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JPS6424710A - Manufacture of mold instrument - Google Patents

Manufacture of mold instrument

Info

Publication number
JPS6424710A
JPS6424710A JP18003987A JP18003987A JPS6424710A JP S6424710 A JPS6424710 A JP S6424710A JP 18003987 A JP18003987 A JP 18003987A JP 18003987 A JP18003987 A JP 18003987A JP S6424710 A JPS6424710 A JP S6424710A
Authority
JP
Japan
Prior art keywords
mold
resin
thermosetting resin
feeding port
vacuum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18003987A
Other languages
Japanese (ja)
Inventor
Yoshihiro Ito
Toru Ochiai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP18003987A priority Critical patent/JPS6424710A/en
Publication of JPS6424710A publication Critical patent/JPS6424710A/en
Pending legal-status Critical Current

Links

Landscapes

  • Insulating Of Coils (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To improve the insulating characteristics of mold instruments by a method in which thermosetting resin is poured under vacuum from the resin feeding port provided on a mold, and then the thermosetting resin is cured under heating by keeping the condition where the inside of the mold is pressurized through the pipe fitted to the feeding port. CONSTITUTION:Molds 10 accommodating coils are received in a vacuum tank 8. After the vacuum condition in said tank has been obtained, the thermosetting resin such as epoxyresin, etc., is poured into the molds 10. Then each mold is taken out from the vacuum tank 8 and is received in a heating furnace 17. The pipe 20 connected to the pressure source 19 such as an air compressor, etc., through a valve 18, is connected to each mold 10 in the heating furnace 17. The pressurized air (about 1.5 atmospheric pressure) is fed into each mold 10 from the pressure source 19 by operating the valve 18, and in this state, the thermosetting resin is cured under heating. By such method, the thermal curing treatment of the resin may be achieved by pressurizing the inside of the mold 10. Since the pressurizing of the inside of the mold is carried out through a resin feeding port, the insulating defects such as voids, etc., do not occur in a resin insulating layer, and its insulating characteristics is improved.
JP18003987A 1987-07-21 1987-07-21 Manufacture of mold instrument Pending JPS6424710A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18003987A JPS6424710A (en) 1987-07-21 1987-07-21 Manufacture of mold instrument

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18003987A JPS6424710A (en) 1987-07-21 1987-07-21 Manufacture of mold instrument

Publications (1)

Publication Number Publication Date
JPS6424710A true JPS6424710A (en) 1989-01-26

Family

ID=16076412

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18003987A Pending JPS6424710A (en) 1987-07-21 1987-07-21 Manufacture of mold instrument

Country Status (1)

Country Link
JP (1) JPS6424710A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007251184A (en) * 2007-04-16 2007-09-27 Toshiba Corp Insulating coil, resin curing device, and resin curing method
CN103144232A (en) * 2013-03-06 2013-06-12 林小平 Epoxy resin pressure gel forming machine
JP2016207742A (en) * 2015-04-17 2016-12-08 株式会社東芝 Manufacturing method of mold coil, manufacturing system of mold coil, and design method of mold coil

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007251184A (en) * 2007-04-16 2007-09-27 Toshiba Corp Insulating coil, resin curing device, and resin curing method
CN103144232A (en) * 2013-03-06 2013-06-12 林小平 Epoxy resin pressure gel forming machine
JP2016207742A (en) * 2015-04-17 2016-12-08 株式会社東芝 Manufacturing method of mold coil, manufacturing system of mold coil, and design method of mold coil

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