JPS6411396A - Curing furnace - Google Patents
Curing furnaceInfo
- Publication number
- JPS6411396A JPS6411396A JP62167304A JP16730487A JPS6411396A JP S6411396 A JPS6411396 A JP S6411396A JP 62167304 A JP62167304 A JP 62167304A JP 16730487 A JP16730487 A JP 16730487A JP S6411396 A JPS6411396 A JP S6411396A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- rear face
- air supply
- air
- cold air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 abstract 7
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000007599 discharging Methods 0.000 abstract 1
- 230000000630 rising effect Effects 0.000 abstract 1
- 238000011144 upstream manufacturing Methods 0.000 abstract 1
Landscapes
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To prevent temperature of electronic components on a printed substrate and its rear face from rising by externally discharging air after blown from a plurality of cold air supply passages for passing cold air and a supply passage to the rear face of the substrate and thermally exchanged. CONSTITUTION:A printed substrate 3 is transferred onto a conveyor 2 from the upstream of a curing furnace body 1, and moved toward the downstream side. Adhesive for bonding electronic components 8 on the upper face of the substrate 3 is cured and/or soldered by a heater 7. Simultaneously, the rear face of the substrate 3 can be cooled by a cooler 9. That is, the atmospheric air is introduced by an air supply fan 16 to be blown through an air supply tube 17 and cold air supply ducts 14 to the rear face of the substrate 3 so as not to be heated to higher than required. Then, the air is thermally exchanged with the substrate 3 and the components 8 to be raised at its temperature, and then exhausted by an exhaust fan 19 through exhaust ducts 15 and exhaust tubes 20 out of the body 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62167304A JP2740168B2 (en) | 1987-07-03 | 1987-07-03 | Curing oven |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62167304A JP2740168B2 (en) | 1987-07-03 | 1987-07-03 | Curing oven |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6411396A true JPS6411396A (en) | 1989-01-13 |
| JP2740168B2 JP2740168B2 (en) | 1998-04-15 |
Family
ID=15847268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62167304A Expired - Lifetime JP2740168B2 (en) | 1987-07-03 | 1987-07-03 | Curing oven |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2740168B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0664180A1 (en) * | 1994-01-21 | 1995-07-26 | SMT Maschinengesellschaft mbH | Method for producing a flow of gas in a soldering apparatus and device for carrying it out |
| JP2005001323A (en) * | 2003-06-13 | 2005-01-06 | Mitsubishi Rayon Eng Co Ltd | Heating chamber for belt machine, belt heating method and apparatus using the same |
| JP2006090271A (en) * | 2004-09-27 | 2006-04-06 | Aisin Seiki Co Ltd | Water pump |
| JP2017519664A (en) * | 2014-06-26 | 2017-07-20 | ベルンドルフ バント ゲゼルシャフト ミット ベシュレンクテル ハフツング | Device having at least one endless belt |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55115395A (en) * | 1979-02-28 | 1980-09-05 | Fujitsu Ltd | Method of fabricating printed board |
| JPS5954292A (en) * | 1982-09-21 | 1984-03-29 | 松下電器産業株式会社 | Method of producing printed circuit board and heater |
| JPS60254790A (en) * | 1984-05-31 | 1985-12-16 | 富士通株式会社 | How to install flat-lead electronic component package |
-
1987
- 1987-07-03 JP JP62167304A patent/JP2740168B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55115395A (en) * | 1979-02-28 | 1980-09-05 | Fujitsu Ltd | Method of fabricating printed board |
| JPS5954292A (en) * | 1982-09-21 | 1984-03-29 | 松下電器産業株式会社 | Method of producing printed circuit board and heater |
| JPS60254790A (en) * | 1984-05-31 | 1985-12-16 | 富士通株式会社 | How to install flat-lead electronic component package |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0664180A1 (en) * | 1994-01-21 | 1995-07-26 | SMT Maschinengesellschaft mbH | Method for producing a flow of gas in a soldering apparatus and device for carrying it out |
| JP2005001323A (en) * | 2003-06-13 | 2005-01-06 | Mitsubishi Rayon Eng Co Ltd | Heating chamber for belt machine, belt heating method and apparatus using the same |
| JP2006090271A (en) * | 2004-09-27 | 2006-04-06 | Aisin Seiki Co Ltd | Water pump |
| JP2017519664A (en) * | 2014-06-26 | 2017-07-20 | ベルンドルフ バント ゲゼルシャフト ミット ベシュレンクテル ハフツング | Device having at least one endless belt |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2740168B2 (en) | 1998-04-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080123 Year of fee payment: 10 |