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JPWO2024024503A1 - - Google Patents

Info

Publication number
JPWO2024024503A1
JPWO2024024503A1 JP2024536947A JP2024536947A JPWO2024024503A1 JP WO2024024503 A1 JPWO2024024503 A1 JP WO2024024503A1 JP 2024536947 A JP2024536947 A JP 2024536947A JP 2024536947 A JP2024536947 A JP 2024536947A JP WO2024024503 A1 JPWO2024024503 A1 JP WO2024024503A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024536947A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024024503A1 publication Critical patent/JPWO2024024503A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/544—Silicon-containing compounds containing nitrogen
    • C08K5/5455—Silicon-containing compounds containing nitrogen containing at least one group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2024536947A 2022-07-26 2023-07-12 Pending JPWO2024024503A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022118751 2022-07-26
PCT/JP2023/025649 WO2024024503A1 (ja) 2022-07-26 2023-07-12 熱伝導性２液付加硬化型シリコーン組成物、硬化物及びシート

Publications (1)

Publication Number Publication Date
JPWO2024024503A1 true JPWO2024024503A1 (de) 2024-02-01

Family

ID=89706221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024536947A Pending JPWO2024024503A1 (de) 2022-07-26 2023-07-12

Country Status (3)

Country Link
JP (1) JPWO2024024503A1 (de)
TW (1) TW202407050A (de)
WO (1) WO2024024503A1 (de)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0618860B2 (ja) * 1987-03-23 1994-03-16 タツタ電線株式会社 半導体封止用樹脂組成物
JPH0655895B2 (ja) * 1989-03-16 1994-07-27 信越化学工業株式会社 硬化性シリコーンゴム組成物
JP2002235184A (ja) * 2001-02-06 2002-08-23 Mitsubishi Cable Ind Ltd 銅または銅合金の防錆処理方法
JP2006056986A (ja) * 2004-08-19 2006-03-02 Shin Etsu Chem Co Ltd 二液硬化型シリコーン組成物
CN102459376B (zh) * 2009-06-02 2013-06-12 住友金属工业株式会社 适合于钢管用螺纹接头防锈的光固化性组合物
JP6508869B2 (ja) * 2013-02-14 2019-05-08 日東電工株式会社 粘着剤組成物、粘着剤層、粘着シート、光学部材、及びタッチパネル
JP6206240B2 (ja) * 2014-02-19 2017-10-04 株式会社オートネットワーク技術研究所 端子付き被覆電線、その製造方法及びワイヤーハーネス
JP6614362B2 (ja) * 2016-10-26 2019-12-04 信越化学工業株式会社 熱伝導性シリコーン組成物
JP2019031601A (ja) * 2017-08-07 2019-02-28 信越化学工業株式会社 付加硬化型シリコーン組成物及びシリコーンゴム硬化物
JP6915599B2 (ja) * 2018-09-07 2021-08-04 信越化学工業株式会社 熱伝導性シリコーン組成物
JP7070320B2 (ja) * 2018-10-18 2022-05-18 信越化学工業株式会社 熱伝導性シリコーン組成物
JP7627549B2 (ja) * 2020-05-26 2025-02-06 信越化学工業株式会社 二液付加硬化型シリコーンゴム組成物
JP7523870B2 (ja) * 2021-06-03 2024-07-29 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物

Also Published As

Publication number Publication date
WO2024024503A1 (ja) 2024-02-01
TW202407050A (zh) 2024-02-16

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20241213