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JPS6439043A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS6439043A
JPS6439043A JP19585687A JP19585687A JPS6439043A JP S6439043 A JPS6439043 A JP S6439043A JP 19585687 A JP19585687 A JP 19585687A JP 19585687 A JP19585687 A JP 19585687A JP S6439043 A JPS6439043 A JP S6439043A
Authority
JP
Japan
Prior art keywords
bump
conductor layer
diameter
soldering member
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19585687A
Other languages
English (en)
Other versions
JPH0793306B2 (ja
Inventor
Yusuke Watanabe
Hachirou Shigeta
Kazuo Tanaka
Satoshi Rikui
Kichiji Abe
Keiji Mayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP62195856A priority Critical patent/JPH0793306B2/ja
Publication of JPS6439043A publication Critical patent/JPS6439043A/ja
Publication of JPH0793306B2 publication Critical patent/JPH0793306B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP62195856A 1987-08-05 1987-08-05 半導体集積回路装置 Expired - Lifetime JPH0793306B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62195856A JPH0793306B2 (ja) 1987-08-05 1987-08-05 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62195856A JPH0793306B2 (ja) 1987-08-05 1987-08-05 半導体集積回路装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP8257989A Division JP2795270B2 (ja) 1996-09-30 1996-09-30 半導体集積回路装置

Publications (2)

Publication Number Publication Date
JPS6439043A true JPS6439043A (en) 1989-02-09
JPH0793306B2 JPH0793306B2 (ja) 1995-10-09

Family

ID=16348135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62195856A Expired - Lifetime JPH0793306B2 (ja) 1987-08-05 1987-08-05 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JPH0793306B2 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0363929U (ja) * 1989-10-23 1991-06-21
US6103551A (en) * 1996-03-06 2000-08-15 Matsushita Electric Industrial Co., Ltd. Semiconductor unit and method for manufacturing the same
US6452280B1 (en) 1996-03-06 2002-09-17 Matsushita Electric Industrial Co., Ltd. Flip chip semiconductor apparatus with projecting electrodes and method for producing same
US8304290B2 (en) 2009-12-18 2012-11-06 International Business Machines Corporation Overcoming laminate warpage and misalignment in flip-chip packages

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57207362A (en) * 1981-06-16 1982-12-20 Mitsubishi Electric Corp Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57207362A (en) * 1981-06-16 1982-12-20 Mitsubishi Electric Corp Semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0363929U (ja) * 1989-10-23 1991-06-21
US6103551A (en) * 1996-03-06 2000-08-15 Matsushita Electric Industrial Co., Ltd. Semiconductor unit and method for manufacturing the same
US6452280B1 (en) 1996-03-06 2002-09-17 Matsushita Electric Industrial Co., Ltd. Flip chip semiconductor apparatus with projecting electrodes and method for producing same
US8304290B2 (en) 2009-12-18 2012-11-06 International Business Machines Corporation Overcoming laminate warpage and misalignment in flip-chip packages

Also Published As

Publication number Publication date
JPH0793306B2 (ja) 1995-10-09

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term