[go: up one dir, main page]

JPS6480058A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS6480058A
JPS6480058A JP23767187A JP23767187A JPS6480058A JP S6480058 A JPS6480058 A JP S6480058A JP 23767187 A JP23767187 A JP 23767187A JP 23767187 A JP23767187 A JP 23767187A JP S6480058 A JPS6480058 A JP S6480058A
Authority
JP
Japan
Prior art keywords
capacitor
wiring
seam
chip
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23767187A
Other languages
Japanese (ja)
Inventor
Takafumi Tamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP23767187A priority Critical patent/JPS6480058A/en
Publication of JPS6480058A publication Critical patent/JPS6480058A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To shorten the wiring between an IC chip and a capacitor as well as to remove the unnecessary alternating-circuit component of a power source system or a signal by a method wherein the title semiconductor device is constructed in such a manner that a capacitor is incorporated into the cap part of the package to be used for the semiconductor device. CONSTITUTION:Electrodes 1 and 2 are buried in a cap 5, and a capacitor 3 is formed with the electrodes 1 and 2 and the ceramic located between them. A seam-sealing metallized layer 4 is formed on the insulating part 14 located on the circumference of the capacitor 3. The cap 5 is placed on the upper part of a ceramic case 13, and it is seam-weld sealed with the metallized layer 4 and a seam-ring 8. An edge of the wiring 7 in the case is connected to a switch 10, another edge of the wiring 7 is connected to an IC chip 9 through a bonding wire 12, and other edge is connected to the external terminal. As a result, the wiring from the chip 9 to the capacitor 3 is made short, and the unnecessary alternating component of a power source system and a signal can be removed.
JP23767187A 1987-09-21 1987-09-21 Semiconductor device Pending JPS6480058A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23767187A JPS6480058A (en) 1987-09-21 1987-09-21 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23767187A JPS6480058A (en) 1987-09-21 1987-09-21 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS6480058A true JPS6480058A (en) 1989-03-24

Family

ID=17018783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23767187A Pending JPS6480058A (en) 1987-09-21 1987-09-21 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS6480058A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09293799A (en) * 1996-04-26 1997-11-11 Nec Corp Semiconductor integrated circuit package and manufacture thereof
US5905301A (en) * 1996-02-01 1999-05-18 Nec Corporation Mold package for sealing a chip

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5905301A (en) * 1996-02-01 1999-05-18 Nec Corporation Mold package for sealing a chip
JPH09293799A (en) * 1996-04-26 1997-11-11 Nec Corp Semiconductor integrated circuit package and manufacture thereof

Similar Documents

Publication Publication Date Title
JPS5731166A (en) Semiconductor device
KR890700925A (en) Wire bond and electrical contact of integrated circuit (IC) devices
KR880011910A (en) Resin Sealed Integrated Circuit Device
KR880702041A (en) Circuit package bonding device and method
EP0179577A3 (en) Method for making a semiconductor device having conductor pins
ES8601629A1 (en) Integrated circuit module and method of making same.
JPS641269A (en) Semiconductor device
KR870005450A (en) Semiconductor device without electrical short circuit through semiconductor layer and method for manufacturing the same
KR900003030B1 (en) Programmable device for semiconductor integrated cricuit
JPS5563840A (en) Semiconductor integrated device
FR2749975B1 (en) SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE HAVING A HIGH NUMBER OF INPUT / OUTPUT CONNECTIONS
EP0272390A3 (en) Packages for a semiconductor device
EP0289102A3 (en) Method and means for bonding of lead wires for an integrated circuit device
JPS6480058A (en) Semiconductor device
JPS57166051A (en) Semiconductor device
JPS6412565A (en) Semiconductor integrated circuit
JPS5651851A (en) Semiconductor device
JPS56148857A (en) Semiconductor device
GB2196475B (en) Semiconductor chip constructions
JPS57104235A (en) Semiconductor device
JPS57141946A (en) Semiconductor device
JPS6473753A (en) Semiconductor integrated circuit device
EP0081419A3 (en) High lead count hermetic mass bond integrated circuit carrier
JPS57113261A (en) Semiconductor device
JPS6436030A (en) Semiconductor device