JPS646087U - - Google Patents
Info
- Publication number
- JPS646087U JPS646087U JP1987100893U JP10089387U JPS646087U JP S646087 U JPS646087 U JP S646087U JP 1987100893 U JP1987100893 U JP 1987100893U JP 10089387 U JP10089387 U JP 10089387U JP S646087 U JPS646087 U JP S646087U
- Authority
- JP
- Japan
- Prior art keywords
- power element
- case
- resin
- state contactor
- solid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005192 partition Methods 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第1図はこの考案の実施例であるソリツドステ
ートコンタクタの側面図、第2図は第1図の要部
拡大断面図、第3図は従来のソリツドステートコ
ンタクタの側面図、第4図は第3図の要部拡大断
面図である。
1……ケース、3……パワー素子(サイリスタ
素子)、5……絶縁樹脂、11……隔壁、11A
……流通孔。
Figure 1 is a side view of a solid-state contactor that is an embodiment of this invention, Figure 2 is an enlarged sectional view of the main part of Figure 1, Figure 3 is a side view of a conventional solid-state contactor, and Figure 4. is an enlarged sectional view of the main part of FIG. 3; 1... Case, 3... Power element (thyristor element), 5... Insulating resin, 11... Partition wall, 11A
...Flow hole.
Claims (1)
このパワー素子を樹脂を用いて絶縁封止し、前記
ケースに被せられるカバーの中に前記パワー素子
のそれぞれのゲートに接続される電子制御回路を
搭載したプリント基板などを内蔵するソリツドス
テートコンタクタにおいて、前記ケースの内部の
各パワー素子間に空気の流通孔を有しかつ熱伝導
の良い材料で構成された隔壁を設け、前記隔壁間
に樹脂を注入して前記パワー素子を絶縁封止した
ことを特徴とするソリツドステートコンタクタ。 Multiple power elements are stored inside the case,
In a solid-state contactor, this power element is insulated and sealed using resin, and a printed circuit board, etc., equipped with an electronic control circuit connected to each gate of the power element is built in a cover that is placed on the case. A partition wall having air circulation holes and made of a material with good thermal conductivity is provided between each power element inside the case, and a resin is injected between the partition walls to insulate and seal the power element. A solid state contactor featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987100893U JPS646087U (en) | 1987-06-30 | 1987-06-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1987100893U JPS646087U (en) | 1987-06-30 | 1987-06-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS646087U true JPS646087U (en) | 1989-01-13 |
Family
ID=31329384
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1987100893U Pending JPS646087U (en) | 1987-06-30 | 1987-06-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS646087U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7161298B2 (en) | 2002-05-17 | 2007-01-09 | Matsushita Electric Industrial Co., Ltd. | Plasma display unit |
US7871542B2 (en) | 2001-10-30 | 2011-01-18 | Hitachi, Ltd. | Plasma display device, luminescent device and image and information display system using the same |
-
1987
- 1987-06-30 JP JP1987100893U patent/JPS646087U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7871542B2 (en) | 2001-10-30 | 2011-01-18 | Hitachi, Ltd. | Plasma display device, luminescent device and image and information display system using the same |
US7161298B2 (en) | 2002-05-17 | 2007-01-09 | Matsushita Electric Industrial Co., Ltd. | Plasma display unit |
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