JPS6473613A - Furnace for heat-treating semiconductor substrate - Google Patents
Furnace for heat-treating semiconductor substrateInfo
- Publication number
- JPS6473613A JPS6473613A JP23083187A JP23083187A JPS6473613A JP S6473613 A JPS6473613 A JP S6473613A JP 23083187 A JP23083187 A JP 23083187A JP 23083187 A JP23083187 A JP 23083187A JP S6473613 A JPS6473613 A JP S6473613A
- Authority
- JP
- Japan
- Prior art keywords
- heat
- inner cylinder
- coolant
- furnace
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
- 239000002826 coolant Substances 0.000 abstract 7
- 238000001816 cooling Methods 0.000 abstract 3
- 230000005855 radiation Effects 0.000 abstract 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 1
- 235000012489 doughnuts Nutrition 0.000 abstract 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 1
- 239000010931 gold Substances 0.000 abstract 1
- 229910052737 gold Inorganic materials 0.000 abstract 1
Landscapes
- Chemical Vapour Deposition (AREA)
Abstract
PURPOSE:To make it possible to quickly control the temperature within a furnace by providing an inner cylinder inside the outer cylinder, forming the inner cylinder into a heat ray reflecting mirror, and providing a heat exchange type cooling means in the space between the inner cylinder and the outer cylinder, thereby absorbing radiation heat and convection heat. CONSTITUTION:An inner cylinder 5 is formed of a heat-resistant quartz glass, and on the inner surface thereof, an evaporated film of gold is deposited and formed as a heat ray reflecting mirror 6. A heat exchange type cooling means 10 is provided in a space 7 so as to surround the inner cylinder 5 and comprised of a plurality of coolant circulation pipes 11 and multiple annular heat absorbing fins 12a provided on the coolant circulation pipes 11. The coolant circulation pipes 11 are passing through the multiple heat absorbing fins 12a shaped in a doughnut so as to surround the inner cylinder 5 and so as to be parallel with the axis of the furnace, and both ends thereof are made to communicate with the coolant ports 16, 16 formed within a pair ot flanges 15, 15. A cooling pump 17 for compressively feeding a coolant is communicatively connected to the coolant port 16, the radiation heat and the conduction and convection heats from the inner cylinder 5 leaking into the space 7 are absorbed by the heat absorbing fins 12a or 12b and ejected through the coolant to the outside of the furnace.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62230831A JPH0722137B2 (en) | 1987-09-14 | 1987-09-14 | Heat treatment furnace for semiconductor substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62230831A JPH0722137B2 (en) | 1987-09-14 | 1987-09-14 | Heat treatment furnace for semiconductor substrates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6473613A true JPS6473613A (en) | 1989-03-17 |
| JPH0722137B2 JPH0722137B2 (en) | 1995-03-08 |
Family
ID=16913960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62230831A Expired - Fee Related JPH0722137B2 (en) | 1987-09-14 | 1987-09-14 | Heat treatment furnace for semiconductor substrates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0722137B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006284077A (en) * | 2005-03-31 | 2006-10-19 | Kumamoto Technology & Industry Foundation | Heat radiation reflecting furnace |
| DE102004046198B4 (en) * | 2003-09-24 | 2009-07-30 | Advics Co., Ltd., Kariya | Vehicle wheel speed calculation device and antilock brake control device provided therewith |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5481270U (en) * | 1977-11-21 | 1979-06-08 | ||
| JPS5649500U (en) * | 1979-09-25 | 1981-05-01 |
-
1987
- 1987-09-14 JP JP62230831A patent/JPH0722137B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5481270U (en) * | 1977-11-21 | 1979-06-08 | ||
| JPS5649500U (en) * | 1979-09-25 | 1981-05-01 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004046198B4 (en) * | 2003-09-24 | 2009-07-30 | Advics Co., Ltd., Kariya | Vehicle wheel speed calculation device and antilock brake control device provided therewith |
| JP2006284077A (en) * | 2005-03-31 | 2006-10-19 | Kumamoto Technology & Industry Foundation | Heat radiation reflecting furnace |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0722137B2 (en) | 1995-03-08 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |