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JPS6477953A - Lead frame for semiconductor device - Google Patents

Lead frame for semiconductor device

Info

Publication number
JPS6477953A
JPS6477953A JP23560187A JP23560187A JPS6477953A JP S6477953 A JPS6477953 A JP S6477953A JP 23560187 A JP23560187 A JP 23560187A JP 23560187 A JP23560187 A JP 23560187A JP S6477953 A JPS6477953 A JP S6477953A
Authority
JP
Japan
Prior art keywords
lead frame
sections
frame
chips
joining material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23560187A
Other languages
Japanese (ja)
Inventor
Takahiro Tajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP23560187A priority Critical patent/JPS6477953A/en
Publication of JPS6477953A publication Critical patent/JPS6477953A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To disuse a bonding process, and to prevent the scattering of a joining material by separately connecting a chip housed in a die pad section and a second frame section by a printed wiring formed in a first frame section on the periphery of the die pad section. CONSTITUTION:A lead frame 9 is composed of lead frame A sections (nonconductors) 10 constituting first frame sections and lead frame B sections (conductors) 11 organizing second lead frame sections. Chips 15 are joined onto die pads 13 through joining materials 14 in the lead frame constructed in this manner. A process in which the chips 15 and inner leads 16 are bonded by metallic small-gage wires for connection as the next process is unnecessitated because printed wirings 12 arranged to the lead frame A sections 10 and electrodes 17 in the chips are conducted, and the die pads 13 function as the antirunning of the joining material because the shapes of the die pads 13 are constituted slightly of irregularities, thus preventing scattering, adhesion, etc., to the inner leads 16 of the joining material.
JP23560187A 1987-09-19 1987-09-19 Lead frame for semiconductor device Pending JPS6477953A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23560187A JPS6477953A (en) 1987-09-19 1987-09-19 Lead frame for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23560187A JPS6477953A (en) 1987-09-19 1987-09-19 Lead frame for semiconductor device

Publications (1)

Publication Number Publication Date
JPS6477953A true JPS6477953A (en) 1989-03-23

Family

ID=16988421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23560187A Pending JPS6477953A (en) 1987-09-19 1987-09-19 Lead frame for semiconductor device

Country Status (1)

Country Link
JP (1) JPS6477953A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5231304A (en) * 1989-07-27 1993-07-27 Grumman Aerospace Corporation Framed chip hybrid stacked layer assembly
CN106438257A (en) * 2016-12-13 2017-02-22 荆门市召铭液压科技有限公司 Double-fork inclined disc through shaft type axial plunger pump

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5231304A (en) * 1989-07-27 1993-07-27 Grumman Aerospace Corporation Framed chip hybrid stacked layer assembly
CN106438257A (en) * 2016-12-13 2017-02-22 荆门市召铭液压科技有限公司 Double-fork inclined disc through shaft type axial plunger pump

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