JPS635601A - Plane antenna - Google Patents

Abstract

PURPOSE:To prevent the reduction in the antenna gain caused by a bent of a dielectric base or deterioration in the characteristic by leading part of an antenna support supporting a plane antenna main body at the outside of a case and forming a heat sink connected to a heat dissipation means. CONSTITUTION:The plane antenna main body 1 is a rectangular dielectric base where a microstrip line conductor being an antenna pattern is formed on the surface and a ground conductor is formed on the rear side. An antenna support 2 supporting each plane antenna main body 1 is made of a metal, the part is led out at the outside of the case 3 and the heat sink 4 connected to a heat dissipation means is formed by the lead section. Even if the plane antenna main body 1 is heated by the heat of the sun ray, the heat energy of the plane antenna main body 1 is led at the outside of the case 3 via each support chiping of the antenna support 2 and the heat sink 4, a proper heat dissipation means is connected to the heat sink 4 to suppress the temperature rise of the plane antenna main body 1.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to a planar antenna that receives microwaves transmitted from a broadcasting satellite.

[Background technology] Recently, satellite broadcasting using SHF band radio waves has been put into practical use using geostationary satellites near 36,000 KIII above the equator, and in Japan, right-handed circularly polarized waves are transmitted from broadcasting satellites. . In order to receive this circularly polarized wave, it is necessary to install the antenna toward the equator, that is, toward the southwest in Japan, but in this case, problems arise due to the antenna being heated by solar heat. In particular, planar antennas have recently come into use for reasons such as ease of installation, but since these planar antennas are housed inside a casing, the negative effects of solar heat are greater. That is, in the conventional planar antenna of this type, as shown in FIGS. 3 and 4, a plurality of planar antenna bodies 1 are mounted on an antenna support 2 equipped with an elevation angle variable means 2a, and the antenna support 2 is It was to be delivered screwed into a synthetic resin case 3. However, in such a conventional example, when the planar antenna main body 1 inside the case 3 is heated by solar heat, heat radiation is poor, and the temperature of the planar antenna main body 1 decreases.

The difference in thermal expansion coefficient between the dielectric substrate constituting the planar antenna body 1 and the conductor provided on the dielectric substrate causes the dielectric substrate to warp and reduce the antenna dein. There was a problem. In addition, when using a yJ dielectric substrate with a low softening temperature such as polyethylene, the characteristics of the dielectric itself deteriorate due to temperature rise.
There was a problem that the antenna dein was reduced.

[Objective of the Invention 1 The present invention has been made in view of the above-mentioned 5C1,
The purpose is to provide a planar antenna that can reduce the temperature rise in the main body of the planar antenna due to solar heat, and that can prevent a decrease in antenna gain due to warping of the dielectric substrate or deterioration of characteristics. be.

[Disclosure of the Invention] The planar antenna according to the present invention is a planar antenna similar to the conventional example in which a planar antenna main body 1 having a dielectric substrate on which an antenna pattern is formed and a two-ground conductor formed on the back side is housed in a case 2. The antenna is characterized in that a part of the antenna support 2 supporting the planar antenna main body 1 is guided out of the case 2 to form a heat radiating piece 4 connected to a heat radiating means, and the planar antenna uses solar heat. The temperature rise of the main body 1 can be reduced, and a decrease in antenna gain due to warping of the dielectric substrate or deterioration of characteristics can be prevented.

(Embodiment 1) Fig. 1 shows an embodiment of the present invention, in which a planar antenna main body 1 has a microstrip line conductor as an antenna pattern formed on the surface of a rectangular dielectric substrate, and A ground conductor is formed on the back surface, and in the embodiment, two planar antenna bodies 1 supported by an antenna support 2 such that the angle of elevation can be adjusted are housed in a case 3.

Here, the antenna support 2 that supports each planar antenna main body 1 is made of metal, and its negative part is led out to the outside of the case 3, and the heat dissipation piece 4 connected to the heat dissipation means is connected to the heat dissipation means at this guide part.
is formed. The heat dissipation piece 4 is made of a metal plate with good thermal conductivity, and its width is set to an appropriate value taking into consideration the heat dissipation property of 2V.

Now, even if the flat antenna main body 1 is heated by solar heat, the thermal energy of the flat antenna main body 1 is transferred to the case 3 via each support piece of the antenna support 2 and the heat dissipation piece 4 as shown by the arrow. The heat radiating piece 4 is connected to an appropriate heat radiating means (not shown) to suppress the temperature rise of the planar antenna body 1. Therefore, the dielectric substrate constituting the planar antenna body 1 may warp due to temperature rise.
There is no possibility of deterioration of the characteristics of the dielectric substrate, and a decrease in antenna gain is prevented.

(Example 2) FIG. 2 shows another example in which a heat dissipating piece 4a is formed by a case support connected to an antenna support 2. Energy is discharged to the outside via the heat sink 4a made up of the antenna support 2 and the case support, and the heat is radiated from the heat sink 4a through an antenna mounting portion (not shown).

[Effects of the Invention] As described above, the present invention provides a planar antenna in which a planar antenna body is housed in a case, which has a dielectric substrate with an antenna pattern formed on its surface and a ground conductor formed on the back side, which supports the planar antenna body. A part of the antenna support is led out of the case to form a heat radiating piece that is connected to the heat radiating means, and the thermal energy of the planar antenna body heated by solar heat is transferred through the antenna support and the heat radiating piece. Since it is discharged outside the case, it is less likely that the dielectric substrate that makes up the planar antenna body will warp or the characteristics of the dielectric substrate will deteriorate. This has the effect of preventing a decrease in antenna gain due to deterioration.

[Brief explanation of drawings]

FIG. 1 is a sectional view showing one embodiment of the present invention, FIG. 2 is a sectional view of another embodiment, IS3 is a sectional view of a conventional example, and FIG. 4 is a perspective view of the same essential parts. 1 is a flat antenna main body, 2 is an antenna support, 3 is a case, and 4 is a heat sink. Agent Patent Attorney Ishi 1) Ai Figure 7 1

Claims (2)

[Claims] (1) In a planar antenna in which a planar antenna body, which has a dielectric substrate with an antenna pattern formed on its surface and a ground conductor formed on the back side, is housed in a case, a part of the antenna support that supports the planar antenna body is removed from the case. 1. A planar antenna characterized by forming a heat radiating piece that is led out and connected to a heat radiating means. (2) The planar antenna according to claim 1, wherein the heat dissipation piece is formed by a case support connected to an antenna support.