JPS644904B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for attaching an adhesive tape to the surface of a thin plate-shaped article having a circular or arbitrary shape that is easily breakable, such as a silicon wafer serving as a substrate for an integrated circuit.

FIG. 8 is a plan view of an adhesive film 2 pasted on a silicon wafer 1 as an example of an article to be pasted, and as shown in FIG. 9, the film 2 is pasted to the wafer 1 by the adhesive layer 3 on the lower surface . As shown in this figure, silicon wafers have the shape of a partially cut out perfect circle, but there are also triangular, quadrangular, and other polygonal shapes.

Conventionally, when applying an adhesive film to an object such as a silicon wafer, a wide adhesive tape is first applied to the object, and then a knife is applied to the outer periphery of the object to remove the adhesive tape. A method of cutting along the outer periphery is used.

In the case of this conventional method, if the object is a perfect circle, it is sufficient to move the cutter around the circumference concentric with the center of the object, so automation is limited, but as shown in Fig. Automation is difficult when there is a cutout or when the shape is a polygon such as a triangle or a square.

Furthermore, in the case of silicon wafers, the back surface may be polished after a film is attached, but this polishing involves water flow.

For this reason, if the edge of the film protrudes beyond the periphery of the wafer, the water flow will curl up the periphery of the film, interfering with polishing. Further, when the film is smaller than the wafer and the wafer is retracted from the periphery of the film, the wafer is lifted by the water flow, resulting in a problem that the thickness cannot be accurately determined by polishing.

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, an object of the present invention is to provide a pasting method that allows a film to be pasted such that the circumferential edge of the object to be pasted almost coincides with the circumferential edge of the film.

That is, in applying an adhesive tape to the surface of a thin plate-like object, the present invention uses a releasable strip to which an adhesive film formed into a predetermined shape is attached, and this strip is adhered by a guide member. Peeling the adhesive film from the strip by moving it while bending at a steep angle with the film on the outside;
This adhesive film is characterized by being adhesively bonded to the surface of the article to which it is attached by pressure.

Since the method of this invention is as described above, an adhesive film cut into an accurate shape is pasted at regular intervals on a strip made of a mount coated with a release agent, and this strip is attached to the article to be pasted. At the upper part, the adhesive film is peeled off from the strip by moving it while bending at a steep angle with the guide member, and while the adhesive film is affixed to the surface of the object to be affixed, the object to be affixed and the adhesive film are moved. After being pressed by a take-up roller and the film is peeled off, the strip is moved in the opposite direction so that the adhesive film is automatically affixed to the object to be affixed.

Further, the strip is moved while being bent at a steep angle by the guide member, and while being peeled off, it is adsorbed by a vacuum suction pad, and the adsorbed adhesive film is pressed and bonded together with the vacuum suction pad to the surface of the article to be pasted. Also, the adhesive film is automatically affixed to the object to be affixed.

An embodiment of the method of the present invention will be described below with reference to the accompanying drawings.

In FIG. 1, reference numeral 11 denotes a band-shaped body made of a mount coated with a release agent on the top surface, and adhesive films 12 are stuck on the top surface at regular intervals. Also, band-shaped body 1
There is also one in which holes for positioning are punched.

The adhesive film 12 has an adhesive layer provided on one side in a previous step and is cut into a precise shape, and is pasted onto the strip 11 using the adhesive layer.
In addition, by sealing, only the necessary parts are left from the continuous body of the strip 11 and the adhesive film 12,
The adhesive film 12 may be provided on the strip 11 by removing unnecessary portions or the like.

FIGS. 2 and 3 show an example of an apparatus for carrying out the method of this invention. Reference numeral 15 denotes a machine base, and a magazine 17 in which a large number of articles 16 to be pasted, such as silicon wafers, are stacked at regular intervals is provided at the rear of the machine base.

Reference numeral 19 denotes a take-out means 20 having an endless conveyor belt 18, which is a drive pulley for the belt 18, and is driven by a motor (not shown). Reference numeral 21 denotes a magazine pedestal, which is lowered at a constant pitch by a suitable elevating mechanism 22 to place the next article 16 on the belt 18. 25 is a machine box installed on the side of the machine base 15, and a pair of winding shafts 26, 27 are mounted on the side of the machine box.
will be established.

The belt-like body 11 having the adhesive film 12 is wound around the winding shaft 26, and the winding shaft 27 winds up the belt-like body 11 after the film 12 has been peeled off.

Reference numeral 28 denotes a guide roller provided in the machine box 25, and a guide member 29 is provided below the guide roller, and the strip 11 pulled out from the winding shaft 26 passes through the guide roller 28 and is turned at a steep angle by the knife edge-shaped tip 30 of the guide member 29. It is configured so that it is bent, passed between a pair of take-up rollers 31, and then wound up by a winding shaft 27.

Although not shown in the drawings, if the article 16 has a notch 14 for determining the direction, a positioning means consisting of a plurality of vertical rotating rods is provided in front of the magazine, and this positioning means allows the notch 14 to be rotated forward, etc. Align it in a certain direction and correct its position.

Reference numeral 32 denotes a vacuum suction stand below the guide member 29, which is a hollow body having numerous suction holes on its upper surface, surrounded by a frame 50 with an open top, and communicated with a vacuum suction device via a valve.

In addition, a stopper 33 that is moved up and down by an air cylinder, an electromagnet, etc. is provided in front of the suction table 32, and when the stopper 33 is raised, the belt 18 is driven to supply one article 16 onto the suction table 32. The belt 18 is stopped under the condition that the notch 14 of the article 16 hits the stopper 33, vacuum suction of the suction table 32 is started, and the article 16 is fixed on the table 32. Alternatively, the belt 18 may be made longer and positioned in front of the stopper, and the suction table 32 may be omitted.

On the other hand, by driving the winding shaft 27 and the take-up roller 31 to pull the strip 11, the film 12 is peeled off from the strip 11 bent at a steep angle, the notch 13 hits the stopper 33, and come into contact with.

Under this condition, the stopper 33 is lowered and the vacuum suction is stopped. Since the strip 11 is continuously pulled, the film 12 moves forward together with the article 16, and when the leading end enters between the upper and lower take-up rollers 35, the article 16 and the film 12 move forward together with the article 16.
5, the film 12 is accurately pasted onto the article 16, and transferred to the belt conveyor 36.
It is sent into the magazine 37 through the process.

This magazine 37 is also almost similar to the magazine 17, and is placed on a pedestal 39 that is raised and lowered by an appropriate elevating mechanism 38, and each time an article 16 with a film 12 pasted thereon is inserted into the magazine 37, The platform 39 is raised one pitch.

FIGS. 6 and 7 show other embodiments. In this embodiment as well, the strip 11 is bent at a steep angle at the tip of the guide member 29 to form the adhesive film 1.
In this example, a vacuum pad 40 is also used. This pad 40 is connected to the frame 50.
It is surrounded by a frame 51 with an open bottom corresponding to .

The pad 40 is raised and lowered by a lifting mechanism 42 such as an air cylinder or an electromagnet attached to the lower side of the moving table 41, and the moving table 41 is also moved back and forth along a guide rail 43 by an air cylinder or a feed screw.

The pad 40 is hollow and has a number of suction holes on its lower surface, and communicates with a vacuum suction device via a valve.

In this example, the strip 11 on the guide member 29
The film 12 is adsorbed to the lower surface of the pad 40 that has descended onto the film 12 attached to the film 12, and as the strip 11 moves, the moving stage 41 moves in the direction of the arrow, and the film 12 moves while being adsorbed to the pad 40. However, the strip 11 is bent at a sharp angle at the tip of the guide member 29 and peeled off from the film 12.
It passes between take-up rollers 31 and is wound onto a winding shaft 27 shown in FIG.

In this way, the film 1 peeled off from the strip 11
When the pad 40 that has absorbed 2 comes onto the suction table 32, the movable table 41 temporarily stops. On the other hand, since the article to be pasted 16 sent by the endless conveyor belt 18 is placed on the suction stage 32 and fixed in a fixed position by vacuum suction, the pad 40 When the pad 40 descends as shown by the chain line in FIG. 6, the film 12 on the lower surface of the pad 40 is adhered onto the article 16 by the adhesive layer. At this time, if the inside surrounded by the upper and lower frames 50 and 51 is placed in a vacuum state, air bubbles, dust, etc. can be more reliably prevented from entering.

Next, the vacuum on the upper and lower frames 50 and 51 is released, the suction on the suction table 32 is released, and the film 12 is placed on the pad 40.
The pad 40 is slightly raised while the article 16 is being adsorbed through the conveyor 36, and the moving table 41 is moved to the top of the conveyor 36.The pad 40 is then lowered and the article 16 is placed on the conveyor 36, and then the pad 40 performs vacuum suction. After unraveling and leaving the article 16 on the conveyor 36, the pad 40 rises and returns to its original position together with the moving platform 41.

The parts other than those shown in FIGS. 6 and 7 are the same as the first embodiment. Further, in the illustrated example, the film is drawn small relative to the silicon wafer, but the actual dimensions should be such that the outer peripheries of the silicon wafer and the film almost match.

This invention uses an adhesive film that has been cut into an accurate shape in advance as described above and is pasted at regular intervals on a strip made of a mount coated with a release agent. This is because the film is bent and peeled off, and the peeled film is pasted by pressing it onto the top surface of the object to be pasted using its adhesive layer using an appropriate means such as upper and lower take-up rollers or vacuum suction. , the film can be reliably peeled from the strip.

Further, unlike the conventional method, there is no need to cut the film along the outer periphery of the article to be pasted after pasting the film. Therefore, if the cut shape of the film and the positioning of the film and the object to be adhered are accurately determined, the periphery of the film and the periphery of the object to be affixed will match exactly, and the above-mentioned problems will be avoided even during polishing. The effect is that it does not occur.

[Brief explanation of drawings]

Fig. 1 is a partially cutaway perspective view of a band-shaped body to which a film is attached using the attaching method of the present invention;
The figure is a partially longitudinal front view showing an example of an apparatus for carrying out the pasting method of the present invention, FIG. 3 is a plan view of the same, and FIGS. 4 and 5 are partially cutaway enlarged front views showing the functions of the main parts of the above. FIG. 6 is an enlarged front view showing the main parts of another embodiment, FIG. 7 is an enlarged vertical side view of a part of the same main parts, and FIG. 8 is a plan view showing an example of an article to which a film is attached. FIG. 9 is an enlarged longitudinal sectional view of a part of the same as above. 11...Strip-shaped body, 12...Adhesive film, 16
...Article to be affixed, 29...Guide member, 40...
Vacuum suction pad.

Claims (1)

[Scope of Claims] 1. When adhering an adhesive film to the surface of a thin plate-like object, a releasable strip to which an adhesive film formed into a predetermined shape is attached is used, and this strip is used as a guide member. A method for applying an adhesive film, characterized in that the adhesive film is peeled from the strip by moving the adhesive film while being bent at a steep angle with the adhesive film on the outside, and the adhesive film is pressed and adhered to the surface of the article to be applied. . 2. The adhesive film is peeled off from the strip by moving the releasable strip to which the adhesive film is attached while being bent at a steep angle by the guide member above the article to which it is attached, and the adhesive film is applied to the surface of the article to which it is attached. While pasting, the object to be pasted and the adhesive film are moved and pressed together by upper and lower take-up rollers.
2. The adhesive film pasting method according to claim 1, wherein the strip is moved in the opposite direction after the film is peeled off. 3. The releasable strip to which the adhesive film is attached is moved while being bent at a steep angle by the guide member, and is adsorbed by a vacuum suction pad while being peeled off, and the adsorbed adhesive film is applied to the surface of the article to be affixed together with the vacuum suction pad. 2. A method for applying an adhesive film according to claim 1, wherein the adhesive film is adhered by pressing the adhesive film onto the adhesive film.