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JPWO2021044644A1 - - Google Patents

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Publication number
JPWO2021044644A1
JPWO2021044644A1 JP2021543936A JP2021543936A JPWO2021044644A1 JP WO2021044644 A1 JPWO2021044644 A1 JP WO2021044644A1 JP 2021543936 A JP2021543936 A JP 2021543936A JP 2021543936 A JP2021543936 A JP 2021543936A JP WO2021044644 A1 JPWO2021044644 A1 JP WO2021044644A1
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JP
Japan
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JP2021543936A
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JP7295540B2 (ja
JPWO2021044644A5 (ja
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/0242Crystalline insulating materials
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/40Oxides
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/16Oxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/0237Materials
    • H01L21/02414Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02367Substrates
    • H01L21/02433Crystal orientation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02551Group 12/16 materials
    • H01L21/02554Oxides
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/02521Materials
    • H01L21/02565Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02518Deposited layers
    • H01L21/0257Doping during depositing
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/0262Reduction or decomposition of gaseous compounds, e.g. CVD
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02623Liquid deposition
    • H01L21/02628Liquid deposition using solutions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/28Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
    • H01L21/283Deposition of conductive or insulating materials for electrodes conducting electric current
    • H01L21/285Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
    • H01L21/28506Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
    • H01L21/28512Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
    • H01L21/28556Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
    • H01L21/28562Selective deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
  • Chemical Vapour Deposition (AREA)
JP2021543936A 2019-09-02 2020-01-09 成膜方法、及び、半導体装置の製造方法 Active JP7295540B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPPCT/JP2019/034436 2019-09-02
JP2019034436 2019-09-02
PCT/JP2020/000539 WO2021044644A1 (ja) 2019-09-02 2020-01-09 成膜方法、及び、半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JPWO2021044644A1 true JPWO2021044644A1 (ja) 2021-03-11
JPWO2021044644A5 JPWO2021044644A5 (ja) 2022-02-14
JP7295540B2 JP7295540B2 (ja) 2023-06-21

Family

ID=74853128

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021543936A Active JP7295540B2 (ja) 2019-09-02 2020-01-09 成膜方法、及び、半導体装置の製造方法

Country Status (5)

Country Link
US (1) US20220157598A1 (ja)
JP (1) JP7295540B2 (ja)
CN (1) CN114341409A (ja)
DE (1) DE112020004152T5 (ja)
WO (1) WO2021044644A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7452448B2 (ja) * 2021-01-21 2024-03-19 トヨタ自動車株式会社 ビスマス含有酸化ガリウム系半導体膜を基材上に成膜する方法、ビスマス含有酸化ガリウム系半導体膜、及びビスマス含有酸化ガリウム系半導体部品

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007063106A (ja) * 2005-09-02 2007-03-15 Fujifilm Corp Bi12MO20粉体の製造方法および放射線撮像パネルを構成する光導電層
WO2013035843A1 (ja) * 2011-09-08 2013-03-14 株式会社タムラ製作所 Ga2O3系半導体素子
JP2014063973A (ja) * 2012-08-26 2014-04-10 Kumamoto Univ 酸化亜鉛結晶層の製造方法及び酸化亜鉛結晶層並びにミスト化学気相成長装置
WO2018052097A1 (ja) * 2016-09-15 2018-03-22 株式会社Flosfia 半導体膜の製造方法及び半導体膜並びにドーピング用錯化合物及びドーピング方法
JP2019041107A (ja) * 2017-08-24 2019-03-14 株式会社Flosfia 半導体装置

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JPH08264525A (ja) * 1995-03-20 1996-10-11 Olympus Optical Co Ltd ビスマス層状化合物薄膜の形成方法
US6151241A (en) * 1999-05-19 2000-11-21 Symetrix Corporation Ferroelectric memory with disturb protection
EP1923395A1 (en) * 1999-12-21 2008-05-21 Monsanto Technology, LLC Use of supplemental promoter in conjuction with a carbon-supported, noble-metal-containing catalyst in liquid phase oxidation reactions
JP5533622B2 (ja) * 2010-04-14 2014-06-25 三菱マテリアル株式会社 強誘電体薄膜形成用組成物、強誘電体薄膜の形成方法並びに該方法により形成された強誘電体薄膜
US9279182B2 (en) * 2010-06-01 2016-03-08 Toshiba Mitsubishi-Electric Industrial Systems Corporation Apparatus for forming metal oxide film, method for forming metal oxide film, and metal oxide film
US9608214B2 (en) * 2012-04-10 2017-03-28 Postech Academy-Industry Foundation Integrated conductive substrate, and electronic device employing same
US20140121403A1 (en) * 2012-10-31 2014-05-01 Celanese International Corporation Integrated Process for the Production of Acrylic Acids and Acrylates
JP2015070248A (ja) 2013-10-01 2015-04-13 株式会社Flosfia 酸化物薄膜及びその製造方法
JP6578596B2 (ja) * 2014-09-17 2019-09-25 国立大学法人 東京大学 金属(x)ドープバナジン酸ビスマスの製造方法および金属(x)ドープバナジン酸ビスマス
US10851015B2 (en) * 2015-10-30 2020-12-01 Agc Glass Europe Coated glass sheet
GB201520077D0 (en) * 2015-11-13 2015-12-30 Johnson Matthey Plc Conductive track or coating
JP6658161B2 (ja) * 2016-03-18 2020-03-04 セイコーエプソン株式会社 固体電解質及びリチウムイオン電池
US10944015B2 (en) * 2017-08-24 2021-03-09 Flosfia Inc. Semiconductor device
JP2019142756A (ja) * 2018-02-22 2019-08-29 トヨタ自動車株式会社 成膜方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007063106A (ja) * 2005-09-02 2007-03-15 Fujifilm Corp Bi12MO20粉体の製造方法および放射線撮像パネルを構成する光導電層
WO2013035843A1 (ja) * 2011-09-08 2013-03-14 株式会社タムラ製作所 Ga2O3系半導体素子
JP2014063973A (ja) * 2012-08-26 2014-04-10 Kumamoto Univ 酸化亜鉛結晶層の製造方法及び酸化亜鉛結晶層並びにミスト化学気相成長装置
WO2018052097A1 (ja) * 2016-09-15 2018-03-22 株式会社Flosfia 半導体膜の製造方法及び半導体膜並びにドーピング用錯化合物及びドーピング方法
JP2019041107A (ja) * 2017-08-24 2019-03-14 株式会社Flosfia 半導体装置

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CHOUIKH, F., ET AL.: "Highly oriented and conducting Bi doped ZnO (BZO) layers chemically sprayed using nitrogen gas carri", MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, vol. 64, JPN6019044520, 2017, pages 39 - 46, XP029984243, ISSN: 0005007288, DOI: 10.1016/j.mssp.2017.03.011 *
KHADEMI, NEGAR, ET AL.: "The Structural, Thermoelectric and Optical Properties of SnO2-Fe2O3:Bi Thin Films Deposited by Spray", THERMAL ENERGY AND POWER ENGINEERING, vol. 2, no. 3, JPN6019044527, 2013, pages 89 - 93, ISSN: 0005007291 *
SABINO,FERNANDO P., ET AL.: "Bismuth-doped Ga2O3 as candidate for p-type transparent conducting material", ARXIV.ORG, CONDENSED MATTER, vol. arXiv:1906.00840, JPN6019044529, 3 June 2019 (2019-06-03), pages 1 - 6, ISSN: 0005007292 *
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VELUSAMY, P. ET AL.: "A study on formaldehyde gas sensing and optoelectronic properties of Bi-doped CdO thin films deposit", SENSORS AND ACTUATORS B:CHEMICAL, vol. 297, JPN6019044525, 26 June 2019 (2019-06-26), pages 126718 - 1, ISSN: 0005007290 *

Also Published As

Publication number Publication date
DE112020004152T5 (de) 2022-05-19
CN114341409A (zh) 2022-04-12
JP7295540B2 (ja) 2023-06-21
US20220157598A1 (en) 2022-05-19
WO2021044644A1 (ja) 2021-03-11

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