-27 | 가부시키가이샤 니콘 | 노광장치및노광방법 |
JP3890136B2 (ja) * | 1997-03-25 | 2007-03-07 | キヤノン株式会社 | 露光装置とこれを用いたデバイス製造方法、ならびにステージ装置 |
US6195155B1 (en) * | 1997-04-18 | 2001-02-27 | Nikon Corporation | Scanning type exposure method |
US6235438B1 (en) | 1997-10-07 | 2001-05-22 | Nikon Corporation | Projection exposure method and apparatus |
JP3535749B2 (ja) | 1997-12-10 | 2004-06-07 | キヤノン株式会社 | ステージ装置、露光装置、並びにデバイス製造方法 |
JP2000124122A (ja) * | 1998-10-19 | 2000-04-28 | Canon Inc | 半導体露光装置および同装置を用いるデバイス製造方法 |
DE10136388A1 (de) * | 2001-07-26 | 2003-02-13 | Zeiss Carl | System zum Vermessen eines optischen Systems, insbesondere eines Objektives |
CN103676488B (zh) * | 2012-09-10 | 2016-02-03 | 上海微电子装备有限公司 | 掩模交接机构及具有该掩模交接机构的掩模台 |
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JPS61160934A (ja) * | 1985-01-10 | 1986-07-21 | Canon Inc | 投影光学装置 |
JPS61251025A (ja) * | 1985-04-30 | 1986-11-08 | Canon Inc | 投影露光装置 |
JPS62262426A (ja) * | 1986-05-09 | 1987-11-14 | Canon Inc | 露光装置 |
US5148214A (en) * | 1986-05-09 | 1992-09-15 | Canon Kabushiki Kaisha | Alignment and exposure apparatus |
JP2631485B2 (ja) * | 1988-01-28 | 1997-07-16 | キヤノン株式会社 | 位置決め装置 |
EP0357423B1 (en) * | 1988-09-02 | 1995-03-15 | Canon Kabushiki Kaisha | An exposure apparatus |
JP2728898B2 (ja) * | 1988-10-05 | 1998-03-18 | キヤノン株式会社 | 露光装置 |
JP2777915B2 (ja) * | 1989-08-30 | 1998-07-23 | キヤノン株式会社 | 位置合わせ機構 |
JPH03198320A (ja) * | 1989-12-27 | 1991-08-29 | Nikon Corp | 投影光学装置 |
US4989031A (en) * | 1990-01-29 | 1991-01-29 | Nikon Corporation | Projection exposure apparatus |
DE69128655T2 (de) * | 1990-03-02 | 1998-05-07 | Canon K.K., Tokio/Tokyo | Belichtungsgerät |
JP2860578B2 (ja) * | 1990-03-02 | 1999-02-24 | キヤノン株式会社 | 露光装置 |
NL9000503A (nl) * | 1990-03-05 | 1991-10-01 | Asm Lithography Bv | Apparaat en werkwijze voor het afbeelden van een maskerpatroon op een substraat. |
JP2830492B2 (ja) * | 1991-03-06 | 1998-12-02 | 株式会社ニコン | 投影露光装置及び投影露光方法 |
JPH05152186A (ja) * | 1991-05-01 | 1993-06-18 | Canon Inc | 測定装置及び露光装置及び露光装置の位置決め方法 |
JP2864060B2 (ja) * | 1991-09-04 | 1999-03-03 | キヤノン株式会社 | 縮小投影型露光装置及び方法 |
US5281996A (en) * | 1992-09-04 | 1994-01-25 | General Signal Corporation | Photolithographic reduction imaging of extended field |
US5291240A (en) * | 1992-10-27 | 1994-03-01 | Anvik Corporation | Nonlinearity-compensated large-area patterning system |
-
1994
- 1994-06-29 KR KR1019940015097A patent/KR0139039B1/ko not_active IP Right Cessation
-
1997
- 1997-07-14 US US08/891,803 patent/US5796469A/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
KR950001869A (ko) | 1995-01-04 |
US5796469A (en) | 1998-08-18 |
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