[go: up one dir, main page]

JPS648282A - Brush-etching device - Google Patents

Brush-etching device

Info

Publication number
JPS648282A
JPS648282A JP16361887A JP16361887A JPS648282A JP S648282 A JPS648282 A JP S648282A JP 16361887 A JP16361887 A JP 16361887A JP 16361887 A JP16361887 A JP 16361887A JP S648282 A JPS648282 A JP S648282A
Authority
JP
Japan
Prior art keywords
substrate
etchant
conductive layer
resist film
brush
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16361887A
Other languages
Japanese (ja)
Inventor
Naomi Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP16361887A priority Critical patent/JPS648282A/en
Publication of JPS648282A publication Critical patent/JPS648282A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/068Apparatus for etching printed circuits

Landscapes

  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE:To uniformly etch an electrically conductive layer by separately providing plural brush devices, impregnating the device with a liq. etchant, pressing the device on a substrate, and rotating the device when a resist film is provided on both sides of the substrate having the conductive layer on both sides and the conductive layer is etched. CONSTITUTION:The substrate 1 having a conductive layer of copper foil, etc., on both surfaces and provided with a resist film on the surfaces is conveyed by a carrier roll 21. Brush bodies 13 and 14 implanted with a fiber body 16 are pressed on the upper and lower surfaces of the substrate 1 by gravity and a spring 15, a liq. etchant is supplied to the fiber body 16 from a hose 20 to wet the fiber body 16 with the etchant, and the respective brush bodies 13 and 14 are independently reciprocated by a driving part 11 while following a small circular locus B in the direction orthogonal to the moving direction of the substrate 1. The fiber bodies 16 of the brush bodies 13 and 14 sufficiently penetrate into recesses by gravity and the action of the spring 15 even when the surface of the substrate 1 is warped or has a rugged surface, and hence the part of the conductive film not coated with the resist film is uniformly etched. In addition, since the conveyor of the substrate 1 is not dipped in the etchant, the conveyor is not corroded by the etchant.
JP16361887A 1987-06-30 1987-06-30 Brush-etching device Pending JPS648282A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16361887A JPS648282A (en) 1987-06-30 1987-06-30 Brush-etching device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16361887A JPS648282A (en) 1987-06-30 1987-06-30 Brush-etching device

Publications (1)

Publication Number Publication Date
JPS648282A true JPS648282A (en) 1989-01-12

Family

ID=15777352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16361887A Pending JPS648282A (en) 1987-06-30 1987-06-30 Brush-etching device

Country Status (1)

Country Link
JP (1) JPS648282A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6036585A (en) * 1997-03-31 2000-03-14 Nippei Toyama Corporation Grinder and grinding method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6036585A (en) * 1997-03-31 2000-03-14 Nippei Toyama Corporation Grinder and grinding method
US6220931B1 (en) 1997-03-31 2001-04-24 Nippei Toyama Corporation Feeding a grinding wheel in grinding method

Similar Documents

Publication Publication Date Title
EP0368334A3 (en) Etching apparatus and method of using the same
EP0335459A3 (en) Electrical connections for electronic devices
EP0316612A3 (en) Method of manufacturing a semiconductor device with a recess filled with wiring material
EP1005086A3 (en) Metal foil having bumps, circuit substrate having the metal foil, and semiconductor device having the circuit substrate
EP0851724A3 (en) Printed circuit board and electric components
TW339473B (en) Electronic package with multilevel connections
ES8400636A1 (en) PINDESILICIO AMORFO PHOTOVOLTAIC DEVICE.
EP0756323A3 (en) Substrate having an electrical conductor for an electronic component
EP0338232A3 (en) Method for mounting a flexible film electronic device carrier on or for separating it from a substrate
EP0177105A3 (en) Method for providing a semiconductor device with planarized contacts
EP0358350A3 (en) Forming a Prescribed Pattern on a Semiconductor Device Layer
EP0238929A3 (en) Process for providing circuit lines on a substrate
JPS648282A (en) Brush-etching device
EP0232127A3 (en) Anisotropic electrically conductive film connector
GB1537306A (en) Processing epitaxial layers
DE3664183D1 (en) Printed circuits
MX166210B (en) PROCEDURE FOR OBTAINING A LAMINATE AND THE LAMINATE SO OBTAINED
JPS648283A (en) Brush-etching device
JPS543843A (en) Surface treatment of base material for imparting electrical conductivity
GB2134817A (en) Antiskidding band, particularly carpet band
JPS648284A (en) Brush-etching device
JPS5317583A (en) Process for forming vacuum evaporation layer on largeesized substrate surface
JPS57194074A (en) Electrostatic coating method of bad conductive goods
EP0303384A3 (en) Flexible connector tape
JPS5676543A (en) Semiconductor element