JPS6452246U - - Google Patents
Info
- Publication number
- JPS6452246U JPS6452246U JP14906487U JP14906487U JPS6452246U JP S6452246 U JPS6452246 U JP S6452246U JP 14906487 U JP14906487 U JP 14906487U JP 14906487 U JP14906487 U JP 14906487U JP S6452246 U JPS6452246 U JP S6452246U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- heat sink
- copper foil
- twisted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図及び第２図は本考案の実施例を示すプリ
ント基板のパターン側の図、第３図は放熱板本体
の正面図、第４図及び第５図は従来例を示すプリ
ント基板のパターン側の図である。
１……放熱板本体、１ａ……係止脚、２……プ
リント基板、２ａ……長孔、２ｂ，２ｃ……銅箔
部、２ｄ……半田非付着部。
Figures 1 and 2 are views of the pattern side of a printed circuit board showing an embodiment of the present invention, Figure 3 is a front view of the heat sink body, and Figures 4 and 5 are patterns of a printed circuit board showing a conventional example. This is a side view. DESCRIPTION OF SYMBOLS 1... Heat sink main body, 1a... Locking leg, 2... Printed circuit board, 2a... Long hole, 2b, 2c... Copper foil part, 2d... Solder non-adhesion part.
Claims (1)
ント基板に穿設された長孔に挿通されて該係止脚
が捻ねられた状態で前記プリント基板の銅箔部に
半田付けされてなる放熱板の取付装置において、
前記銅箔部が捻ねられた状態の係止脚と長手方向
に平行な向きに形成され、更にプリント基板の前
記長孔の周縁には半田の非付着部が形成されたこ
とを特徴とする放熱板の取付装置。 T-shaped locking legs provided on the heat sink body are inserted into elongated holes drilled in the printed circuit board, and the locking legs are twisted and soldered to the copper foil portion of the printed circuit board. In the heat sink mounting device,
The copper foil portion is formed in a direction parallel to the longitudinal direction of the twisted locking leg, and further, a non-solder-adhesive portion is formed at the periphery of the elongated hole of the printed circuit board. Heat sink mounting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14906487U JPS6452246U (en) | 1987-09-28 | 1987-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14906487U JPS6452246U (en) | 1987-09-28 | 1987-09-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6452246U true JPS6452246U (en) | 1989-03-31 |
Family
ID=31420952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14906487U Pending JPS6452246U (en) | 1987-09-28 | 1987-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6452246U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007180369A (en) * | 2005-12-28 | 2007-07-12 | Sharp Corp | Heat sink and electronic equipment |
-
1987
- 1987-09-28 JP JP14906487U patent/JPS6452246U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007180369A (en) * | 2005-12-28 | 2007-07-12 | Sharp Corp | Heat sink and electronic equipment |