JPS6447836A - High hardness and high speed sintered steel ingot having excellent hot workability - Google Patents
High hardness and high speed sintered steel ingot having excellent hot workabilityInfo
- Publication number
- JPS6447836A JPS6447836A JP20489687A JP20489687A JPS6447836A JP S6447836 A JPS6447836 A JP S6447836A JP 20489687 A JP20489687 A JP 20489687A JP 20489687 A JP20489687 A JP 20489687A JP S6447836 A JPS6447836 A JP S6447836A
- Authority
- JP
- Japan
- Prior art keywords
- steel
- steel ingot
- hot workability
- high speed
- inequalities
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Powder Metallurgy (AREA)
Abstract
PURPOSE:To particularly improve the end mill cuttability, hot workability and hardness of the titled steel ingot by regulating the compositional limiting value of C, N, W, Mo, V, Co, etc., the conditions in the process and the size of primary carbide. CONSTITUTION:The steel contg., by weight, 1.49-1.90% C, 3-5% Cr, 11.5-13.0% W, 3-5% Mo (where 19-21% W+2Mo), 4-5% V and 7-12% Co, furthermore contg. C and N amounts satisfying the inequalities and consisting of the balance iron with inevitable impurities is used. In the inequalities, Ceq=0.19+0.017 (W+2Mo)+0.22V is furthermore regulated. At the time of forming said steel into a high speed sintered steel ingot by powder metallurgy, the steel is formed into quench solidified steel powder by gas atomizing with N2, etc., and is subjected to compression molding by a hot isostatic pressing method to produce the steel ingot (sintered products) having true density. In this case, the average size of primary carbide in the steel ingot must be regulated to <=3mum. Said steel ingot has excellent hot workability, etc., and is suitable for the production of tools by hot rolling, forging, etc., having a thin diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20489687A JPH0674486B2 (en) | 1987-08-18 | 1987-08-18 | High hardness sintered high speed steel ingot with excellent hot workability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20489687A JPH0674486B2 (en) | 1987-08-18 | 1987-08-18 | High hardness sintered high speed steel ingot with excellent hot workability |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6447836A true JPS6447836A (en) | 1989-02-22 |
| JPH0674486B2 JPH0674486B2 (en) | 1994-09-21 |
Family
ID=16498194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20489687A Expired - Fee Related JPH0674486B2 (en) | 1987-08-18 | 1987-08-18 | High hardness sintered high speed steel ingot with excellent hot workability |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0674486B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01119645A (en) * | 1987-10-30 | 1989-05-11 | Daido Steel Co Ltd | Powdery high-speed steel |
| JPH02175846A (en) * | 1988-12-27 | 1990-07-09 | Daido Steel Co Ltd | Powder high-speed tool steel |
| JPH02182867A (en) * | 1989-01-06 | 1990-07-17 | Daido Steel Co Ltd | Powdered tool steel |
| US5684328A (en) * | 1992-07-29 | 1997-11-04 | Samsung Electronics Co., Ltd. | Semiconductor chip package using improved tape mounting |
-
1987
- 1987-08-18 JP JP20489687A patent/JPH0674486B2/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01119645A (en) * | 1987-10-30 | 1989-05-11 | Daido Steel Co Ltd | Powdery high-speed steel |
| JPH02175846A (en) * | 1988-12-27 | 1990-07-09 | Daido Steel Co Ltd | Powder high-speed tool steel |
| JPH02182867A (en) * | 1989-01-06 | 1990-07-17 | Daido Steel Co Ltd | Powdered tool steel |
| US5684328A (en) * | 1992-07-29 | 1997-11-04 | Samsung Electronics Co., Ltd. | Semiconductor chip package using improved tape mounting |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0674486B2 (en) | 1994-09-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |