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JPWO2024101164A1 - - Google Patents

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Publication number
JPWO2024101164A1
JPWO2024101164A1 JP2024535483A JP2024535483A JPWO2024101164A1 JP WO2024101164 A1 JPWO2024101164 A1 JP WO2024101164A1 JP 2024535483 A JP2024535483 A JP 2024535483A JP 2024535483 A JP2024535483 A JP 2024535483A JP WO2024101164 A1 JPWO2024101164 A1 JP WO2024101164A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024535483A
Other versions
JP7544311B1 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024101164A1 publication Critical patent/JPWO2024101164A1/ja
Application granted granted Critical
Publication of JP7544311B1 publication Critical patent/JP7544311B1/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F22/00Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides or nitriles thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Optics & Photonics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2024535483A 2022-11-10 2023-10-26 レジスト組成物およびその硬化物 Active JP7544311B1 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2022180187 2022-11-10
JP2022180187 2022-11-10
JP2023025197 2023-02-21
JP2023025197 2023-02-21
PCT/JP2023/038622 WO2024101164A1 (ja) 2022-11-10 2023-10-26 レジスト組成物およびその硬化物

Publications (2)

Publication Number Publication Date
JPWO2024101164A1 true JPWO2024101164A1 (ja) 2024-05-16
JP7544311B1 JP7544311B1 (ja) 2024-09-03

Family

ID=91032617

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024535483A Active JP7544311B1 (ja) 2022-11-10 2023-10-26 レジスト組成物およびその硬化物

Country Status (3)

Country Link
JP (1) JP7544311B1 (ja)
TW (1) TW202419491A (ja)
WO (1) WO2024101164A1 (ja)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL128965C (ja) 1963-09-06
DE10048258B4 (de) 2000-09-29 2004-08-19 Byk-Chemie Gmbh Verlaufmittel für Oberflächenbeschichtungen
JP2009256553A (ja) 2008-04-21 2009-11-05 Fujifilm Corp 光硬化性コーティング組成物、オーバープリント及びその製造方法
EP2460861B1 (en) 2009-07-31 2015-07-29 Kyoeisha Chemical Co., Ltd. Surface conditioner for coating agents
JP6123194B2 (ja) 2011-11-11 2017-05-10 Jnc株式会社 熱硬化性組成物
EP3344705B1 (en) 2015-08-31 2019-06-26 BYK-Chemie GmbH Copolymers containing polysiloxane macromonomer units, process of their preparation and their use in coating compositions and polymeric moulding compounds
JP6979791B2 (ja) 2017-05-26 2021-12-15 楠本化成株式会社 両親媒性ブロック共重合体を利用した塗料用レベリング剤
US20230312977A1 (en) 2020-09-15 2023-10-05 Dic Corporation Silicone chain-containing polymer and coating composition containing said polymer
WO2022130990A1 (ja) 2020-12-17 2022-06-23 Dic株式会社 化合物、レベリング剤、コーティング組成物、レジスト組成物及び物品
TW202311331A (zh) 2021-05-18 2023-03-16 日商Dic股份有限公司 含矽酮鏈的聚合物、塗敷組成物、抗蝕劑組成物及物品

Also Published As

Publication number Publication date
JP7544311B1 (ja) 2024-09-03
WO2024101164A1 (ja) 2024-05-16
TW202419491A (zh) 2024-05-16

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