JPS649634A - Wafer alignment apparatus - Google Patents
Wafer alignment apparatusInfo
- Publication number
- JPS649634A JPS649634A JP62165822A JP16582287A JPS649634A JP S649634 A JPS649634 A JP S649634A JP 62165822 A JP62165822 A JP 62165822A JP 16582287 A JP16582287 A JP 16582287A JP S649634 A JPS649634 A JP S649634A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- orientation flat
- chuck
- cassette
- during
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Delivering By Means Of Belts And Rollers (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
PURPOSE:To position a wafer during the transfer of the wafer simply and readily, by using the orientation flat, which is perpendicular to the moving direction of the wafer, as a reference during the movement of the wafer from a wafer cassette to a wafer chuck. CONSTITUTION:A wafer 15 is conveyed from a wafer cassette 13 to a position on a wafer table 7 on a table 12. The wafer 15 is positioned at a position, where an orientation flat 16 is perpendicular to the advancing direction on the wafer table 7. In this way, the moving period of the table 12 is effectively utilized, the orientation flat 16, which is perpendicular to the moving direction of the wafer 15, is used as a reference and the position of the wafer 15 is determined. The position perfectly agrees with the desired position of the wafer 15 on a wafer chuck 14. When the positioning mechanism having such a simple structure is used, the position of the wafer can be determined in a short time, by utilizing the orientation flat during the time when the wafer is conveyed from the wafer cassette to the wafer chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62165822A JP2581085B2 (en) | 1987-07-01 | 1987-07-01 | Wafer alignment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62165822A JP2581085B2 (en) | 1987-07-01 | 1987-07-01 | Wafer alignment device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS649634A true JPS649634A (en) | 1989-01-12 |
| JP2581085B2 JP2581085B2 (en) | 1997-02-12 |
Family
ID=15819657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62165822A Expired - Lifetime JP2581085B2 (en) | 1987-07-01 | 1987-07-01 | Wafer alignment device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2581085B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011181849A (en) * | 2010-03-03 | 2011-09-15 | Koyo Mach Ind Co Ltd | Method and apparatus for wafer-positioning |
-
1987
- 1987-07-01 JP JP62165822A patent/JP2581085B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011181849A (en) * | 2010-03-03 | 2011-09-15 | Koyo Mach Ind Co Ltd | Method and apparatus for wafer-positioning |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2581085B2 (en) | 1997-02-12 |
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