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JPS6439100A - Packaging method of semiconductor integrated circuit - Google Patents

Packaging method of semiconductor integrated circuit

Info

Publication number
JPS6439100A
JPS6439100A JP19550687A JP19550687A JPS6439100A JP S6439100 A JPS6439100 A JP S6439100A JP 19550687 A JP19550687 A JP 19550687A JP 19550687 A JP19550687 A JP 19550687A JP S6439100 A JPS6439100 A JP S6439100A
Authority
JP
Japan
Prior art keywords
noises
integrated circuit
gnd
electromagnetic
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19550687A
Other languages
Japanese (ja)
Inventor
Sumio Mizobe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP19550687A priority Critical patent/JPS6439100A/en
Publication of JPS6439100A publication Critical patent/JPS6439100A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE:To prevent electromagnetic trouble for other semiconductor circuits and electronic equipment, by shielding the package itself of an integrated circuit, which is the source of electromagnetic noises, and shielding the electromagnetic noises. CONSTITUTION:The entire outer surface of a DIP package is covered with a conductor 72 of aluminum, copper and the like, having rolling property. The conductor is connected to GND through a lead wire. The lead wire 74 is made as short as possible. A grounding (GND) electrode 75 is a 'stabiIized GND' for noises. Therefore, electromagnetic noises, which are generated in an integrated circuit, can be caught with the conductor 72, which covers the outer surface of the package. The noises can be made to flow to the GND electrode 75 through the lead wire 74 and removed. Thus electromagnetic trouble affecting other integrated circuits and electronic equipment can be prevented.
JP19550687A 1987-08-05 1987-08-05 Packaging method of semiconductor integrated circuit Pending JPS6439100A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19550687A JPS6439100A (en) 1987-08-05 1987-08-05 Packaging method of semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19550687A JPS6439100A (en) 1987-08-05 1987-08-05 Packaging method of semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPS6439100A true JPS6439100A (en) 1989-02-09

Family

ID=16342217

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19550687A Pending JPS6439100A (en) 1987-08-05 1987-08-05 Packaging method of semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPS6439100A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0536868A (en) * 1991-07-29 1993-02-12 Mitsubishi Electric Corp Thin type semiconductor device
US5537342A (en) * 1990-08-28 1996-07-16 Lsi Logic Corporation Encapsulation of electronic components
US5663872A (en) * 1992-05-14 1997-09-02 Lsi Logic Corporation Encapsulation of electronic components

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5537342A (en) * 1990-08-28 1996-07-16 Lsi Logic Corporation Encapsulation of electronic components
JPH0536868A (en) * 1991-07-29 1993-02-12 Mitsubishi Electric Corp Thin type semiconductor device
US5663872A (en) * 1992-05-14 1997-09-02 Lsi Logic Corporation Encapsulation of electronic components

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