JPS648282A - Brush-etching device - Google Patents
Brush-etching deviceInfo
- Publication number
- JPS648282A JPS648282A JP16361887A JP16361887A JPS648282A JP S648282 A JPS648282 A JP S648282A JP 16361887 A JP16361887 A JP 16361887A JP 16361887 A JP16361887 A JP 16361887A JP S648282 A JPS648282 A JP S648282A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- etchant
- conductive layer
- resist film
- brush
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/068—Apparatus for etching printed circuits
Landscapes
- ing And Chemical Polishing (AREA)
Abstract
PURPOSE:To uniformly etch an electrically conductive layer by separately providing plural brush devices, impregnating the device with a liq. etchant, pressing the device on a substrate, and rotating the device when a resist film is provided on both sides of the substrate having the conductive layer on both sides and the conductive layer is etched. CONSTITUTION:The substrate 1 having a conductive layer of copper foil, etc., on both surfaces and provided with a resist film on the surfaces is conveyed by a carrier roll 21. Brush bodies 13 and 14 implanted with a fiber body 16 are pressed on the upper and lower surfaces of the substrate 1 by gravity and a spring 15, a liq. etchant is supplied to the fiber body 16 from a hose 20 to wet the fiber body 16 with the etchant, and the respective brush bodies 13 and 14 are independently reciprocated by a driving part 11 while following a small circular locus B in the direction orthogonal to the moving direction of the substrate 1. The fiber bodies 16 of the brush bodies 13 and 14 sufficiently penetrate into recesses by gravity and the action of the spring 15 even when the surface of the substrate 1 is warped or has a rugged surface, and hence the part of the conductive film not coated with the resist film is uniformly etched. In addition, since the conveyor of the substrate 1 is not dipped in the etchant, the conveyor is not corroded by the etchant.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16361887A JPS648282A (en) | 1987-06-30 | 1987-06-30 | Brush-etching device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16361887A JPS648282A (en) | 1987-06-30 | 1987-06-30 | Brush-etching device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS648282A true JPS648282A (en) | 1989-01-12 |
Family
ID=15777352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16361887A Pending JPS648282A (en) | 1987-06-30 | 1987-06-30 | Brush-etching device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS648282A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6036585A (en) * | 1997-03-31 | 2000-03-14 | Nippei Toyama Corporation | Grinder and grinding method |
-
1987
- 1987-06-30 JP JP16361887A patent/JPS648282A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6036585A (en) * | 1997-03-31 | 2000-03-14 | Nippei Toyama Corporation | Grinder and grinding method |
US6220931B1 (en) | 1997-03-31 | 2001-04-24 | Nippei Toyama Corporation | Feeding a grinding wheel in grinding method |
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