JPWO2021044644A1 - - Google Patents
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- Publication number
- JPWO2021044644A1 JPWO2021044644A1 JP2021543936A JP2021543936A JPWO2021044644A1 JP WO2021044644 A1 JPWO2021044644 A1 JP WO2021044644A1 JP 2021543936 A JP2021543936 A JP 2021543936A JP 2021543936 A JP2021543936 A JP 2021543936A JP WO2021044644 A1 JPWO2021044644 A1 JP WO2021044644A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/0242—Crystalline insulating materials
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/40—Oxides
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/0237—Materials
- H01L21/02414—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02367—Substrates
- H01L21/02433—Crystal orientation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02554—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02565—Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/0257—Doping during depositing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02623—Liquid deposition
- H01L21/02628—Liquid deposition using solutions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28556—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD
- H01L21/28562—Selective deposition
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Chemical Vapour Deposition (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPPCT/JP2019/034436 | 2019-09-02 | ||
JP2019034436 | 2019-09-02 | ||
PCT/JP2020/000539 WO2021044644A1 (ja) | 2019-09-02 | 2020-01-09 | 成膜方法、及び、半導体装置の製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2021044644A1 true JPWO2021044644A1 (ja) | 2021-03-11 |
JPWO2021044644A5 JPWO2021044644A5 (ja) | 2022-02-14 |
JP7295540B2 JP7295540B2 (ja) | 2023-06-21 |
Family
ID=74853128
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021543936A Active JP7295540B2 (ja) | 2019-09-02 | 2020-01-09 | 成膜方法、及び、半導体装置の製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220157598A1 (ja) |
JP (1) | JP7295540B2 (ja) |
CN (1) | CN114341409A (ja) |
DE (1) | DE112020004152T5 (ja) |
WO (1) | WO2021044644A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7452448B2 (ja) * | 2021-01-21 | 2024-03-19 | トヨタ自動車株式会社 | ビスマス含有酸化ガリウム系半導体膜を基材上に成膜する方法、ビスマス含有酸化ガリウム系半導体膜、及びビスマス含有酸化ガリウム系半導体部品 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007063106A (ja) * | 2005-09-02 | 2007-03-15 | Fujifilm Corp | Bi12MO20粉体の製造方法および放射線撮像パネルを構成する光導電層 |
WO2013035843A1 (ja) * | 2011-09-08 | 2013-03-14 | 株式会社タムラ製作所 | Ga2O3系半導体素子 |
JP2014063973A (ja) * | 2012-08-26 | 2014-04-10 | Kumamoto Univ | 酸化亜鉛結晶層の製造方法及び酸化亜鉛結晶層並びにミスト化学気相成長装置 |
WO2018052097A1 (ja) * | 2016-09-15 | 2018-03-22 | 株式会社Flosfia | 半導体膜の製造方法及び半導体膜並びにドーピング用錯化合物及びドーピング方法 |
JP2019041107A (ja) * | 2017-08-24 | 2019-03-14 | 株式会社Flosfia | 半導体装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08264525A (ja) * | 1995-03-20 | 1996-10-11 | Olympus Optical Co Ltd | ビスマス層状化合物薄膜の形成方法 |
US6151241A (en) * | 1999-05-19 | 2000-11-21 | Symetrix Corporation | Ferroelectric memory with disturb protection |
EP1923395A1 (en) * | 1999-12-21 | 2008-05-21 | Monsanto Technology, LLC | Use of supplemental promoter in conjuction with a carbon-supported, noble-metal-containing catalyst in liquid phase oxidation reactions |
JP5533622B2 (ja) * | 2010-04-14 | 2014-06-25 | 三菱マテリアル株式会社 | 強誘電体薄膜形成用組成物、強誘電体薄膜の形成方法並びに該方法により形成された強誘電体薄膜 |
US9279182B2 (en) * | 2010-06-01 | 2016-03-08 | Toshiba Mitsubishi-Electric Industrial Systems Corporation | Apparatus for forming metal oxide film, method for forming metal oxide film, and metal oxide film |
US9608214B2 (en) * | 2012-04-10 | 2017-03-28 | Postech Academy-Industry Foundation | Integrated conductive substrate, and electronic device employing same |
US20140121403A1 (en) * | 2012-10-31 | 2014-05-01 | Celanese International Corporation | Integrated Process for the Production of Acrylic Acids and Acrylates |
JP2015070248A (ja) | 2013-10-01 | 2015-04-13 | 株式会社Flosfia | 酸化物薄膜及びその製造方法 |
JP6578596B2 (ja) * | 2014-09-17 | 2019-09-25 | 国立大学法人 東京大学 | 金属(x)ドープバナジン酸ビスマスの製造方法および金属(x)ドープバナジン酸ビスマス |
US10851015B2 (en) * | 2015-10-30 | 2020-12-01 | Agc Glass Europe | Coated glass sheet |
GB201520077D0 (en) * | 2015-11-13 | 2015-12-30 | Johnson Matthey Plc | Conductive track or coating |
JP6658161B2 (ja) * | 2016-03-18 | 2020-03-04 | セイコーエプソン株式会社 | 固体電解質及びリチウムイオン電池 |
US10944015B2 (en) * | 2017-08-24 | 2021-03-09 | Flosfia Inc. | Semiconductor device |
JP2019142756A (ja) * | 2018-02-22 | 2019-08-29 | トヨタ自動車株式会社 | 成膜方法 |
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2020
- 2020-01-09 DE DE112020004152.2T patent/DE112020004152T5/de active Pending
- 2020-01-09 CN CN202080060896.6A patent/CN114341409A/zh active Pending
- 2020-01-09 WO PCT/JP2020/000539 patent/WO2021044644A1/ja active Application Filing
- 2020-01-09 JP JP2021543936A patent/JP7295540B2/ja active Active
-
2022
- 2022-02-02 US US17/591,002 patent/US20220157598A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007063106A (ja) * | 2005-09-02 | 2007-03-15 | Fujifilm Corp | Bi12MO20粉体の製造方法および放射線撮像パネルを構成する光導電層 |
WO2013035843A1 (ja) * | 2011-09-08 | 2013-03-14 | 株式会社タムラ製作所 | Ga2O3系半導体素子 |
JP2014063973A (ja) * | 2012-08-26 | 2014-04-10 | Kumamoto Univ | 酸化亜鉛結晶層の製造方法及び酸化亜鉛結晶層並びにミスト化学気相成長装置 |
WO2018052097A1 (ja) * | 2016-09-15 | 2018-03-22 | 株式会社Flosfia | 半導体膜の製造方法及び半導体膜並びにドーピング用錯化合物及びドーピング方法 |
JP2019041107A (ja) * | 2017-08-24 | 2019-03-14 | 株式会社Flosfia | 半導体装置 |
Non-Patent Citations (5)
Title |
---|
CHOUIKH, F., ET AL.: "Highly oriented and conducting Bi doped ZnO (BZO) layers chemically sprayed using nitrogen gas carri", MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, vol. 64, JPN6019044520, 2017, pages 39 - 46, XP029984243, ISSN: 0005007288, DOI: 10.1016/j.mssp.2017.03.011 * |
KHADEMI, NEGAR, ET AL.: "The Structural, Thermoelectric and Optical Properties of SnO2-Fe2O3:Bi Thin Films Deposited by Spray", THERMAL ENERGY AND POWER ENGINEERING, vol. 2, no. 3, JPN6019044527, 2013, pages 89 - 93, ISSN: 0005007291 * |
SABINO,FERNANDO P., ET AL.: "Bismuth-doped Ga2O3 as candidate for p-type transparent conducting material", ARXIV.ORG, CONDENSED MATTER, vol. arXiv:1906.00840, JPN6019044529, 3 June 2019 (2019-06-03), pages 1 - 6, ISSN: 0005007292 * |
SADANANDA KUMAR, N., ET AL.: "Properties of ZnO:Bi thin films prepared by spray pyrolysis technique", JOURNAL OF ALLOYS AND COMPOUNDS, vol. 578, JPN6019044522, 2013, pages 613 - 619, XP028705148, ISSN: 0005007289, DOI: 10.1016/j.jallcom.2013.07.036 * |
VELUSAMY, P. ET AL.: "A study on formaldehyde gas sensing and optoelectronic properties of Bi-doped CdO thin films deposit", SENSORS AND ACTUATORS B:CHEMICAL, vol. 297, JPN6019044525, 26 June 2019 (2019-06-26), pages 126718 - 1, ISSN: 0005007290 * |
Also Published As
Publication number | Publication date |
---|---|
DE112020004152T5 (de) | 2022-05-19 |
CN114341409A (zh) | 2022-04-12 |
JP7295540B2 (ja) | 2023-06-21 |
US20220157598A1 (en) | 2022-05-19 |
WO2021044644A1 (ja) | 2021-03-11 |
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