JPS6411403A - Plasma generation reacting device - Google Patents
Plasma generation reacting deviceInfo
- Publication number
- JPS6411403A JPS6411403A JP62166677A JP16667787A JPS6411403A JP S6411403 A JPS6411403 A JP S6411403A JP 62166677 A JP62166677 A JP 62166677A JP 16667787 A JP16667787 A JP 16667787A JP S6411403 A JPS6411403 A JP S6411403A
- Authority
- JP
- Japan
- Prior art keywords
- resonator
- applicator
- substrate
- input ports
- microwave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Plasma Technology (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
PURPOSE:To expand a plasma area formed in a resonator and to uniformly form a thin film on the surface of a substrate over a wide range by using a cavity resonator which has plural radio wave input ports by connected electrically to a radio wave system as an applicator. CONSTITUTION:A microwave oscillated by a single microwave oscillator 31 is passed through an isolator 32 and divided by a T-shaped branch pipe 33 into two, which are supplied to microwave input ports 34a and 34b of the applicator 34. Then a cylindrical resonator, for example, is used as the applicator 34. The resonator 60 forms the cavity resonator which has the microwave input ports 34a and 34b facing a cylindrical conductor 61 axially, quartz plates 63a and 63b as partition plates for holding a vacuum, a holding base 64 for the substrate 48, etc. Then the resonator 60 resonates in TE113 mode to form the plasma area covering the surface of the substrate 48. Thus, the cylindrical resonator 60 is used as the applicator to form a uniform film, crystal, etc., on the surface of the substrate 48 over a wide range, and plasma polymerization, plasma processing, etc., which are not affected by the attribute of a sample are performed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62166677A JP2552140B2 (en) | 1987-07-03 | 1987-07-03 | Plasma generation reactor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP62166677A JP2552140B2 (en) | 1987-07-03 | 1987-07-03 | Plasma generation reactor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6411403A true JPS6411403A (en) | 1989-01-17 |
JP2552140B2 JP2552140B2 (en) | 1996-11-06 |
Family
ID=15835676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP62166677A Expired - Lifetime JP2552140B2 (en) | 1987-07-03 | 1987-07-03 | Plasma generation reactor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2552140B2 (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5178683A (en) * | 1990-03-30 | 1993-01-12 | New Japan Radio Co., Ltd. | Microwave plasma cvd apparatus |
WO1996003019A1 (en) * | 1994-07-14 | 1996-02-01 | Sumitomo Metal Industries, Ltd. | Plasma processing device |
US5522343A (en) * | 1988-09-14 | 1996-06-04 | Fujitsu Limited | Thin film formation apparatus |
WO2004068917A1 (en) * | 2003-01-27 | 2004-08-12 | Tokyo Electron Limited | Plasma processor and plasma processing method |
JP2006286269A (en) * | 2005-03-31 | 2006-10-19 | Tokyo Electron Ltd | Plasma processing device |
JP2007200687A (en) * | 2006-01-26 | 2007-08-09 | Toppan Printing Co Ltd | Plasma treatment device having bifurcated waveguide |
CN101853768A (en) * | 2010-04-09 | 2010-10-06 | 长飞光纤光缆有限公司 | Cylindrical plasma resonant cavity |
CN114845455A (en) * | 2022-05-07 | 2022-08-02 | 季华实验室 | Microwave plasma chemical vapor deposition device and system |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57148797U (en) * | 1981-03-13 | 1982-09-18 | ||
JPS6187869A (en) * | 1984-10-05 | 1986-05-06 | Hitachi Ltd | sputtering device |
-
1987
- 1987-07-03 JP JP62166677A patent/JP2552140B2/en not_active Expired - Lifetime
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57148797U (en) * | 1981-03-13 | 1982-09-18 | ||
JPS6187869A (en) * | 1984-10-05 | 1986-05-06 | Hitachi Ltd | sputtering device |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5522343A (en) * | 1988-09-14 | 1996-06-04 | Fujitsu Limited | Thin film formation apparatus |
US5741364A (en) * | 1988-09-14 | 1998-04-21 | Fujitsu Limited | Thin film formation apparatus |
US5178683A (en) * | 1990-03-30 | 1993-01-12 | New Japan Radio Co., Ltd. | Microwave plasma cvd apparatus |
WO1996003019A1 (en) * | 1994-07-14 | 1996-02-01 | Sumitomo Metal Industries, Ltd. | Plasma processing device |
WO2004068917A1 (en) * | 2003-01-27 | 2004-08-12 | Tokyo Electron Limited | Plasma processor and plasma processing method |
JP2006286269A (en) * | 2005-03-31 | 2006-10-19 | Tokyo Electron Ltd | Plasma processing device |
JP2007200687A (en) * | 2006-01-26 | 2007-08-09 | Toppan Printing Co Ltd | Plasma treatment device having bifurcated waveguide |
CN101853768A (en) * | 2010-04-09 | 2010-10-06 | 长飞光纤光缆有限公司 | Cylindrical plasma resonant cavity |
WO2011124074A1 (en) * | 2010-04-09 | 2011-10-13 | 长飞光纤光缆有限公司 | Cylindrical plasma resonant cavity |
CN114845455A (en) * | 2022-05-07 | 2022-08-02 | 季华实验室 | Microwave plasma chemical vapor deposition device and system |
Also Published As
Publication number | Publication date |
---|---|
JP2552140B2 (en) | 1996-11-06 |
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