[go: up one dir, main page]

JPS6420740U - - Google Patents

Info

Publication number
JPS6420740U
JPS6420740U JP1987115961U JP11596187U JPS6420740U JP S6420740 U JPS6420740 U JP S6420740U JP 1987115961 U JP1987115961 U JP 1987115961U JP 11596187 U JP11596187 U JP 11596187U JP S6420740 U JPS6420740 U JP S6420740U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation case
circuit board
power semiconductor
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987115961U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987115961U priority Critical patent/JPS6420740U/ja
Publication of JPS6420740U publication Critical patent/JPS6420740U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る電力半導体装置の一実施
例、また第２図は従来例を示し、夫々ａは斜視図
、ｂは断面図、ｃは上面図である。 ２……回路基板、３……半導体チツプ、４……
入出力端子、５……注型樹脂、６……放熱ケース
。 FIG. 1 shows an embodiment of a power semiconductor device according to the present invention, and FIG. 2 shows a conventional example, in which a is a perspective view, b is a sectional view, and c is a top view. 2... Circuit board, 3... Semiconductor chip, 4...
Input/output terminal, 5...casting resin, 6...heat dissipation case.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 高熱伝導性の放熱ケースと、半導体チツプ及び
入出力端子を装着した回路基板とを備え、該基板
が前記放熱ケース内に挿入され注型樹脂で封止さ
れてなる電力半導体装置において、前記放熱ケー
スの内面に複数の凹凸を設けたことを特徴とする
電力半導体装置。 A power semiconductor device comprising a highly thermally conductive heat dissipation case and a circuit board mounted with a semiconductor chip and an input/output terminal, the circuit board being inserted into the heat dissipation case and sealed with a casting resin, wherein the heat dissipation case A power semiconductor device characterized in that a plurality of unevennesses are provided on an inner surface of the device.
JP1987115961U 1987-07-29 1987-07-29 Pending JPS6420740U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987115961U JPS6420740U (en) 1987-07-29 1987-07-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987115961U JPS6420740U (en) 1987-07-29 1987-07-29

Publications (1)

Publication Number Publication Date
JPS6420740U true JPS6420740U (en) 1989-02-01

Family

ID=31358082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987115961U Pending JPS6420740U (en) 1987-07-29 1987-07-29

Country Status (1)

Country Link
JP (1) JPS6420740U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02131350U (en) * 1989-04-05 1990-10-31

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02131350U (en) * 1989-04-05 1990-10-31

Similar Documents

Publication Publication Date Title
JPS6420740U (en)
JPH0170349U (en)
JPH0268451U (en)
JPH0425289U (en)
JPS6439649U (en)
JPH0339850U (en)
JPH0334292U (en)
JPS6228444U (en)
JPS6219861U (en)
JPS61129397U (en)
JPS63136489U (en)
JPH0330440U (en)
JPS63100840U (en)
JPS6192067U (en)
JPS61111160U (en)
JPS59117165U (en) Electric circuit heat dissipation structure
JPH01169037U (en)
JPS6355548U (en)
JPS6420739U (en)
JPS6169847U (en)
JPS63164295U (en)
JPH0276844U (en)
JPS61168640U (en)
JPS60113642U (en) semiconductor equipment
JPS5967943U (en) Cooling structure for semiconductor devices