JPWO2017119114A1 - Repair device and repair method - Google Patents

Abstract

The inspection repair device (30) is a device used in a mounting system (10) for placing components on a substrate, and includes a correction unit (45) capable of changing the position of the components placed on the substrate, If the inspection result obtained by inspecting the arrangement state of the component arranged in the board includes information on the component in which the positional deviation has occurred, the position deviation correcting unit (45) corrects the positional deviation of the component arranged on the substrate. And a control unit (31) for correcting.

Description

  The present invention relates to a repair device and a repair method.

  Conventionally, as an inspection device for mounting processing for mounting a component on a substrate, for example, the mounting state of a substrate on which the component is mounted is inspected, and from the inspection result data of the defective substrate determined to be defective, There has been proposed a method for acquiring information related to an unmounted component and creating a repair program for mounting a mounted component on a defective board based on this data (see, for example, Patent Document 1). In this apparatus, when a defective board having an unmounted component is carried into the production line, only the process determined by the repair program is performed, and the component remounting process can be performed efficiently. In addition, the inspection device measures the height of the component after mounting the component and the height of the board, determines the component mounting failure based on the difference in height, and remounts the component when mounting failure occurs. The thing is proposed (for example, refer patent document 2). In this apparatus, the mounting of the component can be inspected after the component is mounted on the substrate.

JP 2007-157817 A JP 2000-13097 A

  However, in the apparatuses described in Patent Documents 1 and 2, it is necessary for the operator to remove the board on which the components are displaced from the production line and make corrections.

  The present invention has been made in view of such a problem, and a main object of the present invention is to provide a repair device and a repair method capable of performing mounting processing more efficiently when a positional deviation occurs in a component. .

  The present invention adopts the following means in order to achieve the main object described above.

The repair device of the present invention is
A repair device used in a mounting system for placing components on a board,
A correction unit capable of changing the position of the component arranged on the substrate;
When the inspection result obtained by inspecting the arrangement state of the component arranged on the substrate is acquired, and the acquired inspection result includes information on the component in which the positional deviation has occurred, the positional deviation of the component arranged on the substrate A control unit for correcting the correction unit,
It is equipped with.

  In this apparatus, an inspection result obtained by inspecting an arrangement position of a component arranged on a substrate is acquired, and when the acquired inspection result includes information on a component having a positional deviation, the position of the component arranged on the substrate is acquired. Let the correction part correct the deviation. For example, when there is a substrate having a misaligned component, the operator may discharge the substrate and correct the component. However, the repair process that relies on the skill of the operator affects the quality and may take a lot of time. In this apparatus, since the misalignment of the component is corrected by the correction unit capable of changing the position of the component, the mounting process can be performed more efficiently when the misalignment occurs in the component.

  In the repair apparatus according to the present invention, the correction unit may correct the positional deviation of the component by pushing the misaligned component from the lateral direction. In this apparatus, since the positional deviation of the component is corrected from the lateral direction, for example, when the positional deviation of the component is relatively small, the positional deviation can be corrected more favorably.

  Or the repair apparatus of this invention WHEREIN: The said correction | amendment part is good also as what correct | amends the position shift of the said component by extract | collecting the said components which shifted | deviated, and rearranging to the arrangement position. In this apparatus, since the component displacement is corrected by removing the component, for example, when the component displacement is relatively large, the displacement can be corrected more favorably.

  In the repair apparatus according to the present invention, the control unit may cause the correction unit to correct the misalignment of the component by an operation slower than a mounting process of the mounting unit that places the component on the substrate. In this apparatus, since the position shift of the component is corrected with a slower operation, the position shift of the component can be corrected more accurately.

  The repair device of the present invention includes an imaging unit that images the board on which the component is arranged, and an inspection unit that inspects the arrangement state of the component based on an image captured by the imaging unit. Also good. In this apparatus, the arrangement state of components on the board can be inspected, and the misalignment of the components can be corrected using the inspection result. This apparatus may be an inspection apparatus provided with the repair apparatus described above. In the repair apparatus, the correction unit may be disposed in an inspection head in which the imaging unit is disposed. In this apparatus, since the correction unit is disposed in the inspection head, the apparatus configuration can be further simplified by sharing the head for inspection and correction.

The repair method of the present invention includes:
A repair method including a correction unit that is used in a mounting system that places components on a board and can change the position of the parts placed on the board,
(A) obtaining an inspection result obtained by inspecting an arrangement position of a component arranged on the substrate;
(B) when the inspection result acquired in step (a) includes information on the component that has been misaligned, correcting the misalignment of the component arranged on the substrate by the correction unit;
Is included.

  This repair method, like the above-described repair device, corrects the component misalignment by the correction unit that can change the component position, so that when the component misalignment occurs, the mounting process is performed more efficiently. Can do. In this repair method, various aspects of the repair device described above may be adopted, and steps for realizing each function of the repair device described above may be added.

1 is a schematic explanatory diagram illustrating an example of a configuration of a mounting system 10. FIG. Explanatory drawing of the inspection repair apparatus 30. FIG. Explanatory drawing of the board | substrate S with which the component P is arrange | positioned. The flowchart showing an example of a test | inspection repair process routine. Explanatory drawing of a series of processes which correct the position shift of the component P. FIG. Explanatory drawing of another test | inspection repair apparatus 30B. Explanatory drawing of another test | inspection repair apparatus 30C.

  Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a schematic explanatory diagram illustrating an example of a configuration of a mounting system 10 according to an embodiment of the present invention. FIG. 2 is an explanatory diagram of the inspection repair device 30. FIG. 3 is an explanatory diagram of the substrate S on which the component P is arranged. The mounting system 10 includes a plurality of mounting devices 20 that mount the above electronic components (components P) on a substrate S (see FIG. 2 described later), one or more inspection repair devices 30 that inspect the mounting state of the components P, A management computer (PC) 80 that manages information related to processing in each mounting device 20 and each inspection / repair device 30 is provided. The mounting system 10 is connected to a plurality of mounting apparatuses 20 mounted with reels or the like that accommodate various components P, and is configured as a mounting line that transports the substrate S and mounts the components P. In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS.

  The mounting device 20 is a device for mounting the component P on the substrate S, and includes a control unit 21, a substrate processing unit 23, a mounting processing unit 24, and a supply unit 26. The control unit 21 is configured as a microprocessor centered on a CPU, and includes a storage unit such as a ROM that stores a processing program and a RAM that is used as a work area. The substrate processing unit 23 is a unit that transports and fixes the substrate S, and includes a belt conveyor that transports the substrate S and a clamp device that fixes the substrate S. The mounting processing unit 24 is a unit that collects and arranges the components P, and includes a mounting head, a suction nozzle mounted on the mounting head, and a head moving unit that moves the mounting head in the XY directions. The supply unit 26 is a unit that supplies the component P to the mounting processing unit 24, and includes a reel on which a tape containing the component P is wound, a tray on which the component P is placed, and the like.

  The inspection repair device 30 is a device that inspects the state of the component P arranged on the substrate S, and includes a control unit 31, a substrate processing unit 33, an inspection unit 34, a parts camera 35, and an operation panel 37. I have. The control unit 31 is configured as a microprocessor centered on the CPU 32, and includes a storage unit such as a ROM that stores a processing program and a RAM that is used as a work area. This storage unit stores inspection condition information. The inspection condition information includes condition information used for inspection by the inspection repair device 30, reference image data obtained by imaging the state of the correct component P after mounting the substrate S to be inspected, and the like. The condition information includes the order of one or more areas to be inspected, the order of parts to be inspected, and the like. This inspection condition information is updated to the latest information from the management PC 80 and stored in the storage unit of the control unit 31. The substrate processing unit 33 is a unit that transports and fixes the substrate S, and includes a belt conveyor that transports the substrate S and a clamp device that fixes the substrate S.

  The inspection unit 34 is a unit that inspects and repairs the state of the component P on the substrate S. The inspection unit 34 includes an inspection head 40 and a head moving unit 49. The inspection head 40 includes an imaging unit 41 and a correction unit 45. The imaging unit 41 is a camera that captures an image of the substrate S. The correction unit 45 is a member that changes and corrects the position of the component P arranged on the substrate S, and is a member that can change the position of the component P arranged on the substrate S. The correction unit 45 has a pair of repair pins 46, as shown in FIG. The repair pin 46 is a rod-shaped member, and slides so as to change the distance from the other repair pin 46 facing the repair pin 46. The correction unit 45 is a member that corrects the positional deviation of the component P by pressing the component P that has been displaced on the substrate S from the lateral direction. Moreover, the correction | amendment part 45 can also correct | amend the position shift of this component P by picking up by hold | gripping the position-shifted component P and rearranging to the arrangement position. The correction unit 45 is detachably attached to the inspection head 40 in which the imaging unit 41 is disposed. In other words, the inspection head 40 has two processing functions, that is, the inspection of the component P and the correction of the position of the misaligned component P. The correction unit 45 is supported by the inspection head 40 so as to be rotatable about the Z axis, and is rotated by a motor (not shown). In this inspection / repair device 30, one or more types of correction units 45 corresponding to the type of component P are accommodated in a stocker (not shown), and the correction unit 45 is replaced according to the component P to be corrected. The head moving unit 49 moves the inspection head 40 in the XY directions. The head moving unit 49 includes a slider that is guided by the guide rail and moves in the XY directions, and a motor that drives the slider. The inspection head 40 is detachably attached to the slider.

  The parts camera 35 is, for example, a camera that images the part P gripped by the correction unit 45 from below. The parts camera 35 is disposed in front of the substrate processing unit 33. The imaging range of the parts camera 15 is above the parts camera 15. The operation panel 37 includes a display unit 38 that displays a screen and an operation unit 39 that receives an input operation from an operator.

  As shown in FIG. 3, a plurality of types of components P are arranged on the substrate S. In the inspection condition information, one or more inspection regions 50 are defined by the relationship between the size of the substrate S and the imaging range of the imaging unit 41. Further, in the inspection condition information, a repair unnecessary area 52 and a repairable area 54 are defined for the component P at each arrangement position of the substrate S. The repair unnecessary area 52 is empirically determined as a range of positional deviation of the component P that does not cause a problem in the final product after the reflow process or the like. The substrate S is a good product if the component P is disposed in the repair unnecessary area 52. The repairable area 54 is empirically determined as a range of positional deviation of the part P that can correct the part P into the repair unnecessary area 52 by pressing the part P from the lateral direction. The substrate S becomes a good product by arranging the component P in the repairable area 54 and then correcting the part P in the repair unnecessary area 52 through a predetermined repair process. In the inspection / repair device 30, if the component P is arranged outside the repairable area 54, the component P is assumed to have a large displacement so that the displacement of the component P cannot be corrected by pressing the component P from the lateral direction. The positional deviation of the component P is corrected by collecting P and rearranging it to the arrangement position.

  The management PC 80 is a computer that manages information on the plurality of mounting apparatuses 20 and the plurality of inspection repair apparatuses 30. The management PC 80 stores mounting condition information used for mounting in the mounting apparatus 20, inspection condition information used for inspection in the inspection repair apparatus 30, and the like.

  Next, the operation of the inspection / repair apparatus 30 of the present embodiment configured as described above, first, the mounting process by the mounting apparatus 20 will be described. When the mounting process is started, the control unit 21 controls the mounting processing unit 24 so that, for example, the component P accommodated in the tape or tray of the supply unit 26 is collected by the suction nozzle. Then, the control unit 21 moves the collected component P to a predetermined arrangement position on the substrate S and mounts it on the substrate S. At this time, the control unit 21 moves the component P as short as possible and as fast as possible in order to shorten the mounting time. The control unit 21 repeats this process until all the placement of the components P on the board S is completed. Further, when the placement processing of the component P on the current substrate S is completed, the control unit 21 transports the substrate S to the next process apparatus, loads a new substrate S, and performs the same processing as described above.

  Next, the operation of the inspection / repair device 30, particularly the processing for inspecting the arrangement state of the component P mounted on the substrate S by the mounting device 20 will be described. FIG. 4 is a flowchart illustrating an example of an inspection repair processing routine executed by the CPU 32 of the inspection repair device 30. This routine is stored in the storage unit of the control unit 31 and is appropriately started according to the start input of the mounting process by the operator. In the inspection process for the component P, whether or not the shape of the component P is normal is also inspected. Here, the positional deviation of the component P will be mainly described. When this routine is started, the CPU 32 of the control unit 31 acquires the inspection condition information (step S100), and executes the transfer and fixing process of the substrate S (step S110). The control unit 31 acquires inspection condition information from the storage unit of the control unit 31. The inspection condition information includes an inspection area 50, a repair unnecessary area 52, a repairable area 54, and the like.

  Next, the CPU 32 causes the inspection unit 34 to perform the imaging process of the inspection area 50 based on the condition information included in the inspection condition information (step S130). The inspection unit 34 images one or more inspection regions 50 in a predetermined order by the imaging unit 41. Next, the CPU 32 determines whether or not there is a component that has been displaced based on the captured image and the reference image data included in the inspection condition information (step S140). For example, in this process, the CPU 32 extracts the region of the component P in the image data by a known method such as binarization processing, and the position of the component in the captured image is shifted from the position of the normal component image. It is determined whether or not. When there is a component P that is displaced, the CPU 32 determines whether or not there is a component P in the repairable area 54 (step S150).

  When there is a part in the repairable area 54, the CPU 32 causes the inspection unit 34 to execute a repair process (steps S160 to S190). That is, the control unit 31 performs an inspection process for inspecting the arrangement state of the component P based on the image captured by the imaging unit 41, and when the inspection result includes information on the component P in which the positional deviation has occurred, Repair processing is performed in which the correction unit 45 corrects the positional deviation of the component P arranged on the substrate S. In this repair process, first, the CPU 32 acquires information such as the position of the component P that can be repaired by pressing from the lateral direction (step S160), and calculates the angle deviation amount A of the corresponding component P based on the captured image. Obtain (step S170). In this process, for example, based on the information on the region of the part P extracted in step S140, the end (side) of the part P is recognized, and the angle with respect to the part P placed at the normal position is obtained. Subsequently, the CPU 32 performs a process of correcting the angle and position of the component P (step S180). In this process, the position shift of the component P is corrected by pressing the component P shifted in position on the substrate S with the repair pin 46 from the lateral direction. At this time, the control unit 31 corrects the positional deviation of the component P in the correction unit 45 by an operation slower than the mounting process of the mounting processing unit 24 that places the component P on the substrate S from the viewpoint of correcting a slight positional deviation. Let For example, the repair pin 46 may be moved with any moving speed of 5% to 50% of the maximum moving speed of the suction nozzle in the mounting process as an upper limit.

  FIG. 5 is an explanatory diagram of a series of processes for correcting the positional deviation of the component P by pressing it from the lateral direction, FIGS. 5A to 5D are plan views, and FIGS. ) Is a side view corresponding to each of them. First, the CPU 32 obtains the direction of displacement of the component P and the amount of displacement. The direction and amount of the positional deviation of the component P can be obtained as, for example, the deviation of the center coordinate C of the component P. Knowing the direction and amount of displacement, the CPU 32 can determine the basic direction that the repair pin 46 should press to move the center coordinate C1 of the component P to the center coordinate C of the component P at the normal position. Next, the CPU 32 calculates an angle deviation amount A of the component P (FIGS. 5A and 5E). Here, it is assumed that the angle of the side in the longitudinal direction of the component P is obtained, and a case where the amount of angular deviation is the value A1 will be described. The CPU 32 corrects the angle A1 by pressing the component P with the repair pin 46 from the lateral direction so that the angle of the component P at the normal position (see the dotted line in FIG. 5) is obtained. The “lateral direction” means the front / rear / right / left direction of FIGS. Here, although one repair pin 46 demonstrates as what presses the left end part of the component P from the front side, it is good also as what presses the right end part of the component P from the back side. For the angle correction of the component P, for example, a table is prepared in which the center position (coordinates) of the component P, the position pressed by the repair pin 46, the movement amount of the repair pin 46, and the angular deviation amount A of the component P are prepared. When the center position of the component P and the angle deviation amount A are input, the pressing start position and the movement amount of the repair pin 46 can be derived based on this. Note that the CPU 32 omits this angle correction processing when there is no angle shift in the component P. Next, the CPU 32 corrects the positional deviation in the XY directions based on the basic direction. For example, as shown in FIG. 5B, the CPU 32 moves the repair pin 46 from the lateral direction (rear side) opposite to the pressing side (front side) in angle correction to the position of the side of the component P at the normal position. (FIGS. 5B and 5F). Then, the positional deviation amount Y1 in the front-rear direction of the component P is corrected. In addition, when the pressing direction of the repair pin 46 is changed, CPU32 shall rotate the correction | amendment part 45 axially according to it. Next, the CPU 32 moves the repair pin 46 from one of the laterally displaced directions to the position of the side of the component P at the normal position (FIGS. 5C and 5G). Then, the displacement amount X1 in the left-right direction of the component P is corrected (FIGS. 5D and 5H). In this way, the inspection / repair device 30 detects the positional deviation of the component P and performs a process of correcting the positional deviation.

  Subsequently, the CPU 32 determines whether or not the repair process for all the parts P has been completed (step S190), and when all the repair processes for the parts P have not been completed, the processes after step S150 are executed. On the other hand, when there is no part P in the repairable area 54 in step S150, that is, there is a part outside the repairable area 54, the CPU 32 causes the inspection unit 34 to perform repair processing (steps S200 to S220). In this repair process, first, the CPU 32 causes the correction part 45 to collect the corresponding part P and move it onto the parts camera 35 to cause the parts camera 35 to image the part P (step S200). Next, the CPU 32 acquires the angle deviation amount A of the corresponding component P based on the captured image by the same processing as in step S170 (step S210). Subsequently, the CPU 32 rearranges the component P to the arrangement position in a state where the angle and position of the component P are corrected (step S220), and executes the processing after step S190. At the time of rearrangement of the component P, the CPU 32 is assumed to cause the correction unit 45 to correct the positional deviation of the component P by an operation slower than the mounting process as described above. As described above, when the component P has a positional deviation that is difficult to eliminate the positional deviation by pressing from the lateral direction, the inspection repair device 30 repositions the component P to eliminate the positional deviation.

  On the other hand, when all the repair processing of the component P is completed in step S190, or when there is no component P displaced in step S140, the CPU 32 stores the inspection result and the repair result in the storage unit as history information, to that effect. Is notified to the worker (step S230). When there is no misaligned component P, the CPU 32 stores information indicating that repair has not been performed in the history information. Further, the CPU 32 displays a message or an image on the operation panel 37 when notifying the inspection result and the repair result. Then, the CPU 32 determines whether or not the inspection processing for all the substrates S has been completed (step S240), and when the inspection processing for all the substrates S has not been completed, the processing after step S120 is repeatedly executed. On the other hand, when the inspection process for all the substrates S is completed in step S240, this routine is finished as it is.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The correction unit 45 (repair pin 46) of the present embodiment corresponds to the correction unit of the present invention, the control unit 31 corresponds to the control unit and the inspection unit, and the imaging unit 41 corresponds to the imaging unit. In the present embodiment, an example of the repair method of the present invention is also clarified by describing the operation of the inspection / repair device 30.

  In the inspection repair apparatus 30 according to the embodiment described above, the inspection result obtained by inspecting the arrangement position of the component P arranged on the substrate S is acquired, and the acquired inspection result includes information on the component P in which the positional deviation has occurred. Sometimes, the correction unit 45 corrects the positional deviation of the component P arranged on the substrate S. For example, when there is a substrate having a misaligned component, the operator may discharge the substrate and correct the component. However, the repair process that relies on the skill of the operator affects the quality and may take a lot of time. In this inspection / repair device 30, since the misalignment of the component P is corrected by the correcting unit 45 capable of changing the position of the component P, the production process (mounting process) of the substrate S is performed when the misalignment occurs in the component P. It can be performed more efficiently.

  Moreover, since the correction | amendment part 45 corrects the position shift of the components P from a horizontal direction, the inspection repair apparatus 30 can correct a position shift more favorably, for example, when the position shift of the components P is comparatively small. . Further, since the inspection repair device 30 corrects the positional deviation of the component P by collecting the misaligned component P and rearranging it to the arrangement position, for example, it is better when the positional deviation of the component is relatively large. It is possible to correct the misalignment. Furthermore, the inspection repair device 30 causes the correction unit 45 to correct the positional deviation of the component P by the operation at a lower speed than the mounting process of the mounting device 20 in which the control unit 31 places the component P on the substrate S. The positional deviation of the component P can be corrected. In addition, the inspection repair apparatus 30 includes an imaging unit 41 that images the substrate S on which the component P is arranged, and a control unit 31 (inspection unit) that inspects the arrangement state of the component P based on the image captured by the imaging unit 41. ), It is possible to inspect the arrangement state of the component P on the substrate S and to correct the positional deviation of the component P using the inspection result. Still further, since the correction unit 45 is disposed in the inspection head 40 in which the imaging unit 41 is disposed, the inspection repair apparatus 30 is configured by sharing the head in the inspection process and the correction process. Can be further simplified.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, the correction unit 45 is disposed in the inspection head 40 in which the imaging unit 41 is disposed. However, the present invention is not particularly limited thereto, for example, as illustrated in FIG. The correction unit 45 may be provided in a correction head 40B different from the inspection head 40. FIG. 6 is an explanatory diagram of another inspection repair device 30B. The inspection repair device 30B includes an inspection head 40 provided with an imaging unit 41, a head moving unit 49 that moves the inspection head 40 in the XY direction, a correction head 40B provided with a correction unit 45, and a correction head. And a head moving unit 49B that moves 40B in the XY directions. In this inspection repair device 30B, although the device configuration increases, the inspection processing and the correction processing can be executed in parallel.

  In the above-described embodiment, whether to correct misalignment by pushing from the lateral direction depending on whether or not there is a part P in the repairable region 54, or to correct misalignment by rearranging after collecting the part P However, the present invention is not particularly limited to this, and the component P may be rearranged regardless of the repairable region 54, or may be pushed from the lateral direction to correct the positional deviation. When there is a part P outside the repairable area 54, the board S may be discharged out of the production line as being uncorrectable by the correction unit 45.

  In the embodiment described above, the correction unit 45 has been described as including the repair pin 46, but is not particularly limited thereto, and may include, for example, a suction nozzle 48 as illustrated in FIG. FIG. 7 is an explanatory diagram of another inspection / repair device 30C. This inspection / repair device 30C corrects the positional deviation of the component P by suction-collecting the component P by the suction nozzle 48 and rearranging it. Even in this apparatus, when the component P is displaced, the production process (mounting process) of the substrate S can be performed more efficiently.

  In the embodiment described above, the correction unit 45 includes a pair of repair pins 46. However, the correction unit 45 is not particularly limited thereto, and may include only one repair pin 46, or may include four repair pins 46. It may be a thing. In addition, the repair pin 46 is slidably disposed in the correction portion 45, but may be fixed so as not to slide.

  In the embodiment described above, the inspection / repair device 30 includes the imaging unit 41 and the correction unit 45. However, the inspection / repair device 30 includes the imaging unit 41 and the repair device including the correction unit 45. . In this case, the repair device may acquire the inspection result from the inspection device and correct the positional deviation of the component P according to the inspection result.

  In the above-described embodiment, the present invention has been described as the inspection repair apparatus 30. However, the present invention may be a repair method or a control method of the repair apparatus, or the present invention may be a program that causes a computer to execute the above-described processing.

  The present invention can be used in a mounting apparatus that arranges components on a substrate.

DESCRIPTION OF SYMBOLS 10 Mounting system, 20 Mounting apparatus, 21 Control part, 23 Substrate processing unit, 24 Mounting processing unit, 26 Supply unit, 30, 30B, 30C Inspection repair apparatus, 31
Control unit, 32 CPU, 33 Substrate processing unit, 34 Inspection unit, 35 Parts camera, 37 Operation panel, 38 Display unit, 39 Operation unit, 40 Inspection head, 40B Correction head, 41 Imaging unit, 45 Correction unit, 46 Repair pin, 48 suction nozzle, 49, 49B head moving unit, 50 inspection area, 52 repair unnecessary area, 54 repairable area, 80 management PC, P component, S substrate.

Claims (7)

A repair device used in a mounting system for placing components on a board,
A correction unit capable of changing the position of the component arranged on the substrate;
When the inspection result obtained by inspecting the arrangement state of the component arranged on the substrate is acquired, and the acquired inspection result includes information on the component in which the positional deviation has occurred, the positional deviation of the component arranged on the substrate A control unit for correcting the correction unit,
Repair device with   The repair device according to claim 1, wherein the correction unit corrects a positional shift of the component by pressing the component that has been shifted from a lateral direction.   The repair device according to claim 1, wherein the correction unit corrects the positional deviation of the component by collecting the component that has been misaligned and rearranging the component to the arrangement position.   The said control part makes the said correction | amendment part correct | amend the position shift of the said component by operation | movement slower than the mounting process of the mounting part which arrange | positions the said component in the said board | substrate. Repair device. The repair device according to any one of claims 1 to 4,
An imaging unit for imaging the substrate on which the component is disposed;
An inspection unit for inspecting an arrangement state of the component based on an image captured by the imaging unit;
Repair device with   The repair device according to claim 5, wherein the correction unit is disposed in an inspection head in which the imaging unit is disposed. A repair method including a correction unit that is used in a mounting system that places components on a board and can change the position of the parts placed on the board,
(A) obtaining an inspection result obtained by inspecting an arrangement position of a component arranged on the substrate;
(B) when the inspection result acquired in step (a) includes information on the component that has been misaligned, correcting the misalignment of the component arranged on the substrate by the correction unit;
Including repair method.

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